Printed circuit board assembly including conductive heat transfer

Patent metadata

Field	Value
Publication number	US-9818669-B2
Application number	US-201414453333-A
Country	US
Kind code	B2
Filing date	Aug 6, 2014
Priority date	Aug 6, 2014
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

A printed circuit board assembly (PCBA) may include a printed circuit board (PCB), a socket mechanically and electrically coupled to the PCB, and an integrated circuit package electrically coupled to the socket. The PCBA also may include a thermal cover comprising a thermally conductive material and a thermal strap thermally coupled to the thermal cover. The thermal cover may be thermally coupled to the integrated circuit package and mechanically urge the integrated circuit package in contact with the socket, and the thermal strap may include a thermally conductive material.

First claim

What is claimed is:

1. A system comprising:
a chassis comprising a card guide;
a printed circuit board assembly (PCBA);
a circuit card assembly clamping mechanism mechanically coupled to the PCBA, wherein the circuit card assembly clamping mechanism restrains the PCBA relative to the card guide, and wherein the PCBA comprises:
a printed circuit board (PCB);
a socket mechanically and electrically coupled to the PCB;
an integrated circuit package electrically coupled to the socket;
a thermal cover comprising a thermally conductive material, wherein the thermal cover is thermally coupled to the integrated circuit package and mechanically urges the integrated circuit package in contact with the socket; and
a flexible thermal strap thermally coupled between the thermal cover and the circuit card assembly clamping mechanism, wherein the flexible thermal strap comprises a thermally conductive material.

2. The system of claim 1 , wherein the integrated circuit package comprises at least one of a land grid array (LGA) package or a ball grid array (BGA) package, wherein the at least one of the LGA package or the BGA package comprises a substrate, an integrated circuit, and a package cover, and wherein the thermal cover is thermally coupled to the package cover.

3. The system of claim 1 , wherein the thermal cover comprises at least one of a copper alloy, an aluminum alloy, a thermally conductive composite material, or a thermally conductive ceramic material.

4. The system of claim 1 , wherein the flexible thermal strap comprises at least one of copper, a copper alloy, or a thermally conductive composite material.

5. The system of claim 1 , wherein the flexible thermal strap is further mechanically and thermally coupled to at least one of a heat sink or the chassis.

6. The system of claim 1 , wherein the socket is mechanically and electrically coupled to a first side of the PCB, further comprising a mounting bracket on a second, opposite side of the PCB, wherein the thermal cover is mechanically coupled to the mounting bracket and urges the integrated circuit package in contact with the socket.

7. A method comprising:
assembling an integrated circuit package with a socket, wherein the socket is electrically coupled to a printed circuit board (PCB) of a printed circuit board assembly (PCBA); and
thermally coupling a thermal cover to the integrated circuit package, wherein the thermal cover mechanically urges the integrated circuit package in contact with the socket; and
thermally coupling a thermal strap between the thermal cover and a circuit card assembly clamping mechanism that is mechanically coupled to the PCBA wherein the flexible thermal strap comprises a thermally conductive material,
restraining the printed circuit board assembly relative to a card guide with the circuit card assembly clamping mechanism, wherein a chassis includes the card guide.

8. The method of claim 7 , further comprising:
thermally coupling the flexible thermal strap to the PCB.

9. The method of claim 8 , wherein thermally coupling the flexible thermal strap to the PCB comprises clamping a portion of the flexible thermal strap between the circuit card assembly clamping mechanism and the PCB.

10. The method of claim 7 , further comprising:
mechanically and thermally coupling the flexible thermal strap to the chassis.

11. The method of claim 7 , wherein the integrated circuit package comprises at least one of a land grid array (LGA) package or a ball grid array (BGA) package, wherein the at least one of the LGA package or the BGA package comprises a substrate, an integrated circuit, and a package cover, and wherein thermally coupling the thermal cover to the integrated circuit package comprises thermally coupling the thermal cover to the package cover.

12. The PCBA of claim 7 , wherein the thermal cover comprises at least one of a copper alloy, an aluminum alloy, a thermally conductive composite material, or a thermally conductive ceramic, and wherein the flexible thermal strap comprises at least one of copper, a copper alloy, or a thermally conductive composite material.

Assignees

• Honeywell Int Inc

Inventors

• Jones Kirk
• Kreider Thom
• Jackson Larry

Classifications

• H10W76/60

  Seals · CPC title

• H10W40/259

  Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/231

  characterised by their places of attachment or cooling paths · CPC title

• H10W95/00

  Packaging processes not covered by the other groups of this subclass · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title