Substrate treatment apparatus

Patent metadata

Field	Value
Publication number	US-2016195331-A1
Application number	US-201414915709-A
Country	US
Kind code	A1
Filing date	Oct 17, 2014
Priority date	Oct 17, 2013
Publication date	Jul 7, 2016
Grant date	—

Abstract

Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber body having a passage, through which substrates are transferred, in one side thereof, the chamber body having opened upper and lower portions, an inner reaction tube disposed above the chamber body to provide a process space in which a process with respect to the substrates is performed, the inner reaction tube having an opened lower portion, a substrate holder disposed in the opened lower portion of the chamber to move between a stacking position at which the substrates transferred through the passage are vertically stacked and a process position at which the substrate holder ascends toward the process space to perform the process with respect to the stacked substrates, a blocking plate connected to a lower portion of the substrate holder to ascend or descend together with the substrate holder, the blocking plate closing the opened lower portion of the inner reaction tube at the process position, a connection cylinder vertically disposed on a lower portion of the blocking plate to ascend or descend together with the blocking plate, and a blocking member connected between the opened lower portion of the chamber body and the connection cylinder to isolate the opened lower portion of the chamber body from the outside.

First claim

1 . A substrate processing apparatus comprising:
a chamber body having a passage, through which substrates are transferred, in one side thereof, the chamber body having opened upper and lower portions; an inner reaction tube disposed above the chamber body to provide a process space in which a process with respect to the substrates is performed, the inner reaction tube having an opened lower portion; a substrate holder disposed in the opened lower portion of the chamber to move between a stacking position at which the substrates transferred through the passage are vertically stacked and a process position at which the substrate holder ascends toward the process space to perform the process with respect to the stacked substrates; a blocking plate connected to a lower portion of the substrate holder to ascend or descend together with the substrate holder, the blocking plate closing the opened lower portion of the inner reaction tube at the process position; a connection cylinder vertically disposed on a lower portion of the blocking plate to ascend or descend together with the blocking plate; and a blocking member connected between the opened lower portion of the chamber body and the connection cylinder to isolate the opened lower portion of the chamber body from the outside.

2 . The substrate processing apparatus of claim 1 , wherein the blocking member provides a stacking space communicating with the process space at the stacking position of the substrate holder, and
the stacking space is reduced in volume at the process position of the substrate holder.

3 . The substrate processing apparatus of claim 1 , wherein the blocking member is elastic as the blocking plate is elevated.

4 . The substrate processing apparatus of claim 1 , wherein the connection cylinder has a protrusion protruding outward from a lower portion thereof, and
the blocking member is connected between the opened lower portion of the chamber body and the protrusion.

5 . The substrate processing apparatus of claim 1 , wherein the connection cylinder is disposed in a lower portion of the chamber body at the stacking position of the substrate holder and is disposed in the chamber body at the process position of the substrate holder.

6 . The substrate processing apparatus of claim 1 , further comprising a manifold disposed on the chamber body,
wherein the inner reaction tube is supported by the manifold.

7 . The substrate processing apparatus of claim 6 , wherein the blocking plate is in contact with the manifold at the process position to define the process space.

8 . The substrate processing apparatus of claim 6 , wherein the manifold comprises:
a first supply unit for supplying a process gas into the process space; an exhaust unit disposed at a side opposite to that of the first supply unit to exhaust the process gas supplied into the process space; and a second supply unit disposed under the first supply unit to supply a purge gas into the chamber body, wherein the second supply unit is disposed parallel to the blocking plate at the process position of the substrate holder.

9 . The substrate processing apparatus of claim 1 , further comprising a sealing member inserted into an installation groove defined along an upper surface of the blocking plate.

10 . The substrate processing apparatus of claim 1 , further comprising a cooling passage defined in the blocking plate to allow a refrigerant supplied from the outside to flow therein.

11 . The substrate processing apparatus of claim 10 , further comprising a sealing member inserted into an installation groove defined along an upper surface of the blocking plate,
wherein the cooling passage is disposed adjacent to the sealing member.

12 . The substrate processing apparatus of claim 1 , further comprising:
an elevation shaft vertically disposed outside the blocking member; an elevation motor connected to the elevation shaft to rotate the elevation shaft; a support ring connected to a lower portion of the connection cylinder; and a bracket connected to each of the support ring and the elevation shaft, the bracket being elevated together with the support ring by the rotation of the elevation shaft.

13 . The substrate processing apparatus of claim 2 , wherein the blocking member is elastic as the blocking plate is elevated.

Assignees

• Eugene Technology Co Ltd

Inventors

• Hyon Jun-Jin
• Song Byoung-Gyu
• Kim Kyong-Hun
• Kim Yong-Ki
• Shin Yang-Sik
• Kim Chang-Dol

Classifications

• H10P72/3412

  Batch transfer of wafers · CPC title

• H10P72/3411

  involving loading and unloading of wafers · CPC title

• H10P72/3312

  Vertical transfer of a batch of workpieces · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10P72/0434 Primary

  mainly by convection · CPC title