Silicone-modified epoxy resin and composition and cured article thereof

US2016237202A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016237202-A1
Application numberUS-201415023263-A
CountryUS
Kind codeA1
Filing dateSep 19, 2014
Priority dateSep 20, 2013
Publication dateAug 18, 2016
Grant date

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

Problem to be Solved The purpose of the invention, in view of the above circumstances, is to provide a silicone-modified epoxy resin composition that offers a cured article excellent in low gas permeability and strength, and an epoxy resin cured article obtained by curing the composition. Solution An epoxy resin represented by the following formula (1) wherein R 1 represents an alkylene group having 2 to 6 carbon atoms and optionally containing an ester or ether bond; R 2 represents a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R 3 represents an oxygen atom or a phenylene group; k represents 1 to 10 as an average value; m represents an integer of 0 to 2; n represents 0 to 10 as an average value; and a plurality of groups R 1 , R 2 , R 3 , k, or m present in the formula may be the same or different from each other.

First claim

Opening claim text (preview).

1 . A silicone-modified epoxy resin represented by the following formula (1): wherein R 1 represents an alkylene group having 2 to 6 carbon atoms and optionally containing an ester or ether bond; R 2 represents a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R 3 represents an oxygen atom or a phenylene group; k represents 1 to 10 as an average value; m represents an integer of 0 to 2; n represents 0 to 10 as an average value; and a plurality of groups R 1 , R 2 , R 3 , k, or m present in the formula may be the same or different from each other. 2 . The silicone-modified epoxy resin according to claim 1 , wherein the silicone-modified epoxy resin is a reaction product of compounds represented by the following formulas (2) and (6): wherein m is as defined above; and R 4 represents an alkylene group having 0 to 4 carbon atoms and optionally containing an ester or ether bond, and wherein R 2 , R 3 , and k are each as defined above. 3 . The silicone-modified epoxy resin according to claim 1 , wherein the silicone-modified epoxy resin is obtained by reacting compounds represented by the following formulas (2), (6), and (8): wherein m is as defined above; and R 4 represents an alkylene group having 0 to 4 carbon atoms and optionally containing an ester or ether bond, wherein R 2 , R 3 , and k are each as defined above, and wherein m and R 4 are each as defined above. 4 . The silicone-modified epoxy resin according to claim 1 , wherein the silicone-modified epoxy resin is obtained by oxidizing a diolefin compound of the following formula (4): wherein R 1 to R 3 , k, m, and n are each as defined above. 5 . An epoxy resin composition comprising (A) a silicone-modified epoxy resin according to claim 1 and (B) an epoxy resin curing agent. 6 . The epoxy resin composition according to claim 5 , further comprising (C) an epoxy resin curing catalyst. 7 . The epoxy resin composition according to claim 5 , wherein the epoxy resin curing agent is selected from an amine curing agent, a phenol curing agent, an acid anhydride curing agent, and a polyvalent carboxylic acid resin. 8 . A cured article obtained by curing an epoxy resin composition according to claim 5 .

Assignees

Inventors

Classifications

  • C08G59/30Primary

    containing atoms other than carbon, hydrogen, oxygen and nitrogen · CPC title

  • C08G59/306Primary

    containing silicon · CPC title

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What does patent US2016237202A1 cover?
Problem to be Solved The purpose of the invention, in view of the above circumstances, is to provide a silicone-modified epoxy resin composition that offers a cured article excellent in low gas permeability and strength, and an epoxy resin cured article obtained by curing the composition. Solution An epoxy resin represented by the following formula (1) wherein R 1 represents …
Who is the assignee on this patent?
Shinetsu Chemical Co, Nippon Kayaku Kk
What technology area does this patent fall under?
Primary CPC classification C08G59/30. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Aug 18 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).