Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-12500110-B2
Application number	US-202318199242-A
Country	US
Kind code	B2
Filing date	May 18, 2023
Priority date	May 23, 2022
Publication date	Dec 16, 2025
Grant date	Dec 16, 2025

Abstract

Provided is a substrate processing apparatus. The substrate processing apparatus includes a support plate configured to support a substrate, a base plate under the support plate, a thermal insulation layer between the support plate and the base plate, and a bonder bonding the base plate and the thermal insulation layer to each other, wherein the thermal insulation layer is brought into tight contact with a lower end surface of the support plate by using a bolt.

First claim

What is claimed is:

1 . A substrate processing apparatus comprising:
a support plate configured to support a substrate; a base plate under the support plate; a thermal insulation layer between the support plate and the base plate; and a bonder bonding the base plate and the thermal insulation layer to each other, wherein the thermal insulation layer is brought into tight contact with a lower end surface of the support plate by using a bolt, wherein a tube comprising an internal thread is brazed to a lower end of the support plate, and the bolt is fastened to the tube, wherein the tube extends from a recess of the support plate to a lower surface of the base plate, wherein the tube has threads provided on the inside of the tube, and wherein the bonder is an organic bonder including silicon.

2 . The substrate processing apparatus of claim 1 , wherein the support plate comprises a DC electrode configured to fix the substrate supported on an upper end of the support plate by using electrostatic force.

3 . The substrate processing apparatus of claim 1 , wherein the support plate comprises a radio frequency (RF) layer configured to form an electromagnetic field by receiving power from an RF power source.

4 . The substrate processing apparatus of claim 1 , wherein the support plate comprises a ceramic material.

5 . The substrate processing apparatus of claim 1 , wherein the support plate comprises at least one gas supply hole to supply a temperature control gas through the at least one gas supply hole, and
the at least one gas supply hole is horizontally surrounded by a dam.

6 . The substrate processing apparatus of claim 1 , wherein at least one suction hole is formed in an upper end of the thermal insulation layer to fix the support plate by vacuum suction,
wherein the substrate processing apparatus further comprises a vacuum pump communicating with the at least one suction hole to form a vacuum pressure in the at least one suction hole.

7 . A substrate processing apparatus comprising:
a support plate configured to support a substrate; a base plate under the support plate; a thermal insulation layer between the support plate and the base plate; and a bonder bonding the base plate and the thermal insulation layer to each other, wherein the thermal insulation layer is brought into tight contact with the support plate by using a bolt, and the support plate comprises a plurality of heating electrodes that are laterally arranged, wherein a tube comprising an internal thread is brazed to a lower end of the support plate, and the bolt is fastened to the tube, wherein the tube extends from a recess of the support plate to a lower surface of the base plate, wherein the tube has threads provided on the inside of the tube, and wherein the bonder is an organic bonder including silicon.

8 . The substrate processing apparatus of claim 7 , wherein the support plate further comprises a DC electrode configured to fix the substrate supported on an upper end of the support plate by using electrostatic force.

9 . The substrate processing apparatus of claim 7 , wherein the support plate further comprises a radio frequency (RF) layer configured to form an electromagnetic field by receiving power from an RF power source.

10 . The substrate processing apparatus of claim 7 , wherein the support plate further comprises a ceramic material.

11 . The substrate processing apparatus of claim 7 , wherein the support plate further comprises at least one gas supply hole to supply a temperature control gas through the at least one gas supply hole, and
the at least one gas supply hole is horizontally surrounded by a dam.

12 . The substrate processing apparatus of claim 7 , wherein at least one suction hole is formed in an upper end of the thermal insulation layer to fix the support plate by vacuum suction,
wherein the substrate processing apparatus further comprises a vacuum pump communicating with the at least one suction hole to form a vacuum pressure in the at least one suction hole.

13 . A substrate processing device comprising:
a support plate configured to support a substrate; a base plate under the support plate, the base plate including a threaded hole formed therein; a thermal insulation layer between the support plate and the base plate, the thermal insulation layer including a threaded hole formed therein; a bonder bonding the base plate and the thermal insulation layer to each other; and a mechanical joint layer brazed to a lower end surface of the support plate, the mechanical joint layer including a threaded hole formed therein, wherein the thermal insulation layer is brought into tight contact with a lower end surface of the mechanical joint layer by using a bolt coupled with the threaded hole in each of the base plate, the thermal insulation layer, and the mechanical joint layer, wherein the bonder is an organic bonder including silicon.

14 . The substrate processing device of claim 13 , wherein the support plate comprises a DC electrode configured to fix the substrate supported on an upper end of the support plate by using electrostatic force.

15 . The substrate processing device of claim 13 , wherein the support plate comprises a radio frequency (RF) layer configured to form an electromagnetic field by receiving power from an RF power source.

16 . The substrate processing device of claim 13 , wherein the support plate comprises a ceramic material.

17 . The substrate processing device of claim 13 , wherein the support plate comprises at least one gas supply hole to supply a temperature control gas through the at least one gas supply hole, and
the at least one gas supply hole is horizontally surrounded by a dam.

18 . The substrate processing device of claim 13 , wherein at least one suction hole is formed in an upper end of the thermal insulation layer to fix the support plate by vacuum suction,
wherein the substrate processing apparatus further comprises a vacuum pump communicating with the at least one suction hole to form a vacuum pressure in the at least one suction hole.

Assignees

• Semes Co Ltd

Inventors

• Park Junseok
• Jung Chulho
• Jeon Jongjoon

Classifications

• H10P72/78 Primary

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H10P72/7624 Primary

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/7611

  characterised by edge profile or support profile · CPC title

• H10P72/72

  using electrostatic chucks · CPC title