Lithographic apparatus, control system and device manufacturing method

Patent metadata

Field	Value
Publication number	US-9482967-B2
Application number	US-201113238861-A
Country	US
Kind code	B2
Filing date	Sep 21, 2011
Priority date	Mar 13, 2006
Publication date	Nov 1, 2016
Grant date	Nov 1, 2016

Abstract

An immersion lithographic apparatus is disclosed that has a measurement system or a prediction system for measuring and/or predicting, respectively, an effect associated with a temperature fluctuation of the immersion liquid, and a control system for controlling the or another effect associated with the temperature of the immersion liquid, on the basis of the measurement and/or prediction obtained by the measurement system and/or prediction system, respectively. An associated control system and device manufacturing method is also disclosed.

First claim

The invention claimed is:

1. A lithographic apparatus arranged to project a pattern from a patterning device onto a substrate using a projection system, the apparatus comprising:
a liquid supply system configured to provide a space between the projection system and the substrate with a liquid;
a measurement system configured to measure an effect associated with a temperature fluctuation of the liquid;
a prediction system configured to predict an effect associated with a temperature fluctuation of the liquid, the prediction system comprising a model system configured to predict a variation in the temperature of the liquid; and
a control system configured to adjust a parameter of the lithographic apparatus to control the effect measured by the measurement system and/or the effect predicted by the prediction system or another effect associated with the temperature of the liquid, on the basis of a prediction obtained by the prediction system and a measurement obtained by the measurement system, wherein the control system is configured to provide a feedforward control on the basis of the prediction obtained by the prediction system and to trigger a feedback measurement when the feedforward control exceeds a limit.

2. The apparatus of claim 1 , wherein the control system is configured to provide a feedback control on the basis of the measurement obtained by the measurement system.

3. The apparatus of claim 1 , wherein the measurement system comprises an optical sensor configured to sense an optical characteristic of a radiation beam and the control system is arranged to adjust, on the basis of the sensed optical characteristic, a component of the lithographic apparatus.

4. The apparatus of claim 3 , wherein the optical sensor is a continuous focus measurement sensor, a magnification sensor, an aberration measurement device, or any combination selected from the foregoing.

5. The apparatus of claim 3 , wherein the control system is arranged to provide a feedback control signal on the basis of the optical characteristic sensed by the optical sensor to correct for an associated imaging effect by providing a control signal to an adjustment element configured to adjust (i) a position of the substrate, (ii) a position of one or more optical elements in the projection system, (iii) a wavelength of the radiation beam, or (iv) any combination selected from (i)-(iii).

6. The apparatus of claim 3 , wherein the optical sensor is configured to periodically measure a focus effect of a temperature fluctuation in the liquid between exposures.

7. The apparatus of claim 3 , wherein the control system is arranged to provide feedback control to control a temperature of the liquid in the space between the projection system and the substrate on the basis of the optical characteristic sensed by the optical sensor.

8. The apparatus of claim 3 , wherein the control system is arranged to adjust, on the basis of the sensed optical characteristic, (i) an element in the projection system, (ii) a wavelength of a radiation beam, (iii) a position of the substrate, (iv) a temperature of the liquid, or (v) any combination selected from (i)-(iv).

9. The apparatus of claim 1 , wherein the control system is configured to provide a feedforward control to adjust (i) an element in the projection system (ii) a wavelength of a radiation beam, (iii) a position of the substrate, (iv) a temperature of the liquid, or (v) any combination selected from (i)-(iv).

10. The apparatus of claim 1 , wherein the measurement system comprises a temperature sensor configured to measure a temperature of the liquid and wherein the control system is configured to provide a control signal to a component of the lithographic apparatus on the basis of the temperature sensed by the temperature sensor.

11. The apparatus of claim 10 , wherein the control system is arranged to provide a control signal on the basis of a temperature sensed in the space to correct for an associated imaging effect by providing a control signal to an adjustment element configured to adjust (i) a position of the substrate, (ii) a position of one or more optical elements in the projection system, (iii) a wavelength of a radiation beam, or (iv) any combination selected from (i)-(iii).

12. The apparatus of claim 1 , wherein the parameter is a parameter of (i) a thermal conditioning system, (ii) a substrate table positioning system, (iii) an optical element positioning system, wherein the optical element is comprised in the projection system, (iv) a system configured to adjust a wavelength of a radiation beam, or (v) any combination selected from (i)-(iv).

13. The apparatus of claim 1 , further comprising an outlet, through which the liquid can flow, downstream from the space between the projection system and the substrate, and wherein the measurement system comprises a sensor located in the flow downstream of the space to measure a temperature of the liquid downstream of the space.

14. The apparatus of claim 13 , wherein the control system is arranged to control a thermal conditioning system to adjust a temperature of the liquid in the space between the projection system and the substrate, on the basis of the temperature sensed downstream of the space.

15. The apparatus of claim 13 , wherein the control system is arranged to provide a control signal on the basis of the temperature sensed downstream of the space to correct for an associated imaging effect by providing a control signal to an adjustment element configured to adjust (i) a position of the substrate, (ii) a position of one or more optical elements in the projection system, (iii) a wavelength of a radiation beam, or (iv) any combination selected from (i)-(iii).

16. The apparatus of claim 1 , wherein the control system is arranged to adjust, on the basis of the prediction and the measurement, the parameter of an element in the projection system.

17. The apparatus of claim 1 , wherein the control system is arranged to adjust, on the basis of the prediction and the measurement, the parameter of a substrate table positioning system configured to adjust a position of the substrate table.

18. The apparatus of claim 1 , wherein the model system provides a model of a thermal effect for exposure regions, during exposure through the liquid, over the surface of the substrate, the model based on data of one or more previous, processed substrates in the lithographic apparatus.

19. A device manufacturing method, comprising:
projecting a patterned radiation beam, through a liquid, onto a substrate using a projection system of a lithographic apparatus;
measuring a variation in the temperature of the liquid;
predicting a variation in the temperature of the liquid using a modelling system; and
adjusting a parameter of the lithographic apparatus to control an effect associated with temperature variation of the liquid based on the measured and predicted variations in the temperature, wherein feedforward control is provided based on the predicted variation in the temperature and triggering a feedback measurement when the control based on the predicted variation exceeds a limit.

20. The method of claim 19 , wherein the parameter is that of an element of the projection system and/or of a substrate positioning system.

21. A control apparatus configured to control a lithographic apparatus, the control apparatus comprising:
a measurement system configured to measure an effect associated with a temperature fluctuation of a liquid filling a space between a projection system

Assignees

• Van De Kerkhof Marcus Adrianus
• Jacobs Johannes Henricus Wilhelmus
• Uitterdijk Tammo
• Lallemant Nicolas Alban
• Asml Netherlands Bv

Inventors

• Van De Kerkhof Marcus Adrianus
• Jacobs Johannes Henricus Wilhelmus
• Uitterdijk Tammo
• Lallemant Nicolas Alban

Classifications

• G03F7/70575

  Wavelength control, e.g. control of bandwidth, multiple wavelength, selection of wavelength or matching of optical components to wavelength · CPC title

• G03F7/705

  Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions · CPC title

• G03F7/70858 Primary

  Environment aspects, e.g. pressure of beam-path gas, temperature (pollution aspects G03F7/70916) · CPC title

• G03F7/706

  Aberration measurement · CPC title

• G03F7/70258

  Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system · CPC title