Electrostatic chuck assembly and substrate processing apparatus including the same

Patent metadata

Field	Value
Publication number	US-10497597-B2
Application number	US-201715469620-A
Country	US
Kind code	B2
Filing date	Mar 27, 2017
Priority date	Aug 18, 2016
Publication date	Dec 3, 2019
Grant date	Dec 3, 2019

Abstract

Disclosed are an electrostatic chuck assembly and a substrate processing apparatus including the same. The substrate processing apparatus comprises a process chamber including an inner space therein, a gas supply unit supplying a process gas into the process chamber, a top electrode section in the process chamber and generating plasma from the process gas, and an electrostatic chuck assembly below the top electrode section in the process chamber. The electrostatic chuck assembly comprises an electrostatic chuck supporting a substrate, a focus ring surrounding an upper portion of the electrostatic chuck, an electrode ring below the focus ring and including a different material from the focus ring, and a brazed bonding layer brazing the focus ring and the electrode ring together, the brazed bonding layer being between the focus ring and the electrode ring.

First claim

What is claimed is:

1. An electrostatic chuck assembly, comprising:
an electrostatic chuck supporting a substrate;
a cover ring part surrounding an upper portion of the electrostatic chuck;
a heat transfer sheet on an upper surface of a portion of the electrostatic chuck; and
a support ring surrounding a lower portion of the electrostatic chuck,
wherein the electrostatic chuck comprises:
a mounting part on which the substrate is mounted; and
a flange part extending outward from the mounting part, and

wherein the cover ring part comprises:
a focus ring surrounding the electrostatic chuck;
an electrode ring below the focus ring and including a different material from the focus ring, the electrode ring including a first portion between the heat transfer sheet and the focus ring and a second portion between the support ring and the focus ring; and
a brazed bonding layer bonding together the focus ring and the electrode ring, the brazed bonding layer being between the focus ring and the electrode ring, and

wherein a bottom surface of the first portion of the electrode ring is at a higher vertical level than a bottom surface of the second portion of the electrode ring.

2. The electrostatic chuck assembly of claim 1 , wherein the brazed bonding layer comprises:
a first metal layer on a bottom surface of the focus ring; and
a filler metal between the first metal layer and a top surface of the electrode ring.

3. The electrostatic chuck assembly of claim 2 , wherein the brazed bonding layer further comprises:
a second metal layer on the top surface of the electrode ring,
wherein the second metal layer and the first metal layer include a same material.

4. The electrostatic chuck assembly of claim 3 ,
wherein the first metal layer is deposited on the bottom surface of the focus ring, and
wherein the second metal layer is deposited on the top surface of the electrode ring.

5. The electrostatic chuck assembly of claim 2 , wherein the filler metal comprises aluminum (Al).

6. The electrostatic chuck assembly of claim 1 , wherein the focus ring comprises at least one of aluminum oxide (Al 2 O 3 ), silicon (Si), silicon carbide (SiC), quartz, and yttrium oxide (Y 2 O 3 ).

7. The electrostatic chuck assembly of claim 1 , wherein the electrode ring comprises aluminum (Al) or titanium (Ti).

8. The electrostatic chuck assembly of claim 1 , wherein a top surface of the focus ring comprises:
a first surface positioned at a vertical level lower than a bottom surface of the substrate supported on the electrostatic chuck;
a second surface positioned at a vertical level higher than a top surface of the substrate supported on the electrostatic chuck, the second surface being stepped with the first surface; and
a third surface connecting the first surface to the second surface.

9. An electrostatic chuck assembly, comprising:
an electrostatic chuck supporting a substrate;
a support ring surrounding a lower portion of the electrostatic chuck;
a focus ring surrounding an upper portion of the electrostatic chuck;
a heat transfer sheet on an upper surface of a portion of the electrostatic chuck;
an electrode ring below the focus ring and including a different material from the focus ring, the electrode ring including a first portion between the heat transfer sheet and the focus ring and a second portion between the support ring and the focus ring; and
a bonding layer brazing the focus ring and the electrode ring together, the bonding layer being between the focus ring and the electrode ring,
wherein a bottom surface of the first portion of the electrode ring is at a higher vertical level than a bottom surface of the second portion of the electrode ring.

10. The electrostatic chuck assembly of claim 9 , wherein the bonding layer comprises:
a first metal layer on a bottom surface of the focus ring; and
a filler metal between the first metal layer and a top surface of the electrode ring.

11. The electrostatic chuck assembly of claim 10 , wherein the bonding layer further comprises:
a second metal layer on the top surface of the electrode ring.

12. The electrostatic chuck assembly of claim 11 ,
wherein the first metal layer is deposited on the bottom surface of the focus ring, and
wherein the second metal layer is deposited on the top surface of the electrode ring.

13. The electrostatic chuck assembly of claim 9 ,
wherein the focus ring comprises at least one of aluminum oxide (Al 2 O 3 ), silicon (Si), silicon carbide (SiC), quartz, and yttrium oxide (Y 2 O 3 ), and
wherein the electrode ring comprises aluminum (Al) or titanium (Ti).

14. An electrostatic chuck assembly, comprising:
an electrostatic chuck configured to support a substrate;
a support ring surrounding a lower portion of the electrostatic chuck;
a focus ring surrounding an upper portion of the electrostatic chuck;
a heat transfer sheet on an upper surface of a portion of the electrostatic chuck;
an electrode ring below the focus ring and including a first portion between the heat transfer sheet and the focus ring and a second portion between the support ring and the focus ring; and
a bonding layer brazing the focus ring and the electrode ring together, the bonding layer being between the focus ring and the electrode ring,
wherein a bottom surface of the first portion of the electrode ring is at a higher vertical level than a bottom surface of the second portion of the electrode ring.

15. The electrostatic chuck assembly of claim 14 , wherein the bonding layer comprises:
a first metal layer on a bottom surface of the focus ring; and
a filler metal between the first metal layer and a top surface of the electrode ring.

16. The electrostatic chuck assembly of claim 15 , wherein the bonding layer further comprises:
a second metal layer on the top surface of the electrode ring.

17. The electrostatic chuck assembly of claim 16 ,
wherein the first metal layer is deposited on the bottom surface of the focus ring, and
wherein the second metal layer is deposited on the top surface of the electrode ring.

18. The electrostatic chuck assembly of claim 17 ,
wherein the focus ring comprises at least one of aluminum oxide (Al 2 O 3 ), silicon (Si), silicon carbide (SiC), quartz, and yttrium oxide (Y 2 O 3 ), and
wherein the electrode ring comprises aluminum (Al) or titanium (Ti).

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Jaehyun
• Kwon Sangdong
• Kim Tae-Hwa
• Park Minjoon

Classifications

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title

• H10P72/7611

  characterised by edge profile or support profile · CPC title

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H10P72/72 Primary

  using electrostatic chucks · CPC title

• H01J37/32715

  Workpiece holder · CPC title