Catalyst layer forming method, catalyst layer forming system and recording medium

US2016247683A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016247683-A1
Application numberUS-201615047690-A
CountryUS
Kind codeA1
Filing dateFeb 19, 2016
Priority dateFeb 23, 2015
Publication dateAug 25, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A catalyst adsorbed on a surface of a substrate is bound to the substrate without leaving residues within a recess of the substrate. A catalyst layer forming method includes forming a catalyst layer 22 by supplying a catalyst solution 32 onto a substrate 2 having a recess 2 a to adsorb the catalyst 22 A onto a surface of the substrate and onto an inner surface of the recess; rinsing the surface of the substrate 2 and an inside of the recess 2 a by supplying a rinse liquid; drying the surface of the substrate 2 and the inside of the recess 2 a . Further, by supplying a binder solution 34 containing a binder 22 B onto the substrate 2 , the catalyst 22 A on the surface of the substrate 2 is bound to the substrate 2 by the binder 22 B.

First claim

Opening claim text (preview).

We claim: 1 . A catalyst layer forming method of forming a catalyst layer on a substrate, comprising: preparing the substrate having a recess; forming a catalyst layer by supplying a catalyst solution containing a catalyst onto the substrate to adsorb the catalyst onto a surface of the substrate and onto an inner surface of the recess; rinsing the surface of the substrate and an inside of the recess by supplying a rinse liquid onto the substrate; drying the surface of the substrate and the inside of the recess; and binding the catalyst on the surface of the substrate to the surface of the substrate by supplying a binder solution containing a binder onto the substrate. 2 . A catalyst layer forming method of forming a catalyst layer on a substrate, comprising: preparing the substrate having a recess; forming a catalyst layer by supplying a catalyst solution containing a catalyst onto the substrate to adsorb the catalyst onto a surface of the substrate and onto an inner surface of the recess; rinsing the surface of the substrate and an inside of the recess by supplying a rinse liquid onto the substrate; and binding the catalyst on the surface of the substrate to the surface of the substrate by supplying a binder solution containing a binder onto the substrate in a state that the rinse liquid is filled within the recess. 3 . The catalyst layer forming method of claim 1 , wherein the substrate is dried after the binder solution is supplied onto the substrate. 4 . The catalyst layer forming method of claim 1 , wherein the substrate is baked after the binder solution is supplied onto the substrate. 5 . The catalyst layer forming method of claim 4 , wherein the binder solution containing the binder is supplied onto the substrate again after the substrate is baked. 6 . The catalyst layer forming method of claim 1 , wherein the binder solution contains polyvinylPyrrolidone (PVP) as the binder. 7 . The catalyst layer forming method of claim 1 , wherein the catalyst solution contains n-Pd or palladium chloride as the catalyst. 8 . The catalyst layer forming method of claim 1 , wherein the catalyst solution further contains a dispersant. 9 . The catalyst layer forming method of claim 8 , wherein the catalyst solution contains polyvinylPyrrolidone (PVP) as the dispersant. 10 . A catalyst layer forming system of forming a catalyst layer on a substrate, comprising: a substrate holding/rotating device configured to hold and rotate the substrate having a recess; a catalyst solution supply unit configured to supply a catalyst solution containing a catalyst onto the substrate to form the catalyst layer by adsorbing the catalyst onto a surface of the substrate and onto an inner surface of the recess; a rinse liquid supply unit configured to supply a rinse liquid to rinse the surface of the substrate and an inside of the recess; a substrate drying unit configured to dry the surface of the substrate and the inside of the recess; and a binder solution supply unit configured to supply a binder solution containing a binder onto the substrate to bind the catalyst on the surface of the substrate to the surface of the substrate. 11 . A catalyst layer forming system of forming a catalyst layer on a substrate, comprising: a substrate holding/rotating device configured to hold and rotate the substrate having a recess; a catalyst solution supply unit configured to supply a catalyst solution containing a catalyst onto the substrate to form the catalyst layer by adsorbing the catalyst onto a surface of the substrate and onto an inner surface of the recess; a rinse liquid supply unit configured to supply a rinse liquid to rinse the surface of the substrate and an inside of the recess; and a binder solution supply unit configured to supply a binder solution containing a binder onto the substrate to bind the catalyst on the surface of the substrate to the surface of the substrate. 12 . The catalyst layer forming system of claim 10 , wherein the substrate holding/rotating device serves as the substrate drying unit. 13 . The catalyst layer forming system of claim 10 , further comprising: a baking unit configured to bake the substrate after the binder solution is supplied onto the substrate. 14 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a catalyst layer forming system to perform a catalyst layer forming method, wherein the catalyst layer forming method comprises: preparing the substrate having a recess; forming a catalyst layer by supplying a catalyst solution containing a catalyst onto the substrate to absorb the catalyst onto a surface of the substrate and onto an inner surface of the recess; rinsing the surface of the substrate and an inside of the recess by supplying a rinse liquid onto the substrate; drying the surface of the substrate and the inside of the recess; and binding the catalyst on the surface of the substrate to the surface of the substrate by supplying a binder solution containing a binder onto the substrate. 15 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a catalyst layer forming system to perform a catalyst layer forming method, wherein the catalyst layer forming method comprises: preparing the substrate having a recess; forming a catalyst layer by supplying a catalyst solution containing a catalyst onto the substrate to absorb the catalyst onto a surface of the substrate and onto an inner surface of the recess; rinsing the surface of the substrate and an inside of the recess by supplying a rinse liquid onto the substrate; and binding the catalyst on the surface of the substrate to the surface of the substrate by supplying a binder solution containing a binder onto the substrate in a state that the rinse liquid is filled within the recess.

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Classifications

  • comprising use of blind vias during the manufacture · CPC title

  • characterised by the filling method or the material of the conductive fill · CPC title

  • using mainly spraying means, e.g. nozzles · CPC title

  • for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

  • for electroplating · CPC title

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What does patent US2016247683A1 cover?
A catalyst adsorbed on a surface of a substrate is bound to the substrate without leaving residues within a recess of the substrate. A catalyst layer forming method includes forming a catalyst layer 22 by supplying a catalyst solution 32 onto a substrate 2 having a recess 2 a to adsorb the catalyst 22 A onto a surface of the substrate and onto an inner surface of the recess; rinsing …
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification H10W20/044. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Aug 25 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).