Cmp pad construction with composite material properties using additive manufacturing processes

Patent metadata

Field	Value
Publication number	US-2016107290-A1
Application number	US-201514695299-A
Country	US
Kind code	A1
Filing date	Apr 24, 2015
Priority date	Oct 17, 2014
Publication date	Apr 21, 2016
Grant date	—

Abstract

Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

First claim

1 . A polishing pad, comprising:
a composite polishing pad body comprising:
one or more first features formed from a first material; and
one or more second features formed from a second material, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material and the second material.

2 . The polishing pad of claim 1 , wherein the first material comprises a first composition of materials that is formed by depositing droplets of a third material and a fourth material.

3 . The polishing pad of claim 2 , wherein the second material comprises a second composition of materials that is formed by depositing droplets of a fifth material and a sixth material.

4 . The polishing pad of claim 1 , wherein the first material has a first hardness and the second material has a second hardness different from the first hardness.

5 . The polishing pad of claim 4 , wherein the one or more first features and the one or more second features are arranged to achieve a predetermined Young's modulus or a predetermined storage modulus and loss modulus across the composite polishing pad body.

6 . The polishing pad of claim 1 , wherein the one or more first features are thicker than the one or more second features in a direction normal to a plane that is parallel to at least one of the plurality of layers so that grooves and/or channels are formed on a top surface of the composite pad body.

7 . The polishing pad of claim 1 , wherein the first material has a higher Young's modulus than the second material.

8 . The polishing pad of claim 1 , wherein the one or more first features comprise a plurality of concentric rings separated by the one or more second features.

9 . The polishing pad of claim 1 , wherein the one or more first features comprise a plurality of posts surrounded by the one or more second features.

10 . The polishing pad of claim 1 , wherein the one or more first features and one or more second features are formed by 3D printing.

11 . A method of forming a polishing pad, comprising:
depositing a plurality of composite layers with a 3D printer to reach a target thickness, wherein depositing the plurality of composite layers comprises:
depositing a first material over one or more first regions of a surface; and
depositing a second material over one or more second regions of the surface, wherein the one or more first regions and the one or more second regions form a continuous part of each of the plurality of composite layers; and
solidifying the plurality of composite layers to form a composite pad body having one or more first features comprising the first material and one or more second features comprising the second material, wherein the one or more first features and the one or more second features form a unitary body.

12 . The method of claim 11 , wherein the first material comprises a first composition of materials that is formed by depositing droplets of a third material and a fourth material.

13 . The method of claim 12 , wherein the second material comprises a second composition of materials that is formed by depositing droplets of a fifth material and a sixth material.

14 . The method of claim 11 , further comprising depositing a plurality of discontinuous layers with a 3D printer after depositing the plurality of composite layers, wherein each of the discontinuous layer comprises one or more feature regions that are disconnected from one another.

15 . The method of claim 14 , wherein the one or more feature regions are disposed over the one or more first regions.

16 . The method of claim 14 , wherein depositing each of the discontinuous layers comprises:
depositing the first material and the second material on each of one or more feature regions, wherein the second material surrounds the first material in each feature region.

17 . The method of claim 11 , wherein the first material comprises one or more thermoplastic polymers.

18 . The method of claim 17 , wherein the one or more thermoplastic polymers comprises polyurethane, polypropylene, polystyrene, polyacrylonitrile, polymethyle methacrylate, polychlorotrifluoroethylene, polytetrafluoroethylene, polyoxymethylene, polycarbonate, polyimide, polyetheretherketone, polyphenylene sulfide, polyether sulfone, acrylonitrile butadiene styrene (ABS), polyetherimide, polyamides, melamines, polyesters, polysulfones, polyvinyl acetates, fluorinated hydrocarbons, and acrylate, copolymers, grafts, and mixtures thereof.

19 . A polishing pad, comprising:
a composite pad body comprising:
a plurality of polishing features forming a polishing surface, wherein the plurality of polishing features are formed from a first material; and
one or more base features formed from a second material, wherein the one or more base features jointly surround the plurality of polishing feature to form a unitary body.

20 . The polishing pad of claim 19 , wherein the first material comprises one of polyurethane, polypropylene, polystyrene, polyacrylonitrile, polymethyle methacrylate, polychlorotrifluoroethylene, polytetrafluoroethylene, polyoxymethylene, polycarbonate, polyimide, polyetheretherketone, polyphenylene sulfide, polyether sulfone, acrylonitrile butadiene styrene (ABS), polyetherimide, polyamides, melamines, polyesters, polysulfones, polyvinyl acetates, fluorinated hydrocarbons, and acrylates, copolymers, grafts, and mixtures thereof.

21 . The polishing pad of claim 19 , wherein size, density, and/or arrangement of the plurality of polishing features vary across the polishing surface.

22 . The polishing pad of claim 1 , further comprising one or more observation windows, wherein the one or more observation windows are formed through and/or abut the one or more first features or the one or more second features.

Assignees

• Applied Materials Inc

Inventors

• Bajaj Rajeev
• Krishnan Kasiraman
• Orilall Mahendra C
• Redfield Daniel
• Redeker Fred C
• Patibandla Nag B
• Menk Gregory E
• Fung Jason G
• Perry Russell Edward
• Davenport Robert E

Classifications

• B24D18/0018

  by electrolytic deposition · CPC title

• B29C64/112

  using individual droplets, e.g. from jetting heads · CPC title

• B33Y80/00

  Products made by additive manufacturing · CPC title

• B24B37/205 Primary

  provided with a window for inspecting the surface of the work being lapped · CPC title

• B24B37/26 Primary

  characterised by the shape of the lapping pad surface, e.g. grooved · CPC title