Ceramic electrostatic chuck bonded with high temperature polymer bond to metal base

Patent metadata

Field	Value
Publication number	US-2016276196-A1
Application number	US-201614997852-A
Country	US
Kind code	A1
Filing date	Jan 18, 2016
Priority date	Mar 20, 2015
Publication date	Sep 22, 2016
Grant date	—

Abstract

Implementations described herein provide a substrate support assembly which enables high temperature processing. The substrate support assembly includes an electrostatic chuck secured to a cooling base by a bonding layer. The bonding layer has a first layer and a second layer. The first layer has an operating temperature that includes a temperature of about 300 degrees Celsius. The second layer having a maximum operating temperature that is below 250 degrees Celsius.

First claim

What is claimed is:

1 . A substrate support assembly, comprising:
an electrostatic chuck having a workpiece supporting surface and a bottom surface; a cooling base having a top surface; and a bonding layer securing the bottom surface of the electrostatic chuck and the top surface of the cooling base, wherein the bonding layer comprises:
a first layer adhered to the bottom surface, wherein the first layer has an operating temperature that includes a temperature of about 300 degrees Celsius; and
a second layer disposed below the first layer, the second layer having a maximum operating temperature that is below 250 degrees Celsius.

2 . The substrate support assembly of claim 1 , wherein the bonding layer further comprises:
a third layer disposed below the second layer and bonded to the cooling base, wherein the third layer has a maximum operating temperature that is below about 200 degrees Celsius.

3 . The substrate support assembly of claim 1 , wherein the first layer has an operating temperature that includes temperatures between about 250 degrees Celsius and about 325 degrees Celsius.

4 . The substrate support assembly of claim 1 , wherein the thermal conductivity of the bonding layer is about 0.2 W/mK.

5 . The substrate support assembly of claim 2 , wherein the third layer has an operating temperature that includes temperatures between about 170 degrees Celsius and 60 degrees Celsius.

6 . The substrate support assembly of claim 1 , wherein the first layer is comprised of a perfluoro compound.

7 . The substrate support assembly of claim 6 , wherein a thickness of the first layer is between about 0.3 mm and about 5 mm.

8 . The substrate support assembly of claim 1 , wherein the second layer comprises polyimide or silicone.

9 . The substrate support assembly of claim 1 , wherein the second layer has a thermal conductivity of less than about 1 W/mK.

10 . The substrate support assembly of claim 2 , wherein the third layer comprises silicone.

11 . The substrate support assembly of claim 1 further comprising:
an o-ring providing a seal between the electrostatic chuck and the cooling plate, the o-ring circumscribing the bonding layer.

12 . The substrate support assembly of claim 2 , wherein the coefficient of thermal expansion for the first layer is greater than that of the second layer or the third layer.

14 . A substrate support assembly, comprising:
an electrostatic chuck having a heater, a workpiece support surface and a bottom surface; a cooling base having a top surface; and a bonding layer securing the bottom surface of the electrostatic chuck and the top surface of the cooling base, wherein the bonding layer comprises:
a first layer adhered to the bottom surface, wherein the first layer has an operating temperature that includes a temperature of about 300 degrees Celsius;
a second layer disposed below the first layer, the second layer having a maximum operating temperature that is lower that of the first layer; and
a third layer disposed below the second layer and in contact with the cooling plate, the third layer having a maximum operating temperature that is lower that of the second layer.

15 . The substrate support assembly of claim 14 , wherein the thermal conductivity of the bonding layer is about 0.2 W/mK.

16 . The substrate support assembly of claim 14 , wherein the third layer has an operating temperature that includes temperatures between about 170 degrees Celsius and 60 degrees Celsius.

17 . The substrate support assembly of claim 14 , wherein the first layer is comprised of a perfluoro polymer compound.

18 . The substrate support assembly of claim 14 , wherein the second layer comprises at least one of is one of a perfluoro polymer compound, silicone, polyimide and porous graphite.

19 . The substrate support assembly of claim 14 , wherein the second layer has a thermal conductivity of less than about 1 W/mK.

19 . The substrate support assembly of claim 14 , further comprising:
an o-ring providing a seal between the electrostatic chuck and the cooling plate, the o-ring circumscribing the bonding layer.

20 . A substrate support assembly, comprising:
an electrostatic chuck having a heater, a workpiece support surface and a bottom surface; a cooling plate having a top surface and lips along the top surface; a metal plate disposed below the bottom surface of the electrostatic chuck; and a bonding layer disposed between the metal plate and the top surface of the cooling plate; and
a first layer adhered to the bottom surface, wherein the first layer has an operating temperature that includes a temperature of about 300 degrees Celsius; and
a second layer disposed below the first layer, the second layer having a maximum operating temperature that is lower that of the first layer.

21 . A substrate support assembly, comprising:
an electrostatic chuck having a workpiece supporting surface and a bottom surface; a cooling base having a top surface; and a bonding layer securing the bottom surface of the electrostatic chuck and the top surface of the cooling base, wherein the bonding layer comprises:
a first layer adhered to the bottom surface, wherein the first layer has an operating temperature that includes a temperature of about 300 degrees Celsius; and
a second layer stacked below the first layer and bonded to the cooling base, the second layer having a maximum operating temperature less than the maximum operating temperature of the first layer.

22 . The substrate support assembly of claim 21 , wherein the bonding layer further comprises:
a third layer disposed between the second layer and the first layer, the third layer having a maximum operating temperature that is below about 300 degrees Celsius.

23 . The substrate support assembly of claim 21 , wherein the thermal conductivity of the bonding layer is about 0.2 W/mK.

24 . The substrate support assembly of claim 21 , wherein the first layer is comprised of a perfluoro compound.

25 . The substrate support assembly of claim 24 , wherein the second layer comprises polyimide or silicone.

26 . The substrate support assembly of claim 24 , wherein the second layer comprises a perfluoro compound.

Assignees

• Applied Materials Inc

Inventors

• Parkhe Vijay D

Classifications

• H10P72/0432 Primary

  mainly by conduction · CPC title

• H10P72/72 Primary

  using electrostatic chucks · CPC title

• H01L21/67103

  Electricity · mapped topic

• H01L21/6831 Primary

  Electricity · mapped topic