Jet nozzle and jet soldering apparatus

Patent metadata

Field	Value
Publication number	US-9849535-B2
Application number	US-201615260678-A
Country	US
Kind code	B2
Filing date	Sep 9, 2016
Priority date	Sep 11, 2015
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

Provided is a jet nozzle that varies a width of a flow of jetted molten solder. The jet nozzle contains a nozzle main body having a channel section at its part and a molten solder flow width varying member that varies a width of the upper opening end of the nozzle main body by a slide of the molten solder flow width varying member within the channel section of the nozzle main body to vary a width of the molten solder flow jetted from the upper opening end of the nozzle main body. The molten solder flow width varying member includes a molten solder flow width varying plate that varies the width of the molten solder flow, a rectangular rectifying piece that extends along a slide direction of the molten solder flow width varying member, and a sliding shaft that slides the rectifying piece.

First claim

What is claimed is:

1. A jet nozzle which allows a width of a flow of jetted molten solder to vary, the jet nozzle comprising:
a nozzle main body having a rectangular channel section with both opening ends, the one opening end being opposed to a soldering bath and the other opening end jetting the molten solder flow; and
a molten solder flow width varying member that varies a width of the other opening end of the nozzle main body by a slide of the molten solder flow width varying member, wherein the molten solder flow width varying member includes:
a molten solder flow width varying plate that extends along a jetting direction of the molten solder;
a rectangular rectifying piece that is attached to the molten solder flow width varying plate at an opposite side of the other opening end of the nozzle main body and extends along a slide direction of the molten solder flow width varying member; and
a sliding shaft that slides the rectifying piece,
wherein the rectifying piece contains a solder-guiding portion that is obliquely cut away from a side surface of the rectifying piece to a bottom thereof and guides the flow of the molten solder.

2. The jet nozzle according to claim 1 , wherein the nozzle main body bends along the jetting direction of the molten solder jetted from the nozzle main body.

3. The jet nozzle according to claim 1 , wherein the molten solder flow width varying member further includes a reinforcing member that is attached to an angle formed by the molten solder flow width varying plate and the rectifying piece.

4. The jet nozzle according to claim 1 , wherein the jet nozzle further comprises a plunger that plunges the sliding shaft.

5. The jet nozzle according to claim 1 , wherein the jet nozzle further comprises an inclined plate that has an inclination along a flowing direction of the molten solder jetted from the other opening end of the nozzle main body.

6. A jet soldering apparatus, comprising:
a jet nozzle according to claim 1 ;
a supplying device for supplying molten solder to the jet nozzle;
a conveying device for conveying a printed circuit board horizontally along the other opening end of the nozzle main body; and
a control device for varying a width of the molten solder flow from the jet nozzle so as to meet a width of the region to be partially soldered of the printed circuit board, adjusting an amount of the supplied molten solder so as to meet the varied width of the molten solder flow, contacting one end of the region to be partially soldered of the printed circuit board with the jetted molten solder, and conveying the printed circuit board by sequentially moving the contact thereof toward the other end of the region to be partially soldered of the printed circuit board.

7. A jet soldering apparatus, comprising:
a jet nozzle according to claim 2 ;
a supplying device for supplying molten solder to the jet nozzle;
a conveying device for conveying a printed circuit board horizontally along the other opening end of the nozzle main body; and
a control device for varying a width of the molten solder flow from the jet nozzle so as to meet a width of the region to be partially soldered of the printed circuit board, adjusting an amount of the supplied molten solder so as to meet the varied width of the molten solder flow, contacting one end of the region to be partially soldered of the printed circuit board with the jetted molten solder, and conveying the printed circuit board by sequentially moving the contact thereof toward the other end of the region to be partially soldered of the printed circuit board.

8. A jet soldering apparatus, comprising:
a jet nozzle according to claim 3 ;
a supplying device for supplying molten solder to the jet nozzle;
a conveying device for conveying a printed circuit board horizontally along the other opening end of the nozzle main body; and
a control device for varying a width of the molten solder flow from the jet nozzle so as to meet a width of the region to be partially soldered of the printed circuit board, adjusting an amount of the supplied molten solder so as to meet the varied width of the molten solder flow, contacting one end of the region to be partially soldered of the printed circuit board with the jetted molten solder, and conveying the printed circuit board by sequentially moving the contact thereof toward the other end of the region to be partially soldered of the printed circuit board.

9. A jet soldering apparatus, comprising:
a jet nozzle according to claim 4 ;
a supplying device for supplying molten solder to the jet nozzle;
a conveying device for conveying a printed circuit board horizontally along the other opening end of the nozzle main body; and
a control device for varying a width of the molten solder flow from the jet nozzle so as to meet a width of the region to be partially soldered of the printed circuit board, adjusting an amount of the supplied molten solder so as to meet the varied width of the molten solder flow, contacting one end of the region to be partially soldered of the printed circuit board with the jetted molten solder, and conveying the printed circuit board by sequentially moving the contact thereof toward the other end of the region to be partially soldered of the printed circuit board.

10. A jet soldering apparatus, comprising:
a jet nozzle according to claim 5 ;
a supplying device for supplying molten solder to the jet nozzle;
a conveying device for conveying a printed circuit board horizontally along the other opening end of the nozzle main body; and
a control device for varying a width of the molten solder flow from the jet nozzle so as to meet a width of the region to be partially soldered of the printed circuit board, adjusting an amount of the supplied molten solder so as to meet the varied width of the molten solder flow, contacting one end of the region to be partially soldered of the printed circuit board with the jetted molten solder, and conveying the printed circuit board by sequentially moving the contact thereof toward the other end of the region to be partially soldered of the printed circuit board.

11. The jet soldering apparatus according to claim 6 , wherein the control device controls the conveying device to convey the printed circuit board toward the same direction as the jetting direction of the molten solder jetted from the other opening end of the nozzle main body.

12. The jet soldering apparatus according to claim 7 , wherein the control device controls the conveying device to convey the printed circuit board toward the same direction as the jetting direction of the molten solder jetted from the other opening end of the nozzle main body.

13. The jet soldering apparatus according to claim 8 , wherein the control device controls the conveying device to convey the printed circuit board toward the same direction as the jetting direction of the molten solder jetted from the other opening end of the nozzle main body.

14. The jet soldering apparatus according to claim 9 , wherein the control device controls the conveying device to convey the printed circuit board toward the same direction as the jetting direction of the molten solder jetted from the other opening end of the nozzle main body.

15. The jet soldering apparatus according to claim 10 , wherein the control device controls the conveying device to convey the printed circuit board toward the same direction as the jetting direction of the molten solder jetted from the other opening end of the nozzle main body.

Assignees

• Senju Metal Industry Co

Inventors

• Hashimoto Noboru
• Kasama Takahiro

Classifications

• B23K3/0653 Primary

  with wave generating means, e.g. nozzles, jets, fountains · CPC title

• H05K3/34 Primary

  by soldering · CPC title

• B23K2101/42

  Printed circuits · CPC title

• B23K3/0646

  Solder baths · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title