Soldering module

Patent metadata

Field	Value
Publication number	US-10086460-B2
Application number	US-201515320351-A
Country	US
Kind code	B2
Filing date	Jul 24, 2015
Priority date	Jul 29, 2014
Publication date	Oct 2, 2018
Grant date	Oct 2, 2018

Abstract

The invention relates to a soldering module (3) for the, in particular selective, soldering of components to a circuit board (14), having a soldering nozzle (32) for creating a solder wave. It is proposed that the soldering module (3) comprises a linear conveyor (8), in particular a belt conveyor or a chain conveyor, for applying solder to the circuit board (14) by moving the circuit board (14) in a conveying direction over the solder wave, and that the linear conveyor (8) is tiltable, in particular about a first tilting axis (23).

First claim

The invention claimed is:

1. A soldering module for the soldering of components to a circuit board, having a soldering nozzle for creating a solder wave,
the soldering module comprising a linear conveyor including one of a belt conveyor and a chain conveyor, for applying solder to the circuit board by moving the circuit board in a conveying direction over the solder wave, and in that the linear conveyor is tiltable about a first tilting axis,
wherein the first tilting axis is oriented substantially perpendicularly to a direction of gravitational force and substantially perpendicularly to a conveying direction or substantially parallel to the conveying direction,
wherein the linear conveyor is tiltable about a second tilting axis, wherein the second tilting axis is oriented substantially normal to the direction of gravitational force, and
wherein the first tilting axis and/or the second tilting axis extends through the solder wave.

2. The soldering module as claimed in claim 1 , wherein the linear conveyor is tiltable about the first tilting axis such that the normal of the circuit board encloses an angle of at least 4°, of at least 8°, or of at least 10°, with the direction of gravitational force.

3. The soldering module as claimed in claim 1 , wherein the linear conveyor is tiltable while the circuit board is being moved over the solder wave.

4. The soldering module as claimed in claim 1 , wherein a soldering nozzle is movable in a plane oriented substantially normal to the direction of gravitational force.

5. The solder module as claimed in claim 4 , wherein a distance between the soldering nozzle and the circuit board is sellable by moving the soldering nozzle.

6. The soldering module as claimed in claim 4 , wherein the soldering nozzle is rotatable.

7. The soldering module as claimed in claim 4 , wherein the soldering nozzle is wettable with solder, and is manufactured from steel.

8. The soldering module as claimed in claim 4 , wherein the soldering nozzle is not wettable with solder, and is manufactured from a stainless, coated, steel.

9. The soldering module as claimed in claim 1 , wherein the soldering module has an inert gas device.

10. The soldering module as claimed in claim 1 , wherein provision is made of a solder joint processing device, wherein the solder joint processing device comprises a gas nozzle.

11. The soldering module as claimed in claim 4 , wherein the soldering module has a second soldering nozzle for creating a second solder wave.

12. A soldering plant having a first soldering module as claimed in claim 1 and a flux module.

13. The soldering plant as claimed in claim 12 , wherein the soldering plant has a preheating module.

14. The soldering plant as claimed in claim 12 , wherein the soldering plant has a second soldering module.

15. A method for soldering components to a circuit board using a soldering module as claimed in claim 1 , wherein a populated circuit board is received on the linear conveyor, wherein the linear conveyor is in a receiving position, in that the linear conveyor is tilted into a first processing position, in that the circuit board is moved over a first solder wave by means of the linear conveyor, wherein a subregion of the circuit board is wetted with solder.

Assignees

• Illinois Tool Works

Inventors

• Colijn Antonie Cornelis

Classifications

• B23K1/085 Primary

  Wave soldering · CPC title

• B23K3/0676

  Conveyors therefor · CPC title

• B23K3/0653 Primary

  with wave generating means, e.g. nozzles, jets, fountains · CPC title

• H05K13/0061

  Tools for holding the circuit boards during processing; handling transport of printed circuit boards · CPC title

• H05K13/0465

  by soldering (H05K13/0469 takes precedence) · CPC title