Substrate Processing Apparatus

US2016276206A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016276206-A1
Application numberUS-201615064856-A
CountryUS
Kind codeA1
Filing dateMar 9, 2016
Priority dateMar 19, 2015
Publication dateSep 22, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A substrate processing apparatus includes: a substrate holder which holds a plurality of substrates; a processing vessel including an inner tube and an outer tube disposed outside the inner tube; a gas supply part which supplies a process gas in parallel to target surfaces of the substrates; an exhaust part which exhausts the process gas from the processing vessel through a gas outlet; an exhaust port formed in the inner tube; and a rectifying plate installed in an outer wall of the inner tube or an inner wall of the outer tube between the exhaust port and the gas outlet in a circumferential direction of the processing vessel. The rectifying plate is installed to extend upward from a position below a lower end of the substrate holder to a location corresponding at least to a lower end of the exhaust port.

First claim

Opening claim text (preview).

What is claimed is: 1 . A substrate processing apparatus comprising: a substrate holder configured to hold a plurality of substrates in a shelf formation; a processing vessel including an inner tube configured to accommodate the plurality of substrates and the substrate holder, and an outer tube disposed outside the inner tube; a gas supply part configured to supply a process gas in parallel with respect to target surfaces of the plurality of substrates accommodated in the processing vessel; an exhaust part configured to exhaust the process gas from the processing vessel through a gas outlet; an exhaust port formed in a sidewall opposite to the gas supply part via the substrate holder in the inner tube; and a rectifying plate installed in an outer wall of the inner tube or an inner wall of the outer tube between the exhaust port and the gas outlet in a circumferential direction of the processing vessel, wherein the rectifying plate is installed to extend upward from a position below a lower end of the substrate holder to a location corresponding at least to a lower end of the exhaust port in a vertical direction of the processing vessel. 2 . The substrate processing apparatus of claim 1 , wherein the rectifying plate is installed to extend upward from a position below a lower end of the substrate holder to a position corresponding at least to a middle portion of the substrate holder. 3 . The substrate processing apparatus of claim 1 , wherein the exhaust port is a slit whose upper end is placed above an uppermost wafer among the wafers held by the substrate holder and whose lower end is placed below a lowermost wafer among the wafers held by the substrate holder. 4 . The substrate processing apparatus of claim 1 , wherein the exhaust port includes a plurality of openings which is arranged in the vertical direction of the processing vessel. 5 . The substrate processing apparatus of claim 1 , wherein the substrate holder includes: a ceiling plate; a bottom plate installed to face the ceiling plate; a column connecting between the ceiling plate and the bottom plate; an arm portion formed in the column and configured to hold the plurality of substrates; and disk-shaped members installed between the ceiling plate and the plurality of substrates and between the bottom plate and the plurality of substrates, each of the disk-shaped member having an outer diameter larger than that of each of the plurality of substrates. 6 . The substrate processing apparatus of claim 5 , wherein each of the disk-shaped members has a notch formed at a position corresponding to a position of the column such that the disk-shaped member is held by the arm portion. 7 . The substrate processing apparatus of claim 1 , wherein the rectifying plate is installed in the inner wall of the outer tube. 8 . The substrate processing apparatus of claim 1 , wherein a length of the rectifying plate when viewed from the top is 0.67 times or more in length from the inner wall of the outer tube to the outer wall of the inner tube. 9 . A substrate processing apparatus comprising: a substrate holder configured to hold a plurality of substrates in a shelf formation; a processing vessel including an inner tube configured to accommodate the plurality of substrates and the substrate holder, and an outer tube disposed outside the inner tube; a gas supply part configured to supply a process gas in parallel with respect to target surfaces of the plurality of substrates accommodated in the processing vessel; an exhaust part configured to exhaust the process gas from the processing vessel through a gas outlet; and an exhaust port formed in a sidewall opposite to the gas supply part via the substrate holder in the inner tube, wherein the substrate holder includes: a ceiling plate, a bottom plate installed to face the ceiling plate; a column connecting between the ceiling plate and the bottom plate; an arm portion installed in the column and configured to hold the plurality of substrates; and disk-shaped members installed between the ceiling plate and the plurality of substrates and between the bottom plate and the plurality of substrates, each of the disk-shaped member having an outer diameter larger than that of each of the plurality of substrates. 10 . The substrate processing apparatus of claim 9 , wherein the substrate holder further includes a disk-shaped member installed in a middle portion of the substrate holder in a vertical direction thereof and having an outer diameter larger than that of each of the plurality of substrates.

Assignees

Inventors

Classifications

  • characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

  • mainly by convection · CPC title

  • Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

  • Gas supply means · CPC title

  • Fixed means, e.g. wings, baffles · CPC title

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Frequently asked questions

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What does patent US2016276206A1 cover?
A substrate processing apparatus includes: a substrate holder which holds a plurality of substrates; a processing vessel including an inner tube and an outer tube disposed outside the inner tube; a gas supply part which supplies a process gas in parallel to target surfaces of the substrates; an exhaust part which exhausts the process gas from the processing vessel through a gas outlet; an exhau…
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/0434. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Sep 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).