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Thermal fill bonding method
US10603846B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10603846-B2 |
| Application number | US-201514830301-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 19, 2015 |
| Priority date | Aug 19, 2014 |
| Publication date | Mar 31, 2020 |
| Grant date | Mar 31, 2020 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A Thermal Bonding Method and Apparatus to thermally bond sheets of fill in a cooling tower fill pack. The apparatus creates a hemispherical joint extending through two fill sheets to provide a substantial joint between said sheets.
First claim
Opening claim text (preview).
The invention claimed is: 1. A thermal bonding method comprising: placing alternating film fill sheets on a stack; heating a hemispherical bonding tip to a melting point of said alternating film fill sheets; plunging the bonding tip vertically onto a bond site on a selected one of said alternating film fill sheets; allowing the tip to melt into the stack of alternating film fill sheets to a predetermined depth; providing a pulse of air through the bonding tip that pushes the melted film fill sheets together; and removing the bonding tip from the bond site. 2. The method of claim 1 wherein some steps occur simultaneously. 3. The method of claim 1 wherein a sufficient pressure and duration of air pulse is provided through the tip to cause the bond site to form into a partial bubble shape as air is injected into the bond site. 4. The method of claim 3 , wherein the partial bubble shape of the bond site is larger at a bottom, inhibiting separation of bonded sheets.
Assignees
Inventors
Classifications
Sheets, plates, blanks or films · CPC title
comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF · CPC title
being convex · CPC title
Joining a relatively small portion of the surface of said articles (B29C66/45 takes precedence) · CPC title
characterised by a layer comprising a deformed thin sheet {, i.e. the layer having its entire thickness deformed out of the plane}, e.g. corrugated, crumpled (B32B29/08 takes precedence) · CPC title
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Frequently asked questions
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- What does patent US10603846B2 cover?
- A Thermal Bonding Method and Apparatus to thermally bond sheets of fill in a cooling tower fill pack. The apparatus creates a hemispherical joint extending through two fill sheets to provide a substantial joint between said sheets.
- Who is the assignee on this patent?
- Evapco Inc
- What technology area does this patent fall under?
- Primary CPC classification B29C65/18. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Mar 31 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).