Low temperature curing composition, cured film formed therefrom, and electronic device having cured film

Patent metadata

Field	Value
Publication number	US-10822449-B2
Application number	US-201615747244-A
Country	US
Kind code	B2
Filing date	Aug 1, 2016
Priority date	Aug 31, 2015
Publication date	Nov 3, 2020
Grant date	Nov 3, 2020

Abstract

(B) a cationic thermal initiator for a ring-opening reaction of epoxide, the initiator being a salt of a sulfonium-based cation and a borate-based anion, wherein the compound represented by chemical formula 1 is a combination of a siloxane 1,000 and a siloxane compound of which a number average molecular weight is in a range of 1,000-10,000.

First claim

The invention claimed is:

1. A low temperature curing composition, comprising:
a first epoxy group-containing siloxane compound represented by Chemical Formula 1, the first epoxy group-containing siloxane compound having a number average molecular weight of 100 to 1,000 g/mol;
a second epoxy-group containing siloxane compound represented by Chemical Formula 1, the second epoxy-group containing siloxane compound having a number average molecular weight of 1,000 to 10,000 g/mol, the second epoxy group-containing compound being different from the first epoxy group-containing compound; and
a cationic thermal initiator represented by Chemical Formula 2,
(R 1 R 2 R 3 SiO 1/2 ) M (R 4 R 5 SiO 2/2 ) D1 (R 6 SiO 3/2 ) T1 (R 7 R 8 SiO 2/2 ) D2 (R 9 SiO 3/2 ) T2   [Chemical Formula 1]

wherein, in Chemical Formula 1,
each of R 1 to R 9 is independently an organic group selected from a substituted or unsubstituted C1 to C6 monovalent aliphatic hydrocarbon group, a substituted or unsubstituted C6 to C20 monovalent alicyclic hydrocarbon group, a substituted or unsubstituted C6 to C20 monovalent aromatic hydrocarbon group, and an epoxy-substituted monovalent organic group, provided that R 6 is an epoxy-substituted monovalent organic group, and
0≤M<1, 0≤D1<1, 0<T1≤1, 0≤D2<1, 0≤T2<1, 0<M+D1+T1≤1, and M+D1+T1+D2+T2=1,

wherein, in Chemical Formula 2,
R 10 to R 13 are independently hydrogen, a C1 to C4 alkyl group, or a C6 to C10 aryl group substituted or unsubstituted with a C1 to C4 alkyl group, and
X − is a borate-based anion represented by Chemical Formula 3,

wherein, in Chemical Formula 3,
R 26 to R 30 are independently F, Cl, Br, or I.

2. The low temperature curing composition according to claim 1 , wherein the composition contains 20 wt % or less of the first epoxy group-containing siloxane compound and 80 wt % or greater of the second epoxy group-containing siloxane compound.

3. The low temperature curing composition according to claim 1 , wherein, in Chemical Formula 1, about 35 mol % to 100 mol % of siloxane units have an epoxy-substituted organic group.

4. The low temperature curing composition according to claim 1 , wherein, in Chemical Formula 1, 0≤M≤0.3, 0≤D1<0.7, 0.3≤T1≤1, 0≤D2<0.7, 0≤T2<0.7, 0<M+D1+T1≤1, and M+D1+T1+D2+T2=1.

5. The low temperature curing composition according to claim 1 , wherein the epoxy-substituted monovalent organic group comprises an epoxy-substituted monovalent aliphatic organic group, an epoxy-substituted monovalent alicyclic organic group, or an epoxy-substituted monovalent aromatic organic group, and wherein the epoxy-substituted monovalent aliphatic organic group comprises a glycidyl ether group or an oxetanyl ether group.

6. The low temperature curing composition according to claim 1 , wherein the cationic thermal initiator for a ring-opening reaction of epoxide is included in an amount of about 0.01 wt % to about 5 wt % in the composition.

7. The low temperature curing composition according to claim 1 , which further comprises a solvent.

8. The low temperature curing composition according to claim 1 , which further comprises a polymerization inhibitor.

9. The low temperature curing composition according to claim 1 , which is cured at a temperature of 100° C. or less.

10. A cured film obtained by curing the composition according to any of claim 1 - 5 or 6 - 9 .

11. The cured film according to claim 10 , which is an overcoat layer of an organic light emitting diode (OLED).

12. An electronic device comprising the cured film according to claim 10 .

Assignees

• Samsung Sdi Co Ltd

Inventors

• Song Doori
• Kim Woo Han
• Shin Dongju
• Yu Hong Jeong
• Lee Jiho

Classifications

• C08G59/30

  containing atoms other than carbon, hydrogen, oxygen and nitrogen · CPC title

• C09D183/04

  Polysiloxanes · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08G59/306 Primary

  containing silicon · CPC title

• C09D163/00

  Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins · CPC title