Exposure method, exposure apparatus, and method for manufacturing article

Patent metadata

Field	Value
Publication number	US-12468229-B2
Application number	US-202318496547-A
Country	US
Kind code	B2
Filing date	Oct 27, 2023
Priority date	Oct 31, 2022
Publication date	Nov 11, 2025
Grant date	Nov 11, 2025

Abstract

An exposure method includes performing exposure processing via a projection optical system between a start and an end of the exposure processing on a plurality of substrates included in a lot as exposure, predicting a change in an optical characteristic of the projection optical system during the exposure based on an exposure processing condition of the exposure, determining whether the optical characteristic exceeds a predetermined range during the exposure based on a predicted result, and in a case where the optical characteristic is determined to exceed the predetermined range during the exposure, adjusting the optical characteristic before the optical characteristic exceeds the predetermined range, wherein at least one or more of the plurality of substrates is/are exposed after the adjusting.

First claim

What is claimed is:

1 . An exposure method comprising:
performing exposure processing via a projection optical system during exposure on a plurality of substrates included in a lot; predicting a change in an optical characteristic of the projection optical system during the exposure based on an exposure processing condition; determining whether the optical characteristic exceeds a predetermined range during the exposure based on the change in the optical characteristic; and adjusting the optical characteristic by irradiating the projection optical system with light before the optical characteristic exceeds the predetermined range, in a case where the optical characteristic is determined to exceed the predetermined range during the exposure, wherein at least one of the plurality of substrates is/are exposed after the adjusting, and wherein in the irradiation with the light for the adjustment of the optical characteristic the light is applied to the projection optical system without being applied to the substrate.

2 . The exposure method according to claim 1 , wherein the optical characteristic is adjusted when a patterned master is located at a position to not be illuminated with the light.

3 . The exposure method according to claim 1 , wherein a light intensity distribution on a pupil plane of an illumination optical system during the irradiating with the light is switched based on the change in the optical characteristic.

4 . The exposure method according to claim 1 , wherein the optical characteristic is adjusted a plurality of times during the exposure.

5 . The exposure method according to claim 1 , wherein the change in the optical characteristic is predicted based on first information and second information, the first information being information for predicting the change in the optical characteristic during the exposure, and the second information being information about an initial value for predicting the change in the optical characteristic.

6 . The exposure method according to claim 5 , wherein the second information is information obtained by measuring the optical characteristic.

7 . The exposure method according to claim 5 , wherein the second information is a target value of adjustment of the optical characteristic.

8 . The exposure method according to claim 5 , wherein the second information is a value obtained based on a target value of adjustment of the optical characteristic and an amount of change in the optical characteristic predicted to occur after the adjusting.

9 . The exposure method according to claim 5 , wherein the first information includes information about a first coefficient indicating aberration saturation included in a prediction equation used in the predicting.

10 . The exposure method according to claim 5 , wherein the first information is stored in association with the exposure processing condition, and in a case where the exposure processing is performed under a same condition as the exposure processing condition, the optical characteristic is predicted using the first information.

11 . The exposure method according to claim 1 , wherein the change in the optical characteristic is predicted each time after the adjusting.

12 . The exposure method according to claim 1 , wherein the optical characteristic is adjusted to a value offset from a value of the optical characteristic at which resolution performance in performing the exposure processing is maximized.

13 . The exposure method according to claim 1 , wherein the determining is performed on every predetermined number of substrates, on a substrate at which optical characteristic is predicted to exceed the predetermined range, or on a substrate immediately prior to the substrate at which the optical characteristic is predicted to exceed the predetermined range.

14 . The exposure method according to claim 1 , wherein the optical characteristic is astigmatism of the projection optical system.

15 . The exposure method according to claim 1 , wherein a range including at least either an upper limit value or a lower limit value of the predetermined range is set with regard to the upper or lower limit value, and in a case where a value of the predicted optical characteristic is in the range including the upper or lower limit value, the optical characteristic is adjusted.

16 . An exposure apparatus comprising:
a projection optical system configured to project light; a control unit configured to predict a change in an optical characteristic of the projection optical system and control adjustment of the optical characteristic; and wherein the control unit is configured to predict the change in the optical characteristic in performing exposure processing during exposure on a plurality of substrates included in a lot based on an exposure processing condition, determine whether the predicted optical characteristic exceeds a predetermined range during the exposure, control the adjustment of the optical characteristic by irradiating the projection optical system with light before the optical characteristic exceeds the predetermined range, in a case where the optical characteristic exceeds the predetermined range during the exposure processing, and control exposure of at least one of the plurality of substrates after the adjustment of the optical characteristic, wherein in the irradiation with the light for the adjustment of the optical characteristic the light is applied to the projection optical system without being applied to the substrate.

17 . A method for manufacturing an article, the method comprising:
adjusting an optical characteristic and exposing a substrate using the exposure method according to claim 1 ; developing a photosensitive material patterned on the substrate by exposure in the exposing; and manufacturing the article with the developed substrate.

Assignees

• Canon Kk

Inventors

• Moizumi Jun

Classifications

• G03F7/705

  Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions · CPC title

• G03F7/706

  Aberration measurement · CPC title

• G03F7/70891

  Temperature · CPC title

• G03F7/70525

  Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure · CPC title

• G03F7/70266 Primary

  Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction · CPC title