Film structure for electric field guided photoresist patterning process
US-11880137-B2 · Jan 23, 2024 · US
US2015114287A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015114287-A1 |
| Application number | US-201414522542-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 23, 2014 |
| Priority date | Oct 25, 2013 |
| Publication date | Apr 30, 2015 |
| Grant date | — |
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A mask frame assembly for thin film deposition and manufacturing method thereof are disclosed. One inventive aspect includes a mask frame, a plurality of first masks and a plurality of second masks. The first and second masks are alternately formed in a first direction. Two overlapped portions of each of the first and second masks are connected to both sides of the non-overlapped portion of each of the first and second mask, respectively. In addition, one overlapped portion of each first mask and one overlapped portion of each second mask overlap each other at a connection area.
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What is claimed is: 1 . A mask frame assembly for thin film deposition, comprising: a mask frame; and a plurality of first masks and a plurality of second masks alternately formed in a first direction and connected to each other, wherein each first mask includes: a first non-overlapped portion, a first overlapped portion, and a second overlapped portion, the first and second overlapped portions connected to both sides of the first non-overlapped portion, wherein eac…
Electricity · mapped topic
Chemistry & Metallurgy · mapped topic
Operations & Transport · mapped topic
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