Photosensitive paste, method for forming wiring pattern, method for producing electronic component, and electronic component
US-2024085787-A1 · Mar 14, 2024 · US
by thick film techniques · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01F41/043 |
| Official title | {by thick film techniques} |
| Display label | by thick film techniques |
| Total patents | 455 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 12 |
| 2016 | 12 |
| 2017 | 19 |
| 2018 | 37 |
| 2019 | 49 |
| 2020 | 44 |
| 2021 | 58 |
| 2022 | 50 |
| 2023 | 64 |
| 2024 | 60 |
| 2025 | 42 |
| 2026 | 8 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2024085787-A1 · Mar 14, 2024 · US
US-2018330870-A1 · Nov 15, 2018 · US
US-2018310408-A1 · Oct 25, 2018 · US
US-10102961-B2 · Oct 16, 2018 · US
US-2018254145-A1 · Sep 6, 2018 · US
US-2018247763-A1 · Aug 30, 2018 · US
US-2018218822-A1 · Aug 2, 2018 · US
US-2018204672-A1 · Jul 19, 2018 · US
US-2018174748-A1 · Jun 21, 2018 · US
US-2018122555-A1 · May 3, 2018 · US
US-2018122560-A1 · May 3, 2018 · US
US-2018122554-A1 · May 3, 2018 · US
US-2018096789-A1 · Apr 5, 2018 · US
US-9929229-B2 · Mar 27, 2018 · US
US-2018054900-A1 · Feb 22, 2018 · US
US-9899136-B2 · Feb 20, 2018 · US
US-2018012696-A1 · Jan 11, 2018 · US
US-2017345552-A1 · Nov 30, 2017 · US
US-2017330674-A1 · Nov 16, 2017 · US
US-2017330673-A1 · Nov 16, 2017 · US
Answers are generated from the same data shown on this page.