Wafer dicing from wafer backside and front side
US-9224650-B2 · Dec 29, 2015 · US
Operations & Transport
Operations & Transport · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K26/40 |
| Official title | — |
| Display label | Operations & Transport (mapped technology topic) |
| Total patents | 1,432 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 201 |
| 2016 | 171 |
| 2017 | 125 |
| 2018 | 95 |
| 2019 | 140 |
| 2020 | 129 |
| 2021 | 120 |
| 2022 | 128 |
| 2023 | 105 |
| 2024 | 113 |
| 2025 | 90 |
| 2026 | 15 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method and Apparatus for Laser Cutting Transparent and Semitransparent Substrates
US-2015367442-A1 · Dec 24, 2015 · US
Layer-selective laser ablation patterning
US-9209400-B2 · Dec 8, 2015 · US
Laser processing method and laser processing apparatus
US-9193008-B2 · Nov 24, 2015 · US
Spalling with laser-defined spall edge regions
US-2015325443-A1 · Nov 12, 2015 · US
Substrate cutting apparatus and method for cutting substrate using the same
US-9174307-B2 · Nov 3, 2015 · US
Laser fusion-cutting method for plate glass
US-2015307386-A1 · Oct 29, 2015 · US
Laminated material and method of production thereof
US-9169054-B2 · Oct 27, 2015 · US
Assist gas generation apparatus for laser processing machine
US-2015273387-A1 · Oct 1, 2015 · US
Fiber laser processing machine, fiber connection method and fiber laser oscillator
US-2015266134-A1 · Sep 24, 2015 · US
Rfid transponder chip modules
US-2015269472-A1 · Sep 24, 2015 · US
Laser Surgical Apparatus and Methods of its Use Minimizing Damage During the Ablation of Tissue Using a Focused Ultrashort Pulsed Laser Beam Wherein the Slope of Fluence Breakdown is a Function of the Pulse Width
US-2015265351-A1 · Sep 24, 2015 · US
Transparent material processing with an ultrashort pulse laser
US-9138913-B2 · Sep 22, 2015 · US
Laser and plasma etch wafer dicing using physically-removable mask
US-9126285-B2 · Sep 8, 2015 · US
Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch
US-9129904-B2 · Sep 8, 2015 · US
Wafer processing method
US-9130031-B2 · Sep 8, 2015 · US
Spectacle lens and method and apparatus for making the same
US-9122073-B2 · Sep 1, 2015 · US
Singulation of layered materials using selectively variable laser output
US-9120181-B2 · Sep 1, 2015 · US
Method and System for Manufacturing a Grinding Tool
US-2015239096-A1 · Aug 27, 2015 · US
Laser cutting of display glass compositions
US-2015232369-A1 · Aug 20, 2015 · US
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K26/40?
- CPC B23K26/40 is the Cooperative Patent Classification code for “Operations & Transport.”
- How many patents are filed under CPC B23K26/40 (Operations & Transport)?
- Our database includes 1,432 publications tagged with this CPC code.
- Is patent activity under CPC B23K26/40 growing?
- Publication counts under this code: 113 in 2024 vs 90 in 2025 (latest complete years).