Thermal fill bonding method

Patent metadata

Field	Value
Publication number	US-2016185038-A1
Application number	US-201514830301-A
Country	US
Kind code	A1
Filing date	Aug 19, 2015
Priority date	Aug 19, 2014
Publication date	Jun 30, 2016
Grant date	—

Abstract

A Thermal Bonding Method and Apparatus to thermally bond sheets of fill in a cooling tower fill pack. The apparatus creates a hemispherical joint extending through two fill sheets to provide a substantial joint between said sheets.

First claim

1 . A thermal bonding method comprising:
placing alternating film fill sheets on a stack; heating a hemispherical bonding tip to a melting point of the fill sheet; plunging the bonding tip vertically onto a bond site on the fill sheet; waiting a specified amount of time for the tip to melt into the fill sheet to a specified depth; providing a pulse of air through the bonding tip that pushes the melted sheets together; and removing the bonding tip from the joint.

2 . The method of claim 1 with a specified duration for each step, and wherein some steps occur simultaneously.

3 . The method of claim 1 wherein a specific pressure and duration of air pulse is provided through the tip to cause the bond site to “bubble-out.”

4 . A thermal bonding device comprising:
a hemispherical bonding tip extending through an insulating bushing; a heater block to provide the temperature necessary to heat the bonding tip to a level near a melting point of the fill sheet; a spring mechanism attached to the bonding tip to provide a resistance force; a sliding mechanism allowing the bonding tip to move vertically; and an air conduit to provide a pulse of air to the bond zone.

5 . The device of claim 4 further comprising a ship's hull shaped tip

6 . The device of claim 4 further comprising a weight to provide resistance to the bond tip

7 . The device of claim 4 comprising a non-cylindrical insulating bushing shape.

Assignees

• Evapco Inc

Inventors

• Vadder Davey
• Kane Jeff

Classifications

• B29C66/87 Primary

  Auxiliary operations or devices · CPC title

• B32B7/05

  the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection (using interposed adhesives or bonding materials applied in spaced arrangements B32B7/14) · CPC title

• B29C65/18 Primary

  using heated tools · CPC title

• B29K2105/256

  Sheets, plates, blanks or films · CPC title

• B29C66/43

  Joining a relatively small portion of the surface of said articles (B29C66/45 takes precedence) · CPC title