Encapsulating or impregnating (encapsulating coil and core H01F41/005)

Encapsulating or impregnating (encapsulating coil and core H01F41/005) · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH01F41/127
Official title{Encapsulating or impregnating (encapsulating coil and core H01F41/005)}
Display labelEncapsulating or impregnating (encapsulating coil and core H01F41/005)
Total patents281

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is declining.

Patents filed per year
YearPatents
201515
201613
201718
201818
201934
202039
202132
202227
202333
202426
202520
20266

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H01F41/127?
CPC H01F41/127 is the Cooperative Patent Classification code for “Encapsulating or impregnating (encapsulating coil and core H01F41/005).”
How many patents are filed under CPC H01F41/127 (Encapsulating or impregnating (encapsulating coil and core H01F41/005))?
Our database includes 281 publications tagged with this CPC code.
Is patent activity under CPC H01F41/127 growing?
Publication counts under this code: 26 in 2024 vs 20 in 2025 (latest complete years).