Dielectric heating of foamable compositions

Patent metadata

Field	Value
Publication number	US-12584040-B2
Application number	US-202117219224-A
Country	US
Kind code	B2
Filing date	Mar 31, 2021
Priority date	Jul 18, 2017
Publication date	Mar 24, 2026
Grant date	Mar 24, 2026

Abstract

Microspheres refer to micro-particle dispersion systems formed by pharmaceutical molecules dispersed or adsorbed in polymer carriers such as albumin, gelatin and polylactide; and their particle sizes are different from microns to hundreds of microns.

First claim

The invention claimed is:

1 . An article produced by the process comprising:
a. providing a first substrate; b. providing a second substrate; c. applying a composition in an uncoalesced state between the first substrate and the second substrate, wherein the composition comprises an (i) emulsion polymer having an initial water content of from about 35 wt % to 60 wt %, and (ii) and a plurality of expandable microspheres configured to expand at a temperature from an initial expansion temperature Texp of from about 80° C. to about 105° C. to a maximum expansion temperature of Tmax of from about 90° C. to about 140° C.; d. heating the composition for less than 1 minute using dielectric heating to expand the composition from a pre-expansion thickness to a post-expansion thickness that is from 77% to 81% greater than the pre-expansion thickness to form a foamed composition; and e. applying an adhesive between the first and the second substrate before, concurrently, or after the composition is applied between the first substrate and the second substrate; and wherein the foamed composition has from 0% to 15% of not expanded composition following the heating step, wherein the article has less than 10% wrinkles on a total surface area of the article, and wherein at least one of the first substrate or the second substrate is a fiberboard, a corrugated board, a solid bleached board, kraft paper, or coated paper.

2 . The article of claim 1 , wherein the emulsion polymer is selected from the group consisting of starch, vinyl acetate ethylene dispersion, polyvinyl acetate, polyvinyl acetate polyvinyl alcohol, dextrin stabilized polyvinyl acetate, polyvinyl acetate copolymers, vinyl acetate-ethylene copolymers, vinylacrylic, styrene acrylic, acrylic, styrene butyl rubber, polyurethane, and mixtures thereof.

3 . The article of claim 1 , wherein each of the plurality of expandable microspheres has a hydrocarbon core and a polyacrylonitrile shell.

4 . The article of claim 1 , wherein the composition further comprises an additive selected from the group consisting of a defoamer, a preservative, a surfactant, a rheology modifier, a filler, a pigment, a dye, a stabilizer, polyvinyl alcohol, a humectant, and mixtures thereof.

5 . The article of claim 4 , wherein the additive is present in an amount of from about 0.05 wt % to about 15 wt %, based on a total weight of the pre-expansion composition.

6 . The article of claim 1 , wherein the composition further comprises a second plurality of expandable microspheres having a second expansion temperature Texp2 that is different from initial expansion temperature Texp and a second maximum expansion temperature of Tmax2 that is different from maximum expansion temperature of Tmax.

7 . The article of claim 1 , wherein the composition further comprises a coalescence agent.

8 . The article of claim 1 , wherein the composition is between the first substrate and the second substrate in a pattern that is a series of dots, stripes, waves, checkerboards, or polyhedron shapes that each have a substantially flat base.

9 . The article of claim 1 , wherein the article is a cup, a food container, a case, a carton, a bag, a box, a lid, an envelope, a wrap, or a clamshell.

10 . The article of claim 1 , wherein a post-expansion diameter of the plurality of expandable microspheres is from about 3 times to about 10 times a pre-expansion diameter of the plurality of expandable microspheres.

11 . The article of claim 10 , wherein the plurality of expandable microspheres have a pre-expansion diameter of from about 5 microns to about 30 microns.

12 . The article of claim 1 , wherein the adhesive is a hot melt adhesive, a pressure sensitive adhesive, a waterborne adhesive, or a solvent-based adhesive.

13 . The article of claim 1 , wherein each of the plurality of expandable microspheres has a blowing agent inside a plastic or a polymeric shell, wherein the blowing agent is configured to activate upon reaching the initial expansion temperature Texp.

14 . The article of claim 1 , wherein the dielectric heating is radio frequency heating conducted at a frequency of less than 300 MHz.

15 . The article of claim 1 , wherein, pre-expansion, the composition comprises the plurality of expandable microspheres in an amount of from about 30 to about 70 wt %, based on a total weight of the pre-expansion composition.

16 . The article of claim 1 , wherein the composition has little to no adhesive properties in the uncoalesced state.

17 . The article of claim 1 , wherein the pre-expansion thickness of the composition is 0.023 inches.

18 . The article of claim 1 , wherein the post-expansion thickness of the foamed composition is from 0.125 to 0.135 inches.

19 . The article of claim 1 , wherein the composition is heated for seven seconds.

Assignees

• Henkel IP & Holding GmbH
• Henkel Ag & Co Kgaa

Inventors

• Mcleod Bradley
• Kriegl Alexis
• Getty Kris
• Waski Daniel
• Huang Tianjian

Classifications

• D21H27/32

  with materials applied between the sheets (attaching together paper or cardboard sheets B31F5/00; adhesives C09J) · CPC title

• D21H25/06

  of impregnated or coated paper (D21H25/08 takes precedence) · CPC title

• D21H19/12

  applied as a solution using water as the only solvent, e.g. in the presence of acid or alkaline compounds · CPC title

• C09J2431/00

  Presence of polyvinyl acetate · CPC title

• C09J2423/04

  Presence of homo or copolymers of ethene · CPC title