Exposure method, exposure apparatus, and method for manufacturing article

Patent metadata

Field	Value
Publication number	US-12474641-B2
Application number	US-202318496629-A
Country	US
Kind code	B2
Filing date	Oct 27, 2023
Priority date	Oct 31, 2022
Publication date	Nov 18, 2025
Grant date	Nov 18, 2025

Abstract

An exposure method includes predicting a change in an optical characteristic of a projection optical system in exposing in which exposure processing is performed on a plurality of substrates via the projection optical system, adjusting the optical characteristic based on a prediction result of the predicting before the exposing, and performing the exposing after the adjusting, wherein, in the adjusting, the optical characteristic at a start of the exposing is adjusted in a direction different from a direction in which the optical characteristic changes, based on a change in the optical characteristic predicted in the predicting.

First claim

What is claimed is:

1 . An exposure method comprising:
predicting a change in an optical characteristic of a projection optical system in exposing in which exposure processing is performed on a plurality of substrates via the projection optical system; adjusting the optical characteristic based on a prediction result of the predicting before the exposing; and performing the exposing after the adjusting, wherein, in the adjusting, the optical characteristic at a start of the exposing is adjusted in a direction different from a direction in which the optical characteristic changes, based on a change in the optical characteristic predicted in the predicting, and wherein the optical characteristic is adjusted in the adjusting by irradiating the projection optical system with light.

2 . The exposure method according to claim 1 , wherein the optical characteristic is adjusted, in the adjusting, by the irradiating with the light for a time determined based on a second coefficient indicating an amount of change in the optical characteristic per unit time.

3 . The exposure method according to claim 1 , wherein the irradiating with the light in the adjusting illuminates the projection optical system and not a substrate.

4 . The exposure method according to claim 1 , wherein the adjusting is performed when a patterned master is located at a position to not be illuminated with the light.

5 . The exposure method according to claim 1 , wherein a light intensity distribution on a pupil plane of an illumination optical system during the irradiating with the light is switched based on the prediction result.

6 . The exposure method according to claim 1 , wherein the change in the optical characteristic is predicted based on first information and second information, the first information being information for predicting the change in the optical characteristic during the exposing, and the second information being information obtained by measuring the optical characteristic before the exposing.

7 . The exposure method according to claim 6 , wherein the first information is stored in association with an exposure processing condition, and in a case where the exposure processing is performed under a same condition as the exposure processing condition, the optical characteristic is predicted using the first information.

8 . The exposure method according to claim 6 , wherein the first information includes information about a first coefficient included in a prediction equation used in the predicting.

9 . The exposure method according to claim 8 , wherein the first coefficient is a value indicating an aberration saturation amount.

10 . The exposure method according to claim 1 , wherein an element indicating the change in the optical characteristic includes one of or both a change amount per unit time of the optical characteristic and a maximum change amount of the optical characteristic during the exposure processing.

11 . The exposure method according to claim 1 , wherein, in the adjusting, the optical characteristic is adjusted so that an average value of the optical characteristic during the exposure processing is a value close to zero (0).

12 . The exposure method according to claim 1 , wherein, in the adjusting, the optical characteristic at the start of the exposing is adjusted toward a sign different from a sign of a slope of the change in the optical characteristic predicted in the predicting.

13 . The exposure method according to claim 1 , wherein the optical characteristic is astigmatism of the projection optical system.

14 . The exposure method according to claim 1 , wherein the adjustment of the optical characteristic in the adjusting adjusts a value of the optical characteristic to be positive or negative.

15 . An exposure method comprising:
predicting a change in an optical characteristic of a projection optical system in exposing in which exposure processing is performed on a plurality of substrates via the projection optical system; adjusting the optical characteristic based on a prediction result of the predicting before the exposing; and performing the exposing after the adjusting, wherein, in the adjusting, the optical characteristic at a start of the exposing is adjusted based on a change in the optical characteristic predicted in the predicting so that the optical characteristic falls within a predetermined range even in a case where the optical characteristic is not adjusted in the exposing, and wherein the optical characteristic is adjusted in the adjusting by irradiating the projection optical system with light.

16 . The exposure method according to claim 15 , wherein the predetermined range is set for each exposure processing condition.

17 . The exposure method according to claim 15 , wherein the adjusting is not performed in a case where the prediction result of the predicting indicates that the optical characteristic falls within the predetermined range.

18 . An exposure apparatus comprising:
a projection optical system configured to project light; and a control unit configured to perform control to adjust an optical characteristic of the projection optical system before exposure processing of a plurality of substrates is performed via the projection optical system, wherein the control unit predicts a change in the optical characteristic and performs control to adjust the optical characteristic at a start of the exposure processing in a direction different from a direction in which the optical characteristic changes based on a prediction result, and wherein the optical characteristic is adjusted in the adjusting by irradiating the projection optical system with light.

19 . A method for manufacturing an article, the method comprising:
exposing in which an optical characteristic is adjusted and exposure of a substrate is performed using the exposure method according to claim 1 ; developing a photosensitive material patterned by the exposure in the exposing on the substrate; and manufacturing an article from the substrate developed in the developing.

Assignees

• Canon Kk

Inventors

• Watanabe Jinnai
• Moizumi Jun

Classifications

• G03F7/705

  Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions · CPC title

• G03F7/706 Primary

  Aberration measurement · CPC title

• G03F7/70258

  Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system · CPC title

• G03F7/70525

  Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure · CPC title

• G03F7/70266 Primary

  Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction · CPC title