Film for temporary fixation, layered product for temporary fixation, and method for producing semiconductor device
US-12581907-B2 · Mar 17, 2026 · US
This page is not indexed by search engines while we improve data quality.
AKASU Yuta patents
AKASU Yuta is listed as an inventor on 17 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | AKASU Yuta |
| Total patents | 17 |
| First publication | Sep 6, 2018 |
| Latest publication | Mar 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Temporary fixation layered film and production method therefor, temporary fixation layered body, and semiconductor device production method
US-12543538-B2 · Feb 3, 2026 · US
Method for manufacturing semiconductor device, method for manufacturing film material for temporary fixing, and film material for temporary fixing
US-12538751-B2 · Jan 27, 2026 · US
Film for temporary fixation, layered product for temporary fixation, and method for producing semiconductor device
US-2025273502-A1 · Aug 28, 2025 · US
Film for temporary fixing, laminate for temporary fixing, method for manufacturing semiconductor device, composition for temporary fixing
US-2025253181-A1 · Aug 7, 2025 · US
Semiconductor device manufacturing method
US-2025046626-A1 · Feb 6, 2025 · US
Semiconductor device manufacturing method
US-12165882-B2 · Dec 10, 2024 · US
Method for manufacturing semiconductor device, method for manufacturing film material for temporary fixing, and film material for temporary fixing
US-2023369093-A1 · Nov 16, 2023 · US
Film for temporary fixation, layered product for temporary fixation, and method for producing semiconductor device
US-2023360947-A1 · Nov 9, 2023 · US
Barrier material formation composition, barrier material, production method for barrier material, product, and production method for product
US-11713375-B2 · Aug 1, 2023 · US
Recent patents
Latest publications not already listed above.
Temporary fixation layered film and production method therefor, temporary fixation layered body, and semiconductor device production method
US-2023207374-A1 · Jun 29, 2023 · US
Semiconductor device manufacturing method
US-2022319872-A1 · Oct 6, 2022 · US
Aerogel laminated composite and thermal insulation material
US-10821705-B2 · Nov 3, 2020 · US
Member with aerogel layer
US-2020299480-A1 · Sep 24, 2020 · US
Barrier material formation composition, barrier material, production method for barrier material, product, and production method for product
US-2020291189-A1 · Sep 17, 2020 · US
Method for manufacturing thermally insulated body, and thermally insulated body
US-2018327609-A1 · Nov 15, 2018 · US
Aerogel laminated composite and thermal insulation material
US-2018250913-A1 · Sep 6, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Resonac Corp | 10 |
| Hitachi Chemical Co Ltd | 6 |
| Showa Denko Materials Co Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/744 | 10 |
| H10P72/7412 | 10 |
| C09J2203/326 | 9 |
| H10W74/019 | 9 |
| H10P72/74 | 9 |