High aspect ratio buried power rail metallization
US-12148699-B2 · Nov 19, 2024 · US
US2016247683A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016247683-A1 |
| Application number | US-201615047690-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 19, 2016 |
| Priority date | Feb 23, 2015 |
| Publication date | Aug 25, 2016 |
| Grant date | — |
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A catalyst adsorbed on a surface of a substrate is bound to the substrate without leaving residues within a recess of the substrate. A catalyst layer forming method includes forming a catalyst layer 22 by supplying a catalyst solution 32 onto a substrate 2 having a recess 2 a to adsorb the catalyst 22 A onto a surface of the substrate and onto an inner surface of the recess; rinsing the surface of the substrate 2 and an inside of the recess 2 a by supplying a rinse liquid; drying the surface of the substrate 2 and the inside of the recess 2 a . Further, by supplying a binder solution 34 containing a binder 22 B onto the substrate 2 , the catalyst 22 A on the surface of the substrate 2 is bound to the substrate 2 by the binder 22 B.
Opening claim text (preview).
We claim: 1 . A catalyst layer forming method of forming a catalyst layer on a substrate, comprising: preparing the substrate having a recess; forming a catalyst layer by supplying a catalyst solution containing a catalyst onto the substrate to adsorb the catalyst onto a surface of the substrate and onto an inner surface of the recess; rinsing the surface of the substrate and an inside of the recess by supplying a rinse liquid onto the substrate; drying the surface of the substrate and the inside of the recess; and binding the catalyst on the surface of the substrate to the surface of the substrate by supplying a binder solution containing a binder onto the substrate. 2 . A catalyst layer forming method of forming a catalyst layer on a substrate, comprising: preparing the substrate having a recess; forming a catalyst layer by supplying a catalyst solution containing a catalyst onto the substrate to adsorb the catalyst onto a surface of the substrate and onto an inner surface of the recess; rinsing the surface of the substrate and an inside of the recess by supplying a rinse liquid onto the substrate; and binding the catalyst on the surface of the substrate to the surface of the substrate by supplying a binder solution containing a binder onto the substrate in a state that the rinse liquid is filled within the recess. 3 . The catalyst layer forming method of claim 1 , wherein the substrate is dried after the binder solution is supplied onto the substrate. 4 . The catalyst layer forming method of claim 1 , wherein the substrate is baked after the binder solution is supplied onto the substrate. 5 . The catalyst layer forming method of claim 4 , wherein the binder solution containing the binder is supplied onto the substrate again after the substrate is baked. 6 . The catalyst layer forming method of claim 1 , wherein the binder solution contains polyvinylPyrrolidone (PVP) as the binder. 7 . The catalyst layer forming method of claim 1 , wherein the catalyst solution contains n-Pd or palladium chloride as the catalyst. 8 . The catalyst layer forming method of claim 1 , wherein the catalyst solution further contains a dispersant. 9 . The catalyst layer forming method of claim 8 , wherein the catalyst solution contains polyvinylPyrrolidone (PVP) as the dispersant. 10 . A catalyst layer forming system of forming a catalyst layer on a substrate, comprising: a substrate holding/rotating device configured to hold and rotate the substrate having a recess; a catalyst solution supply unit configured to supply a catalyst solution containing a catalyst onto the substrate to form the catalyst layer by adsorbing the catalyst onto a surface of the substrate and onto an inner surface of the recess; a rinse liquid supply unit configured to supply a rinse liquid to rinse the surface of the substrate and an inside of the recess; a substrate drying unit configured to dry the surface of the substrate and the inside of the recess; and a binder solution supply unit configured to supply a binder solution containing a binder onto the substrate to bind the catalyst on the surface of the substrate to the surface of the substrate. 11 . A catalyst layer forming system of forming a catalyst layer on a substrate, comprising: a substrate holding/rotating device configured to hold and rotate the substrate having a recess; a catalyst solution supply unit configured to supply a catalyst solution containing a catalyst onto the substrate to form the catalyst layer by adsorbing the catalyst onto a surface of the substrate and onto an inner surface of the recess; a rinse liquid supply unit configured to supply a rinse liquid to rinse the surface of the substrate and an inside of the recess; and a binder solution supply unit configured to supply a binder solution containing a binder onto the substrate to bind the catalyst on the surface of the substrate to the surface of the substrate. 12 . The catalyst layer forming system of claim 10 , wherein the substrate holding/rotating device serves as the substrate drying unit. 13 . The catalyst layer forming system of claim 10 , further comprising: a baking unit configured to bake the substrate after the binder solution is supplied onto the substrate. 14 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a catalyst layer forming system to perform a catalyst layer forming method, wherein the catalyst layer forming method comprises: preparing the substrate having a recess; forming a catalyst layer by supplying a catalyst solution containing a catalyst onto the substrate to absorb the catalyst onto a surface of the substrate and onto an inner surface of the recess; rinsing the surface of the substrate and an inside of the recess by supplying a rinse liquid onto the substrate; drying the surface of the substrate and the inside of the recess; and binding the catalyst on the surface of the substrate to the surface of the substrate by supplying a binder solution containing a binder onto the substrate. 15 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a catalyst layer forming system to perform a catalyst layer forming method, wherein the catalyst layer forming method comprises: preparing the substrate having a recess; forming a catalyst layer by supplying a catalyst solution containing a catalyst onto the substrate to absorb the catalyst onto a surface of the substrate and onto an inner surface of the recess; rinsing the surface of the substrate and an inside of the recess by supplying a rinse liquid onto the substrate; and binding the catalyst on the surface of the substrate to the surface of the substrate by supplying a binder solution containing a binder onto the substrate in a state that the rinse liquid is filled within the recess.
comprising use of blind vias during the manufacture · CPC title
characterised by the filling method or the material of the conductive fill · CPC title
using mainly spraying means, e.g. nozzles · CPC title
for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title
for electroplating · CPC title
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