Surface treated copper foil and laminate using the same
US-9504149-B2 · Nov 22, 2016 · US
Assembling printed circuits with other printed circuits {(H05K7/142 takes precedence)}
Assembling printed circuits with other printed circuits {(H05K7/142 takes precedence)} · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/36 |
| Official title | Assembling printed circuits with other printed circuits {(H05K7/142 takes precedence)} |
| Display label | Assembling printed circuits with other printed circuits {(H05K7/142 takes precedence)} |
| Total patents | 410 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 47 |
| 2016 | 37 |
| 2017 | 48 |
| 2018 | 37 |
| 2019 | 46 |
| 2020 | 36 |
| 2021 | 34 |
| 2022 | 27 |
| 2023 | 22 |
| 2024 | 36 |
| 2025 | 31 |
| 2026 | 9 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
System with stepped three dimensional profile and venting
US-2016295695-A1 · Oct 6, 2016 · US
Circuit board and method of manufacturing the same
US-2016192486-A1 · Jun 30, 2016 · US
Dust collector
US-2016151846-A1 · Jun 2, 2016 · US
Panel Carrier For A Liquid Crystal On Silicon Panel And Method For Electrically Interconnecting Same
US-2016139446-A1 · May 19, 2016 · US
Method for producing a circuit board consisting of a plurality of circuit board areas and circuit board
US-2016105953-A1 · Apr 14, 2016 · US
Implementing simultaneously connecting of multiple devices in a multi-tiered, multi-directional, enhanced tolerance system with mechanical support structures
US-2016073501-A1 · Mar 10, 2016 · US
Implementing simultaneously connecting of multiple devices in a multi-tiered, multi-directional, enhanced tolerance system with mechanical support structures
US-2016073560-A1 · Mar 10, 2016 · US
Blind Via Printed Circuit Board Fabrication Supporting Press Fit Connectors
US-2016050756-A1 · Feb 18, 2016 · US
Method of manufacturing flexible printed circuit board with component mounting section for mounting electronic component and flexible cable sections extending in different directions from the component mounting section
US-2016044797-A1 · Feb 11, 2016 · US
Printed circuit board connector for non-planar configurations
US-2016028173-A1 · Jan 28, 2016 · US
Method for manufacturing layered electronic devices
US-2016007462-A1 · Jan 7, 2016 · US
Techniques relating to phase-locked loop circuits
US-9231601-B1 · Jan 5, 2016 · US
Power supplies having multi-tap voltage attenuators and methods of power supply assembly
US-2015381066-A1 · Dec 31, 2015 · US
Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device
US-9226406-B2 · Dec 29, 2015 · US
Method for producing a circuit board consisting of a plurality of circuit board areas and circuit board
US-9226390-B2 · Dec 29, 2015 · US
Printed circuit board comprising blind press-fit vias
US-2015372403-A1 · Dec 24, 2015 · US
Modular printed circuit board
US-2015373847-A1 · Dec 24, 2015 · US
Semiconductor unit, method of manufacturing the same, and electronic apparatus
US-9219207-B2 · Dec 22, 2015 · US
Process for manufacturing a printed circuit board
US-2015366071-A1 · Dec 17, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/36?
- CPC H05K3/36 is the Cooperative Patent Classification code for “Assembling printed circuits with other printed circuits {(H05K7/142 takes precedence)}.”
- How many patents are filed under CPC H05K3/36 (Assembling printed circuits with other printed circuits {(H05K7/142 takes precedence)})?
- Our database includes 410 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/36 growing?
- Publication counts under this code: 36 in 2024 vs 31 in 2025 (latest complete years).