Resistor
US-10141088-B2 · Nov 27, 2018 · US
Resistor and its manufacturing method
US12476027B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12476027-B2 |
| Application number | US-202218071866-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 30, 2022 |
| Priority date | Dec 3, 2021 |
| Publication date | Nov 18, 2025 |
| Grant date | Nov 18, 2025 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A resistor is composed of a resistor body part and a molded resin in which the resistor body part is embedded. The molded resin includes a base resin and a filler that is higher in thermal conductivity than the base resin.
First claim
Opening claim text (preview).
The invention claimed is: 1 . A resistor, comprising: a resistor body part; and a molded resin in which the resistor body part is embedded, wherein the molded resin comprises a base resin and a filler having a higher thermal conductivity than the base resin, wherein the resistor body part comprises a resistive element and a pair of plate terminals electrically connected to the resistive element, and at least a portion of each of the pair of plate terminals is exposed from the molded resin, and wherein at least one of the pair of plate terminals comprises a facing portion inside the molded resin, which faces the resistive element through a portion of the molded resin. 2 . The resistor, according to claim 1 , wherein the thermal conductivity of the molded resin is 3 W/(m·K) or more and 10 W/(m·K) or less. 3 . The resistor, according to claim 1 , at least one of the pair of plate terminals is bent in a thickness direction in the molded resin. 4 . A method for manufacturing a resistor having a resistor body part and a molded resin in which the resistor body part is embedded, wherein the molded resin comprises a base resin and a filler having a higher thermal conductivity than the base resin, the method comprising: manufacturing the resistor body part; placing the resistor body part inside a mold; and injecting a raw material for the molded resin in a molten state inside the mold and curing the raw material to form the molded resin, wherein the resistor body part comprises a resistive element and a pair of plate terminals electrically connected to the resistive element, and at least a portion of each of the pair of plate terminals is exposed from the molded resin, wherein the resistor body part is placed in the mold while gripping the portion to be exposed from the molded resin at the pair of plate terminals at the mold, and wherein at least one of the pair of plate terminals comprises a facing portion inside the molded resin, which faces the resistive element through a portion of the molded resin.
Assignees
Inventors
Classifications
Cooling, heating or ventilating arrangements · CPC title
the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title
Apparatus or processes specially adapted for manufacturing resistors (providing fillings for housings or enclosures H01C1/02; reducing insulation surrounding a resistor to powder H01C1/03; manufacture of thermally variable resistors H01C7/02, H01C7/04) · CPC title
Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title
- H01C1/084Primary
using self-cooling, e.g. fins, heat sinks · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US12476027B2 cover?
- A resistor is composed of a resistor body part and a molded resin in which the resistor body part is embedded. The molded resin includes a base resin and a filler that is higher in thermal conductivity than the base resin.
- Who is the assignee on this patent?
- Proterial Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01C1/084. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 18 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).