Device for Coating Thin Molten Solder Film, Thin Solder Film-covered Component and Manufacturing Method Therefor

Patent metadata

Field	Value
Publication number	US-2015174678-A1
Application number	US-201314407040-A
Country	US
Kind code	A1
Filing date	Jun 10, 2013
Priority date	Jun 11, 2012
Publication date	Jun 25, 2015
Grant date	—

Abstract

A hot-dip plating apparatus for plating a thin molten solder film can control a film thickness of a molten solder on a base material evenly and in increments of a few μm and achieve a thin-film solder plating having a film thickness less than a conventional system. As shown in FIG. 1, this apparatus comprises a solder bath 17 of accommodating the molten solder 7; a second conveying section 23 for drawing up a strip member 31 from the solder bath; and a blower section 19 for blowing hot gas on the strip member 31 immediately after being drawn up from the solder bath by a second conveying section 23; the hot gas having a predetermined flow volume and a predetermined temperature equal to or higher than a melting temperature of the molten solder 7. According to this configuration, the excess molten solder 7 can be trimmed from the strip member 31 corresponding to composition of the molten solder 7. Thus, the film thickness of the molten solder 7 coated on the strip member 31 can be controlled evenly and in increments of a few μm.

First claim

1 . A hot-dip plating apparatus for plating a thin molten solder film that manufactures a thin solder film plated member by cooling down a base material after coating the washed base material with the molten solder heated to a predetermined temperature, comprising:
a solder bath for, for in an inactive atmosphere, accommodating the molten solder to coat with the solder by dipping the base material; a cover section for covering the upper portion of said solder bath and having an inlet port for the base material toward said solder bath and an outlet port from said solder bath; a bearing member provided in a unified manner with said cover section at the solder bath side of said cover section and supporting a shaft of a roller so as to turn around said base material to convey it from the inlet port of said cover section to the side of said solder bath and further convey it from the outlet port from the side of said solder bath; a longitudinal member provided at a side of said solder bath facing said bearing member with respect to said cover member and being able to slide said cover section and said bearing member in a unified manner; a first conveying section provided at an upstream side of said solder bath for applying a predetermined tension to the base material that is to be conveyed to said solder bath under a condition of determining an inlet side of the base material as the upper stream upstream side and an outlet side of the base material as a downstream side; a second conveying section provided at the downstream side of said solder bath for conveying the base material while drawing up the base material from said solder bath at a predetermined speed with the tension applied; a blower section for blowing hot gas on the base material immediately after being drawn up from said solder bath by said second conveying section, the hot gas having a predetermined flow volume and a temperature set to be equal to or higher than a melting temperature corresponding to the composition of the molten solder; and a control section for controlling the temperature and flow volume of the hot gas to trim the molten solder from the base material so as to control the film thickness coated on the base material.

2 . (canceled)

3 . The hot-dip plating apparatus for plating the thin molten solder film according to claim 1 , further comprising:
a cooling section for cooling down the base material whose film thickness is controlled by said control section.

4 . The hot-dip plating apparatus for plating the thin molten solder film according to claim 1 characterized in that inactive gas is used as the hot gas.

5 . (canceled)

6 . A thin solder film plated member, comprising:
a washed base material; and a coating layer wherein the coating layer is formed by controlling a film thickness consisting of a molten solder for coating the base material; wherein the molten solder heated to a predetermined temperature is accommodated in a solder bath in an inactive atmosphere; the washed base material is conveyed to the molten solder bath at a predetermined speed through a bearing member and a longitudinal member under a condition where a predetermined tension is applied in the solder bath from, said bearing member and solder bath, said bearing member and said longitudinal member being provided in a unified manner with a cover section that covers an upper portion of the solder bath, said bearing member supporting a shaft of a roller that turns around the base material; the washed base material is conveyed to the solder bath at a predetermined speed under a condition where a predetermined tension is applied; the base material is dipped in the molten solder bath; hot gas is blown on the base material immediately after being drawn up from said solder bath; and the molten solder is trimmed from the base material so that the coating layer has a predetermined film thickness; the hot gas having a predetermined flow volume and a temperature set to be equal to or higher than a melting temperature corresponding to the composition of the molten solder.

7 . A method of manufacturing a thin solder film plated member by coating a washed base material with a molten solder heated to a predetermined temperature and then cooling down the base material comprising:
a step of conveying the base material at a predetermined speed and dipping it in a solder bath an inactive atmosphere through a bearing member and a longitudinal member, a predetermined tension being applied to the base material, said bearing member and said longitudinal member being provided in a unified manner with a cover section that covers an upper portion of the solder bath, said bearing member supporting a shaft of a roller that turns around the base material; a step of drawing up the base material dipped in said solder bath from said solder bath; and a step of controlling a film thickness of the molten solder toward the thin-film solder coated member by blowing hot gas on the base material immediately after drawing up the base material in order to trim the molten solder from the base material, the hot gas being set to have a temperature equal to or higher than a melting temperature of the composition of the molten solder and being controlled to have a predetermined flow volume.

Assignees

• Senju Metal Industry Co

Inventors

• Sato Isamu
• Watanabe Koji
• Kikuchi Kota
• Suzuki Michio
• Kameda Naoto
• Nakamura Hideki

Classifications

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• B23K1/20

  Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating · CPC title

• C23C2/003

  Apparatus · CPC title

• B23K3/0676 Primary

  Conveyors therefor · CPC title

• C23C2/16

  using fluids under pressure, e.g. air knives · CPC title