Heat transfer assembly and power electronics device
US-2024397675-A1 · Nov 28, 2024 · US
Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K7/20436 |
| Official title | {Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing} |
| Display label | Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing |
| Total patents | 803 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 56 |
| 2016 | 81 |
| 2017 | 74 |
| 2018 | 80 |
| 2019 | 96 |
| 2020 | 90 |
| 2021 | 58 |
| 2022 | 58 |
| 2023 | 70 |
| 2024 | 62 |
| 2025 | 63 |
| 2026 | 15 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Support system for printed board assemblies
US-2016338215-A1 · Nov 17, 2016 · US
Liquid-cooled heat sink assemblies
US-9345169-B1 · May 17, 2016 · US
Electric power tool
US-2016020676-A1 · Jan 21, 2016 · US
Electronic device with heat dissipating electromagnetic interference shielding structures
US-9215833-B2 · Dec 15, 2015 · US
Flash module
US-2015351277-A1 · Dec 3, 2015 · US
Heatsink with internal cavity for liquid cooling
US-2015342092-A1 · Nov 26, 2015 · US
Multi-layer mesh wicks for heat pipes
US-9175912-B2 · Nov 3, 2015 · US
Lightweight audio system for automotive applications and method
US-9173332-B2 · Oct 27, 2015 · US
Power module package and method for manufacturing the same
US-9161479-B2 · Oct 13, 2015 · US
Electronic assembly for an inverter
US-2015282383-A1 · Oct 1, 2015 · US
Electronic assembly for an inverter
US-2015282291-A1 · Oct 1, 2015 · US
Heat dissipating apparatus for folding electronic devices
US-9148979-B2 · Sep 29, 2015 · US
Electronic assembly for an inverter
US-9148946-B1 · Sep 29, 2015 · US
Thermal stand-off with tortuous solid-wall thermal conduction path
US-2015271955-A1 · Sep 24, 2015 · US
Air-Cooled Electronic Equipment and Device for Cooling an Electronic Component
US-2015264835-A1 · Sep 17, 2015 · US
Planar heat dissipation structure and electronic device utilizing the same
US-9137928-B2 · Sep 15, 2015 · US
Ink jet head
US-9132633-B2 · Sep 15, 2015 · US
Support frame with integrated thermal management features
US-2015253823-A1 · Sep 10, 2015 · US
Hardware shield device and electronic devices including the same
US-2015241936-A1 · Aug 27, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K7/20436?
- CPC H05K7/20436 is the Cooperative Patent Classification code for “Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing.”
- How many patents are filed under CPC H05K7/20436 (Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing)?
- Our database includes 803 publications tagged with this CPC code.
- Is patent activity under CPC H05K7/20436 growing?
- Publication counts under this code: 62 in 2024 vs 63 in 2025 (latest complete years).