Apparatus for treating a substrate

Patent metadata

Field	Value
Publication number	US-12460863-B2
Application number	US-202217825420-A
Country	US
Kind code	B2
Filing date	May 26, 2022
Priority date	May 26, 2022
Publication date	Nov 4, 2025
Grant date	Nov 4, 2025

Abstract

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space therein; a substrate support unit configured to support a substrate in the treating space; and a fluid supply unit configured to supply a fluid in a supercritical state to the treating space, wherein the fluid supply unit comprises: a supply line provided at a top wall of the chamber; and a discharge unit installed at the top wall of the chamber and configured to discharge a fluid to a substrate, and wherein the discharge unit comprises: a body having a discharge fluid channel for the fluid; a nozzle plate provided at a discharge end of the body; and a blocking plate within the discharge fluid channel and spaced apart from the nozzle plate.

First claim

What is claimed is:

1 . A substrate treating apparatus comprising:
a chamber having a treating space therein; a substrate support unit configured to support a substrate in the treating space; and a fluid supply unit configured to supply a fluid in a supercritical state to the treating space, wherein the fluid supply unit comprises: a supply line provided at a top wall of the chamber; and a discharge unit installed at the top wall of the chamber and configured to discharge a fluid to a substrate, and wherein the discharge unit comprises: a body having a discharge fluid channel for the fluid; a nozzle plate provided at a discharge end of the body; and a blocking plate within the discharge fluid channel and spaced apart from the nozzle plate.

2 . The substrate treating apparatus of claim 1 , wherein the nozzle plate has a plurality of first holes in a first region thereof, and a plurality of second holes in a second region thereof, the first region including peripheral region of the nozzle plate and the second region including a central region of the nozzle plate,
wherein a cross-section area of the first hole is larger than a cross-sectional area of the second hole.

3 . The substrate treating apparatus of claim 2 , wherein the blocking plate is disposed such that the plurality of the second holes are located under the blocking plate.

4 . The substrate treating apparatus of claim 2 , wherein a diameter of the blocking plate is substantially equal to a diameter of the second region of the nozzle plate.

5 . The substrate treating apparatus of claim 4 , wherein the blocking plate is substantially aligned with the second region of the nozzle plate.

6 . The substrate treating apparatus of claim 2 , wherein a number of the plurality of the first holes is smaller than a number of the plurality of the second holes.

7 . The substrate treating apparatus of claim 1 , wherein the discharge fluid channel is formed through the body from a top surface to a bottom surface thereof, and
a diameter of the discharge fluid channel is constant.

8 . The substrate treating apparatus of claim 1 , wherein the discharge fluid channel is formed through the body from a top surface to a bottom surface thereof, and
a diameter of the discharge fluid channel gradually increases from the top surface of the body to the bottom surface of the body.

9 . The substrate treating apparatus of claim 1 , wherein the fluid includes a supercritical fluid.

10 . A substrate treating apparatus comprising:
a chamber having a treating space therein; a substrate support unit configured to support a substrate in the treating space; and a fluid supply unit configured to supply a fluid in a supercritical state to the treating space, wherein the fluid supply unit comprises: a supply line provided at a top wall of the chamber; and a discharge unit installed at the top wall of the chamber and configured to discharge a fluid to a substrate, and wherein the discharge unit comprises: a body having a discharge fluid channel for the fluid; and a nozzle plate provided at a discharge end of the body; and wherein the nozzle plate comprises: a first region having a plurality of first holes, the first region including a peripheral region of the nozzle plate; and a second region having a plurality of second holes, the second region including a central region of the nozzle plate, and wherein a diameter of each of the plurality of first holes is larger than a diameter of each of the plurality of second holes.

11 . A substrate treating apparatus of claim 10 , wherein
the discharge unit comprises a blocking plate within the discharge fluid channel and spaced apart from the nozzle plate.

12 . The substrate treating apparatus of claim 11 , wherein the blocking plate has a size substantially corresponding to a size of the second region of the nozzle plate.

13 . The substrate treating apparatus of claim 11 , wherein the blocking plate is substantially aligned with the second region of the nozzle plate.

14 . The substrate treating apparatus of claim 10 , wherein the number of the plurality of first holes is smaller than the number of the plurality of second holes.

15 . The substrate treating apparatus of claim 10 , wherein the plurality of first holes are spaced apart from each other along a circumferential direction of the nozzle plate such that the plurality of first holes surround the plurality of second holes.

16 . The substrate treating apparatus of claim 10 , wherein
the discharge fluid channel is formed through the body from a top and surface to a bottom surface, and a diameter of the discharge fluid channel is constant from the top surface to the bottom surface.

17 . The substrate treating apparatus of claim 10 ,
the discharge fluid channel is formed through the body from a top surface to a bottom surface, and a inner diameter of the discharge fluid channel gradually increases from the top surface to the bottom surface.

18 . The substrate treating apparatus of claim 17 , wherein the nozzle plate has a size corresponding to a size of a discharge port of the discharge fluid channel formed at the bottom surface of the body.

19 . The substrate treating apparatus of claim 10 , wherein the fluid includes a supercritical fluid.

20 . A substrate treating apparatus comprising:
a chamber having a treating space therein; a substrate support unit configured to support a substrate in the treating space; and a fluid supply unit configured to supply a fluid in a supercritical state to the treating space, wherein the fluid supply unit comprises: a supply line provided at a top wall of the chamber; and a discharge unit installed at the top wall of the chamber and configured to discharge a fluid to the substrate, and wherein the discharge unit comprises: a discharge fluid channel for the fluid; a nozzle plate provided at an end of the discharge fluid channel; and a blocking plate within the discharge fluid channel and spaced apart from the nozzle plate, and wherein the nozzle plate comprises: a first region having a plurality of first holes with a first diameter formed therein, the first region including a peripheral region of the nozzle plate; and a second region having a plurality of second holes with a second diameter smaller than the first diameter, the second region including a central region of the nozzle plate, and wherein the blocking plate has a size corresponding to a size of the second region of the nozzle plate, and the blocking plate is substantially aligned with the second region of the nozzle plate.

Assignees

• Semes Co Ltd

Inventors

• Kang Ki-Moon
• Park Hyun Goo
• Yang Hyo Won

Classifications

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/7606

  characterised by edge clamping, e.g. clamping ring · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• F26B5/005 Primary

  by dipping them into or mixing them with a chemical liquid, e.g. organic; chemical, e.g. organic, dewatering aids (F26B3/005 takes precedence; using chemical vapours or gases F26B21/40) · CPC title