Magnetic wiring circuit board and producing method thereof
US-2021249171-A1 · Aug 12, 2021 · US
US12518909B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12518909-B2 |
| Application number | US-202217654994-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 15, 2022 |
| Priority date | Mar 30, 2021 |
| Publication date | Jan 6, 2026 |
| Grant date | Jan 6, 2026 |
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An inductor conductor is configured such that, with respect to a height-wise dimension of the inductor conductor between the top surface and the bottom surface thereof, the height-wise dimension of a central portion of the top surface is smaller than the height-wise dimension of an edge portion of the top surface at a cross section of the inductor conductor taken in a direction orthogonal to an extending direction of the inductor conductor.
Opening claim text (preview).
What is claimed is: 1 . A coil component comprising: at least one inductor conductor having a top surface and a bottom surface that are positioned opposite to each other and a first side surface and a second side surface that are positioned opposite to each other and connect the top surface and the bottom surface; and a resin-containing layer that at least covers the top surface, the first side surface, and the second side surface of the inductor conductor, wherein with respect to a height-wise dimension of the inductor conductor between the top surface and the bottom surface, the height-wise dimension of a central portion of the top surface is smaller than the height-wise dimension of an edge portion of the top surface at a cross section of the inductor conductor taken in a direction orthogonal to an extending direction of the inductor conductor, and in the height-wise dimension of the inductor conductor, a difference between a maximum dimension and a minimum dimension is 20% or less of the maximum dimension at a cross section of the inductor conductor taken in a direction orthogonal to the extending direction of the inductor conductor. 2 . The coil component according to claim 1 , wherein the resin-containing layer includes an insulating resin layer that is an electrical insulator and a non-magnetic body. 3 . The coil component according to claim 2 , wherein the coil component includes a plurality of the inductor conductors, and the plurality of the inductor conductors is configured such that with respect to the height-wise dimension of each conductor inductor, the height-wise dimension of the central portion of the top surface is smaller than the height-wise dimensions of both edge portions of the top surface at a cross section of each of the inductor conductors taken in a direction orthogonal to an extending direction of the each of the inductor conductors. 4 . The coil component according to claim 2 , wherein, the resin-containing layer integrally configures a portion covering the top surface and portions covering the first side surface and the second side surface. 5 . The coil component according to claim 1 , wherein the resin-containing layer includes a magnetic resin layer made of an organic material containing a metal-based magnetic powder. 6 . The coil component according to claim 5 , wherein the coil component includes a plurality of the inductor conductors, and the plurality of the inductor conductors is configured such that with respect to the height-wise dimension of each conductor inductor, the height-wise dimension of the central portion of the top surface is smaller than the height-wise dimensions of both edge portions of the top surface at a cross section of each of the inductor conductors taken in a direction orthogonal to an extending direction of the each of the inductor conductors. 7 . The coil component according to claim 5 , wherein, the resin-containing layer integrally configures a portion covering the top surface and portions covering the first side surface and the second side surface. 8 . The coil component according to claim 1 , wherein the resin-containing layer includes an insulating resin layer that is an electrical insulator and a non-magnetic body and is in contact with the inductor conductor, and a magnetic resin layer that is made of an organic material containing a metal-based magnetic powder and that covers the insulating resin layer. 9 . The coil component according to claim 1 , wherein the coil component includes a plurality of the inductor conductors, and the plurality of the inductor conductors is configured such that with respect to the height-wise dimension of each conductor inductor, the height-wise dimension of the central portion of the top surface is smaller than the height-wise dimensions of both edge portions of the top surface at a cross section of each of the inductor conductors taken in a direction orthogonal to an extending direction of the each of the inductor conductors. 10 . The coil component according to claim 1 , wherein, the resin-containing layer integrally configures a portion covering the top surface and portions covering the first side surface and the second side surface. 11 . A method of manufacturing a coil component, the method comprising: preparing a support substrate; forming an inductor conductor when supported by the support substrate, the inductor conductor has a top surface and a bottom surface that are positioned opposite to each other and a first side surface and a second side surface that are positioned opposite to each other and connect the top surface and the bottom surface; forming a resin-containing layer that at least covers the top surface, the first side surface, and the second side surface of the inductor conductor; and removing the support substrate, wherein in the forming of the inductor conductor, with respect to a height-wise dimension of the inductor conductor between the top surface and the bottom surface, the height-wise dimension of a central portion of the top surface is made smaller than the height-wise dimension of an edge portion of the top surface at a cross section of the inductor conductor taken in a direction orthogonal to an extending direction of the inductor conductor, and in the height-wise dimension of the inductor conductor, a difference between a maximum dimension and a minimum dimension is 20% or less of the maximum dimension at a cross section of the inductor conductor taken in a direction orthogonal to the extending direction of the inductor conductor. 12 . The method of manufacturing the coil component according to claim 11 , the method further comprising: forming a conductive seed layer on the support substrate; and forming a resist on the seed layer, the resist having a cavity that is patterned so as to correspond to a pattern of the inductor conductor to be formed, wherein the forming the inductor conductor includes forming the inductor conductor by electrolytic plating on the seed layer through the cavity of the resist, and the method further comprises removing the resist. 13 . The method of manufacturing the coil component according to claim 12 , wherein the forming the inductor conductor by electrolytic plating includes adjusting additive concentration in a plating bath used for electrolytic plating. 14 . The method of manufacturing the coil component according to claim 13 , wherein the adjusting additive concentration includes increasing a concentration of a leveler additive and of decreasing a concentration of a brightener additive. 15 . The method of manufacturing the coil component according to claim 12 , wherein in the forming of the inductor conductor by electrolytic plating, the seed layer is a seed layer of which a portion corresponding to an edge portion of the top surface of the inductor conductor bulge out relative to a portion corresponding to a central portion of the top surface. 16 . The method of manufacturing the coil component according to claim 12 , wherein the forming the inductor conductor by electrolytic plating includes creating a flow of a plating solution in a plating bath used for electrolytic plating in a direction orthogonal to an extending direction of the inductor conductor to be formed. 17 . The method of manufacturing the coil component according to claim 12 , in the forming of the inductor conductor by electrolytic plating, the seed layer is made narrower than a width of the cavity of the resist and is formed at a position closer to on
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