Curable composition and cured product of the same, and wafer-level lens
US-2024059831-A1 · Feb 22, 2024 · US
containing silicon
containing silicon · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/306 |
| Official title | {containing silicon} |
| Display label | containing silicon |
| Total patents | 172 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 17 |
| 2016 | 5 |
| 2017 | 12 |
| 2018 | 17 |
| 2019 | 17 |
| 2020 | 25 |
| 2021 | 19 |
| 2022 | 14 |
| 2023 | 10 |
| 2024 | 16 |
| 2025 | 15 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Epoxy resin composition
US-2019359822-A1 · Nov 28, 2019 · US
Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device
US-10428239-B2 · Oct 1, 2019 · US
Silicone-modified epoxy resin composition and semiconductor device
US-2019144704-A1 · May 16, 2019 · US
Radiation Curable Silicone-Epoxy Resins
US-2019136087-A1 · May 9, 2019 · US
Packaging material and film
US-2019127513-A1 · May 2, 2019 · US
Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages
US-10242923-B2 · Mar 26, 2019 · US
Epoxy-containing, isocyanurate-modified silicone resin, photosensitive resin composition, photosensitive dry film, laminate, and pattern forming process
US-2019064666-A1 · Feb 28, 2019 · US
Curable composition, cured film, display panel or oled light, and method for producing cured product
US-2019031818-A1 · Jan 31, 2019 · US
Low viscosity polyorganosiloxanes comprising quaternary ammonium groups, methods for the production and the use thereof
US-10160834-B2 · Dec 25, 2018 · US
Silicone-modified epoxy resin composition and semiconductor device
US-2018334567-A1 · Nov 22, 2018 · US
Epoxy resin composition, method for producing same, and use of composition
US-2018327595-A1 · Nov 15, 2018 · US
Photosensitive resin composition and electronic device including cured product of pattern-forming composition including the photosensitive resin composition
US-2018292750-A1 · Oct 11, 2018 · US
Curable composition, cured product thereof, optical member and optical device
US-2018284396-A1 · Oct 4, 2018 · US
Piezoelectric composite and method of forming same
US-2018261757-A1 · Sep 13, 2018 · US
Epoxy-functional silane coupling agents, surface-modified abrasive particles, and bonded abrasive articles
US-2018236637-A1 · Aug 23, 2018 · US
Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3d tsv packages
US-2018226313-A1 · Aug 9, 2018 · US
Curable composition, cured product thereof, optical member and optical device
US-10018810-B2 · Jul 10, 2018 · US
Low temperature curing composition, cured film formed therefrom, and electronic device having cured film
US-2018162989-A1 · Jun 14, 2018 · US
Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereof
US-9944760-B2 · Apr 17, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/306?
- CPC C08G59/306 is the Cooperative Patent Classification code for “containing silicon.”
- How many patents are filed under CPC C08G59/306 (containing silicon)?
- Our database includes 172 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/306 growing?
- Publication counts under this code: 16 in 2024 vs 15 in 2025 (latest complete years).