Method for manufacturing semiconductor device, method for manufacturing film material for temporary fixing, and film material for temporary fixing

Patent metadata

Field	Value
Publication number	US-12538751-B2
Application number	US-202118246854-A
Country	US
Kind code	B2
Filing date	Sep 29, 2021
Priority date	Oct 2, 2020
Publication date	Jan 27, 2026
Grant date	Jan 27, 2026

Abstract

A method for manufacturing a semiconductor device, the method including irradiating a laminated body for temporary fixing with light and thereby separating the semiconductor member from a resin layer for temporary fixing. The laminated body for temporary fixing is formed by a method including: laminating a film material for temporary fixing on a light-absorbing layer in a direction in which a first principal surface is in contact with the light-absorbing layer; and peeling off a second release film from the film material for temporary fixing to expose a second principal surface. When the maximum values of logarithmic decrements of the first principal surface and the second principal surface of the resin layer for temporary fixing in rigid pendulum measurement are designated as δ max 1 and δ max 2, respectively, δ max 2 is smaller than δ max 1.

First claim

The invention claimed is:

1 . A method for manufacturing a semiconductor device, the method comprising:
forming a laminated body for temporary fixing, the laminated body including a support substrate having a support surface and a back surface on an opposite side thereof, a light-absorbing layer, and a resin layer for temporary fixing having a first principal surface and a second principal surface on an opposite side thereof, the light-absorbing layer and the resin layer for temporary fixing being laminated in this order on the support surface; temporarily fixing a semiconductor member on the resin layer for temporary fixing by curing the resin layer for temporary fixing; and separating the semiconductor member from the resin layer for temporary fixing by:
irradiating the laminated body for temporary fixing with light from the back surface side; and
peeling off the resin layer for temporary fixing from the semiconductor member after irradiating the laminated body,
wherein the laminated body for temporary fixing is formed by:
preparing a film material for temporary fixing having the resin layer for temporary fixing, a first release film, and a second release film, the first release film, the resin layer for temporary fixing, and the second release film being laminated in this order so that the first release film is in contact with the first principal surface of the resin layer for temporary fixing, and the second release film is in contact with the second principal surface of the resin layer for temporary fixing;
peeling off the first release film from the film material for temporary fixing, and laminating the film material for temporary fixing on the light-absorbing layer provided on the support surface so that the exposed first principal surface of the resin layer for temporary fixing is in contact with the light-absorbing layer; and
peeling off the second release film from the film material for temporary fixing and exposing the second principal surface of the resin layer for temporary fixing,
wherein maximum values of logarithmic decrements of the first principal surface and the second principal surface of the resin layer for temporary fixing in rigid pendulum measurement are respectively designated as δ max 1 and δ max 2, and δ max 2 is smaller than δ max 1, and wherein the logarithmic decrements are measured over a temperature range below a curing temperature of the resin layer for temporary fixing.

2 . The method according to claim 1 , wherein the laminated body for temporary fixing is irradiated with light from the back surface side to separate the resin layer for temporary fixing from the light-absorbing layer.

3 . The method according to claim 1 , wherein the method further includes processing the semiconductor member temporarily fixed onto the resin layer for temporary fixing.

4 . The method according to claim 1 , wherein the method further includes: forming a sealing layer sealing the semiconductor member on the resin layer for temporary fixing; and thereby forming a sealing structural body having the semiconductor member and the sealing layer.

5 . The method according to claim 1 , wherein preparing the film material for temporary fixing comprises:
applying a resin varnish including a solvent on the first release film to form a film of the resin varnish and subsequently removing the solvent from the film to form the resin layer for temporary fixing having the first principal surface that is in contact with the first release film and the second principal surface on the opposite side thereof, on the first release film; and sticking the second release film to the second principal surface of the resin layer for temporary fixing, wherein a peel strength of a surface of the first release film, the surface being in contact with the resin layer for temporary fixing, is smaller than a peel strength of a surface of the second release film, the surface being in contact with the resin layer for temporary fixing.

6 . The method according to claim 5 , wherein the solvent is a mixed solvent including two or more kinds of solvents.

7 . The method according to claim 1 , wherein the temperature range that the logarithmic decrements are measured over is from 25° C. to 150° C.

8 . The method according to claim 7 , wherein the curing temperature of the resin layer for temporary fixing is from 180° C. to 300° C.

9 . The method according to claim 1 , wherein the maximum values of logarithmic decrements reflect a degree of viscosity of the first principal surface and the second principal surface of the resin layer for temporary fixing, and
wherein the second principal surface has a lower viscosity than the first principal surface in the temperature range.

Assignees

• Resonac Corp

Inventors

• Oyama Yasuyuki
• Miyazawa Emi
• AKASU Yuta
• Furutani Ryoji

Classifications

• H01L2221/68386

  Electricity · mapped topic

• C09J2467/005

  in the release coating · CPC title

• C09J2453/00

  Presence of block copolymer · CPC title

• H01L21/568

  Electricity · mapped topic

• C09J7/405

  characterised by the substrate of the release liner · CPC title