Thin film resistor with viabar structure

Patent metadata

Field	Value
Publication number	US-12555705-B2
Application number	US-202418772320-A
Country	US
Kind code	B2
Filing date	Jul 15, 2024
Priority date	Jul 15, 2024
Publication date	Feb 17, 2026
Grant date	Feb 17, 2026

Abstract

A thin-film resistor (TFR) includes conductive line(s) and a resistive layer over the conductive line(s). The TFR also includes at least one viabar structure coupled to the resistive layer and including a first viabar portion electrically connected to the resistive layer at an edge thereof and a second viabar portion electrically connected to the conductive line(s). In other cases, a viabar structures partially land over the resistive layer and are electrically connected to an edge of the resistive layer and partially land on the conductive line(s). Among other advantages, the viabar structure reduces current crowding from tight contact spacing, and allows alternative routing of interconnects to the TFR.

First claim

What is claimed is:

1 . A thin-film resistor (TFR), comprising:
a first conductive line and a second conductive line; a resistive layer over the first conductive line and the second conductive line; a first viabar structure partially landed over the resistive layer and electrically connected to a first edge of the resistive layer and partially landed on the first conductive line; and a second viabar structure partially landed over the resistive layer and electrically connected to a second edge opposing the first edge of the resistive layer and partially landed on the second conductive line, wherein the second conductive line is coupled to a contact thereunder that is coupled to another conductive line under the contact.

2 . The TFR of claim 1 , further comprising a first etch stop layer over the first conductive line and under the resistive layer, and a second etch stop layer over the resistive layer.

3 . The TFR of claim 2 , wherein the first viabar structure and the second viabar structure each include a viabar portion extending through the first etch stop layer to couple to the first conductive line and the second conductive line, respectively.

4 . The TFR of claim 1 , further comprising a tertiary conductive line coupled to an upper end of the second viabar structure, the tertiary conductive line coupled to a third viabar structure coupled to at least an additional conductive line.

5 . The TFR of claim 1 , wherein the first conductive line and the second conductive line are in a first dielectric layer, and further comprising a heat sink in the first dielectric layer under the resistive layer.

6 . The TFR of claim 4 , wherein the additional conductive line is coupled to a contact thereunder, and the contact is coupled to the another conductive line under the contact.

7 . A thin-film resistor (TFR), comprising:
a first conductive line in a first dielectric layer; a resistive layer over the first conductive line; at least one viabar structure coupled to the resistive layer and including a first viabar portion electrically connected to the resistive layer at a first edge thereof and a second viabar portion electrically connected to the first conductive line; a heat sink in the first dielectric layer under the resistive layer; and a second conductive line separate from the first conductive line, and wherein the second conductive line is coupled to the second viabar portion and is under a second edge opposing the first edge of the resistive layer.

8 . The TFR of claim 7 , further comprising a first etch stop layer over the first conductive line and under the resistive layer, and a second etch stop layer over the resistive layer.

9 . The TFR of claim 7 , further comprising a third viabar structure adjacent to and coupled to the at least one viabar structure, the third viabar structure coupled to an additional conductive line in a same metal layer as the first conductive line.

10 . The TFR of claim 9 , wherein the additional conductive line is coupled to a contact thereunder, and the contact is coupled to another conductive line under the contact.

11 . The TFR of claim 7 , wherein the first viabar portion includes a vertical sidewall of the at least one viabar structure.

12 . A thin-film resistor (TFR), comprising:
a first conductive line and a second conductive line; a resistive layer over the first conductive line and the second conductive line; a first viabar structure partially landed over the resistive layer and electrically connected to a first edge of the resistive layer and partially landed on the first conductive line; a second viabar structure partially landed over the resistive layer and electrically connected to a second edge opposing the first edge of the resistive layer and partially landed on the second conductive line; and a tertiary conductive line coupled to an upper end of the second viabar structure, the tertiary conductive line coupled to a third viabar structure coupled to at least an additional conductive line in a same metal layer as the first conductive line.

13 . The TFR of claim 12 , wherein the additional conductive line is coupled to a contact thereunder, and the contact is coupled to another conductive line under the contact.

14 . The TFR of claim 12 , wherein the first conductive line and the second conductive line are in a first dielectric layer, and further comprising a heat sink in the first dielectric layer under the resistive layer.

15 . The TFR of claim 12 , further comprising a first etch stop layer over the first conductive line and under the resistive layer, and a second etch stop layer over the resistive layer.

16 . The TFR of claim 15 , wherein the first viabar structure extends through the first etch stop layer to couple to the first conductive line.

17 . The TFR of claim 12 , wherein the second conductive line is coupled to a contact thereunder that is coupled to another conductive line under the contact.

18 . The TFR of claim 12 , wherein the first viabar structure includes a vertical sidewall.

Assignees

• Globalfoundries Sg Pte Ltd

Inventors

• Khor Eejan
• Yi Wanbing
• Wong Qiying
• He Feifei

Classifications

• H01C17/075

  by thin-film techniques · CPC title

• H01C1/084

  using self-cooling, e.g. fins, heat sinks · CPC title

• H10W20/42

  Vias, e.g. via plugs · CPC title

• H10W20/498

  Resistive arrangements or effects of, or between, wiring layers · CPC title

• H10W40/778

  in encapsulations · CPC title