Encapsulating or impregnating (encapsulating coil and core H01F27/022)

Encapsulating or impregnating (encapsulating coil and core H01F27/022) · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH01F27/327
Official title{Encapsulating or impregnating (encapsulating coil and core H01F27/022)}
Display labelEncapsulating or impregnating (encapsulating coil and core H01F27/022)
Total patents650

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is declining.

Patents filed per year
YearPatents
201517
201624
201731
201849
201978
202084
202197
202267
202377
202468
202546
202612

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H01F27/327?
CPC H01F27/327 is the Cooperative Patent Classification code for “Encapsulating or impregnating (encapsulating coil and core H01F27/022).”
How many patents are filed under CPC H01F27/327 (Encapsulating or impregnating (encapsulating coil and core H01F27/022))?
Our database includes 650 publications tagged with this CPC code.
Is patent activity under CPC H01F27/327 growing?
Publication counts under this code: 68 in 2024 vs 46 in 2025 (latest complete years).