Seal ring and method for manufacturing seal ring
US-2015342072-A1 · Nov 26, 2015 · US
Cu BALL
US2015336216A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015336216-A1 |
| Application number | US-201314759360-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 11, 2013 |
| Priority date | Jan 11, 2013 |
| Publication date | Nov 26, 2015 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
To provide Cu ball that has an excellent alignment performance. In order to control wettability failure of the Cu ball at a moment of soldering, lightness is regulated as an index of determining oxide film thickness on a surface of the ball and the lightness is set to be 55 or more. Further, since it is preferable that the Cu ball has a higher sphericity to measure the lightness accurately, the purity of the Cu ball is set to be 99.995% or less to order to make the sphericity higher. When the lightness is 55 or more, it is preferable that the thickness of oxide film formed on the surface of the Cu ball is 8 nm or less.
First claim
Opening claim text (preview).
1 .- 5 . (canceled) 6 . A Cu ball that has an excellent alignment performance when connecting the electrode, characterized in that Each Cu ball contains a purity from 99.9% or more to 99.995% or less, sphericity of 0.95 or more, a diameter of 1 through 1000 pm and lightness of 55 or more. 7 . The Cu ball according to claim 1 further containing oxide film thickness of 8 nm or less on its surface. 8 . A solder joint using the Cu ball according to the above-mentioned claim 1 .
Assignees
Inventors
Classifications
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title
characterised by the relative positions of pads or connectors relative to package parts · CPC title
Conductive materials thereof · CPC title
Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title
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- What does patent US2015336216A1 cover?
- To provide Cu ball that has an excellent alignment performance. In order to control wettability failure of the Cu ball at a moment of soldering, lightness is regulated as an index of determining oxide film thickness on a surface of the ball and the lightness is set to be 55 or more. Further, since it is preferable that the Cu ball has a higher sphericity to measure the lightness accuratel…
- Who is the assignee on this patent?
- Senju Metal Industry Co, Senju Metal Lndustry Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification B23K35/302. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Nov 26 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).