Underfill material and method for manufacturing semiconductor device using the same

Patent metadata

Field	Value
Publication number	US-9691677-B2
Application number	US-201414423821-A
Country	US
Kind code	B2
Filing date	Sep 10, 2014
Priority date	Sep 11, 2013
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

An underfill material enabling voidless packaging and excellent solder bonding properties, and a method for manufacturing a semiconductor device using the same are provided. An underfill material, including an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide, the minimum melt viscosity being between 1000 Pa*s and 2000 Pa*s, and gradient of melt viscosity between 10° C. higher than the minimum melt viscosity attainment temperature and a temperature 10° C. higher being between 900 Pa*s/° C. and 3100 Pa*s/° C., is applied to a semiconductor chip having a solder-tipped electrode formed thereon, and the semiconductor chip is mounted onto a circuit substrate having a counter electrode opposing the solder-tipped electrode, and the semiconductor chip and the circuit substrate are thermocompressed under bonding conditions of raising the temperature from a first temperature to a second temperature at a predetermined rate.

First claim

The invention claimed is:

1. A method for manufacturing a semiconductor device comprising:
a mounting step of mounting a semiconductor chip onto an electronic component, the semiconductor chip having a solder-tipped electrode formed thereon and an underfill material applied to the surface of the solder-tipped electrode, and the electronic component having a counter electrode facing the solder-tipped electrode, and
a thermocompression bonding step of thermally compressing the semiconductor chip and the electronic component by increasing a temperature at a predetermined rate from a first temperature to a second temperature, wherein
the underfill material contains an epoxy resin, a curing accelerator, a (meth)acrylate resin and an organic peroxide, the minimum melt viscosity of the underfill material ranges from 1000 Pa*s to 2000 Pa*s, and the gradient of the melt viscosity from a temperature 10° C. higher than a minimum melt viscosity attainment temperature to a temperature 10° C. higher than the temperature ranges 900 Pa*s/° C. to 3100 Pa*s/° C.

2. The method for manufacturing a semiconductor device according to claim 1 , wherein the first temperature is approximately the same as the minimum melt viscosity attainment temperature.

3. The method for manufacturing a semiconductor device according to claim 1 , wherein
the first temperature ranges from 50° C. to 150° C., and
the rate of the temperature increase ranges from 50° C./sec to 150° C./sec.

4. The method for manufacturing a semiconductor device according to claim 3 , wherein
the underfill material contains an epoxy curing agent, and
a ratio of the total mass of the (meth)acrylate resin and the organic peroxide, and the total mass of the epoxy resin and the epoxy curing agent ranges from 7:3 to 4:6.

Assignees

• Dexerials Corp

Inventors

• Koyama Taichi

Classifications

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/07232

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title