Adhesive having structural integrity and insulative properties

Patent metadata

Field	Value
Publication number	US-9771499-B2
Application number	US-201314092110-A
Country	US
Kind code	B2
Filing date	Nov 27, 2013
Priority date	Sep 10, 2010
Publication date	Sep 26, 2017
Grant date	Sep 26, 2017

Abstract

An adhesive composition that provides improved structural integrity and insulative properties when applied to a substrate is provided. The adhesive composition includes an emulsion-based polymer, a plurality of microspheres; and optionally, water and plasticizer.

First claim

The invention claimed is:

1. An adhesive composition to decrease the basis weight of a substrate comprising:
(a) about 50 to about 70 weight percent of an emulsion polymer selected from the group consisting of vinyl acetate-ethylene copolymer, polyvinyl acetate-polyvinyl alcohol copolymer, dextrin-stabilized polyvinyl acetate copolymer, polyvinyl acetate copolymers, and mixtures thereof;
(b) about 0.1 to about 10 weight percent of a plurality of expandable microspheres that are expandable in the presence of heat and/or radiation; and
(c) water; and
wherein the total adhesive composition weight percent is calculated without component (c) water;
wherein the emulsion polymer has a solids level of from about 40 weight percent to about 60 weight percent, based on the emulsion polymer;
wherein the adhesive composition is a water-based resin emulsion.

2. The adhesive composition of claim 1 , wherein said expandable microspheres comprise polymeric microspheres have an initial expansion temperature (Texp) and a maximum expansion temperature (Tmax).

3. The adhesive composition of claim 1 , wherein said plurality of expandable microspheres are present in an amount of from about 0.5 weight percent to about 5 weight percent.

4. The adhesive composition of claim 1 , further comprising a plasticizer and/or a preservative.

5. The adhesive composition of claim 2 , wherein said expandable microspheres has a Texp of about 80° C. to about 90° C. and a (Tmax) about 120° C. to about 140° C.

6. The adhesive composition of claim 1 , wherein the adhesive further comprises a crosslinker, filler, pigment, dye, stabilizer, rheology modifier, polyvinyl alcohol, humectant and mixtures thereof.

7. The adhesive composition of claim 1 , wherein the adhesive further comprises an accelerator that is a multivalent water-soluble salt.

8. An expanded adhesive composition prepared by
(1) forming an unexpanded adhesive, which is a water-based resin emulsion comprising:
(a) about 50 to about 70 weight percent of an emulsion polymer, having a solids level of from about 40 to about 60 weight percent based on the emulsion polymer, selected from the group consisting of vinyl acetate-ethylene copolymer, polyvinyl acetate-polyvinyl alcohol copolymer, dextrin-stabilized polyvinyl acetate copolymer, polyvinyl acetate copolymers, and mixtures thereof
(b) about 0.1 to about 10 weight percent of a plurality of expandable microspheres; and
(c) water; and

wherein the total adhesive weight percent is calculated without component (c) water;
(2) expanding the expandable microspheres with heat and/or radiation; and
(3) drying the water from the water-based resin emulsion;
wherein the dry volume of the expanded adhesive composition is at least 400% greater than the dry volume of the unexpanded adhesive.

Assignees

• Henkel IP & Holding GmbH

Inventors

• Huang Tianjian
• Sandilla Robert
• Waski Daniel
• Thompson Kristina
• Meccia John

Classifications

• Y10T428/1376

  Foam or porous material containing · CPC title

• C09J2205/11

  Chemistry & Metallurgy · mapped topic

• B32B3/28

  characterised by a layer comprising a deformed thin sheet {, i.e. the layer having its entire thickness deformed out of the plane}, e.g. corrugated, crumpled (B32B29/08 takes precedence) · CPC title

• D21H27/36

  Films made from synthetic macromolecular compounds · CPC title

• C08L2205/025

  containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure · CPC title