Resin composition for molding, and electronic component device
US-2025326926-A1 · Oct 23, 2025 · US
containing atoms other than carbon, hydrogen, oxygen and nitrogen
containing atoms other than carbon, hydrogen, oxygen and nitrogen · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/30 |
| Official title | containing atoms other than carbon, hydrogen, oxygen and nitrogen |
| Display label | containing atoms other than carbon, hydrogen, oxygen and nitrogen |
| Total patents | 43 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 3 |
| 2017 | 3 |
| 2018 | 3 |
| 2019 | 4 |
| 2020 | 7 |
| 2021 | 7 |
| 2022 | 2 |
| 2023 | 7 |
| 2024 | 2 |
| 2025 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Reversible Epoxy Polymer with Dynamic Boronic Bond
US-2024336724-A1 · Oct 10, 2024 · US
High-refractive-index composition, high-refractive-index film, and method for manufacturing high-refractive-index film
US-11866584-B2 · Jan 9, 2024 · US
Photosensitive resin composition, dry film resist, and cured objects obtained therefrom
US-11809078-B2 · Nov 7, 2023 · US
Curable composition
US-2023203228-A1 · Jun 29, 2023 · US
Silicone copolymer
US-2023203254-A1 · Jun 29, 2023 · US
Antimony free flame-retarded epoxy compositions
US-2023128079-A1 · Apr 27, 2023 · US
Compound having isocyanuric skeleton and composition in which said compound is included
US-11634608-B2 · Apr 25, 2023 · US
Antimony free flame-retarded epoxy compositions
US-11560448-B2 · Jan 24, 2023 · US
Formaldehyde free microspheres and encapsulation
US-11560447-B2 · Jan 24, 2023 · US
Hardcoat film, article and image display device having hardcoat film, and method for manufacturing hardcoat film
US-11530334-B2 · Dec 20, 2022 · US
Highly thermally conductive epoxy compound, and composition, material for semiconductor package, molded product, electric and electronic device and semiconductor package including the same
US-11421073-B2 · Aug 23, 2022 · US
Resin composition, photosensitive resin composition, cured film, method for manufacturing cured film, patterned cured film, method for producing patterned cured film
US-2021395461-A1 · Dec 23, 2021 · US
Water-repellent substrate
US-11118085-B2 · Sep 14, 2021 · US
Epoxy resin composition, process for producing same, and uses of said composition
US-11066510-B2 · Jul 20, 2021 · US
Compound having isocyanuric skeleton and composition in which said compound is included
US-2021206995-A1 · Jul 8, 2021 · US
Highly thermally conductive epoxy compound, and composition, material for semiconductor package, molded product, electric and electronic device and semiconductor package including the same
US-2021147613-A1 · May 20, 2021 · US
Compound having isocyanuric skeleton and composition in which said compound is included
US-10988633-B2 · Apr 27, 2021 · US
High-refractive-index composition, high-refractive-index film, and method for manufacturing high-refractive-index film
US-2021095128-A1 · Apr 1, 2021 · US
Hardcoat film, article and image display device having hardcoat film, and method for manufacturing hardcoat film
US-2020398542-A1 · Dec 24, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/30?
- CPC C08G59/30 is the Cooperative Patent Classification code for “containing atoms other than carbon, hydrogen, oxygen and nitrogen.”
- How many patents are filed under CPC C08G59/30 (containing atoms other than carbon, hydrogen, oxygen and nitrogen)?
- Our database includes 43 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/30 growing?
- Publication counts under this code: 2 in 2024 vs 1 in 2025 (latest complete years).