Waterborne adhesives for reduced basis weight multilayer substrates and use thereof

US9657200B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9657200-B2
Application numberUS-201313826451-A
CountryUS
Kind codeB2
Filing dateMar 14, 2013
Priority dateSep 27, 2012
Publication dateMay 23, 2017
Grant dateMay 23, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

First claim

Opening claim text (preview).

The invention claimed is: 1. An article comprising a first substrate, a second substrate, and an adhesive interposed between the two substrates comprising: (a) an emulsion-based polymer selected from the group consisting of vinyl acetate ethylene dispersion, polyvinyl acetate, polyvinyl acetate polyvinyl alcohol, dextrin stabilized polyvinyl acetate, polyvinyl acetate copolymers, vinyl acetate-ethylene copolymers, styrene butyl rubber, polyurethane and mixtures thereof; (b) about a plurality of microspheres, wherein the microspheres have a volume of about 10 to about 40 V/V % in the adhesive; and (c) optionally, water, plasticizer, preservative; wherein the article has a substantially similar thermal insulation loss with about 26% decrease in substrate basis weight than an article without any microspheres; and wherein the article is a cup, food container, case, carton, bag, box, envelope, wrap or clamshell. 2. The article of claim 1 , wherein the thermal insulation loss is less than about 2° C. at 30 seconds and ¾ inch away from a heat source. 3. The article of claim 1 , wherein the basis weight of the substrates range from 2 to about 35 pounds per 1000 ft 2 . 4. The article of claim 1 , wherein the first and the second substrate are composed of fiberboard, corrugated board, solid bleached boards, kraft paper, coated paper or oriented polypropylene film. 5. The article of claim 4 wherein the first and the second substrate are kraft paper or coated paper. 6. The article of claim 4 wherein the boards and papers comprise a portion of recycled fiber. 7. The article of claim 1 , wherein the emulsion-based polymer is selected from the group consisting of vinyl acetate ethylene dispersion and polyvinyl acetate. 8. The article of claim 1 , wherein the plurality of microspheres are present in an amount of from about 0.5 wt % to about 5 wt %, based on the total weight of the adhesive. 9. The article of claim 1 , wherein the microspheres are expandable polymeric microspheres. 10. The article of claim 9 , wherein the microspheres have a temperature expansion (T exp ) of about 80° C. to about 135° C. 11. The article of claim 9 , wherein the microspheres have a maximum expansion temperature (T max ) of about 120° C. to about 200° C. 12. The article of claim 1 , wherein the microspheres are pre-expanded polymeric microspheres. 13. The article of claim 1 , wherein the adhesive further comprises a filler, pigment, dye, stabilizer, rheology modifier, polyvinyl alcohol, humectant or a mixture thereof.

Assignees

Inventors

Classifications

  • comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)} · CPC title

  • on synthetic resin layer or on natural or synthetic rubber layer · CPC title

  • Bags, sacks, sachets · CPC title

  • Resistant to heat · CPC title

  • Polyalkenyalcohols; Polyalkenylethers; Polyalkenylesters · CPC title

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Frequently asked questions

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What does patent US9657200B2 cover?
The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.
Who is the assignee on this patent?
Henkel IP & Holding GmbH
What technology area does this patent fall under?
Primary CPC classification B32B7/12. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 23 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).