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US-12087886-B2 · Sep 10, 2024 · US
Vacuum Chuck with Polymeric Embossments
US2015380294A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015380294-A1 |
| Application number | US-201414764436-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 11, 2014 |
| Priority date | Feb 13, 2013 |
| Publication date | Dec 31, 2015 |
| Grant date | — |
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- Title
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Abstract
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A vacuum chuck with polymeric embossments is disclosed. The polymeric embossments are formed on the surface of a base substrate and are lapped to a flatness such that a wafer substrate clamped by the vacuum chuck has a peak to valley flatness that is less than a peak to valley flatness across the base substrate. Lapping of the polymeric embossments accommodates for variations in the flatness of the base substrate so long as the embossments are tall enough to stand over the peak to valley height variations in the base substrate.
First claim
Opening claim text (preview).
1 . A vacuum chuck comprising: a base substrate comprising a first peak to valley flatness; and at least one embossment structure comprising a polymer and being disposed above the base substrate, the at least one embossment structure extending to a height above portions of the vacuum chuck surrounding the at least one embossment structure to support a substrate upon the at least one embossment structure during vacuum chucking of the substrate; the height of the at least one embossment struc…
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H10P72/78Primary
Electricity · mapped topic
- H01L21/6838Primary
Electricity · mapped topic
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- What does patent US2015380294A1 cover?
- A vacuum chuck with polymeric embossments is disclosed. The polymeric embossments are formed on the surface of a base substrate and are lapped to a flatness such that a wafer substrate clamped by the vacuum chuck has a peak to valley flatness that is less than a peak to valley flatness across the base substrate. Lapping of the polymeric embossments accommodates for variations in the flatness of…
- Who is the assignee on this patent?
- Entegris Inc
- What technology area does this patent fall under?
- Primary CPC classification H10P72/78. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Dec 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).