Apparatus and method for treating substrate

Patent metadata

Field	Value
Publication number	US-10529594-B2
Application number	US-201715793263-A
Country	US
Kind code	B2
Filing date	Oct 25, 2017
Priority date	Oct 26, 2016
Publication date	Jan 7, 2020
Grant date	Jan 7, 2020

Abstract

Embodiments of the inventive concept relate to an apparatus for treating a substrate in a high-pressure atmosphere. The apparatus includes a process chamber having an upper body and a lower body that are combined with each other to provide a treatment space therein, an elevation member configured to elevate any one of the upper body and the lower body to an opening location at which the upper body and the lower body is spaced apart or a closing location at which the upper body and the lower body is attached, a clamping member configured to clamp the upper body and the lower body located at the closing location, and a movable member configured to move the clamping member to a locking location at which the clamping member clamps the process chamber or to the release location at which the clamping member is spaced apart from the process chamber.

First claim

What is claimed is:

1. A substrate treating apparatus comprising:
a process chamber having an upper body and a lower body that are combined with each other to provide a treatment space therein;
an elevation member configured to elevate any one of the upper body and the lower body to an opening location at which the one of the upper body and the lower body is spaced apart from the other of the upper body and the lower body or a closing location at which the one of the upper body and the lower body is attached to the other of the upper body and the lower body;
a clamping member configured to clamp the upper body and the lower body located at the closing location;
a movable member configured to move the clamping member to a locking location at which the clamping member clamps the upper body and the lower body or to a release location at which the clamping member is spaced apart from the upper body and the lower body; and
a housing surrounding the process chamber, the clamping member, and the elevation member,
wherein the housing includes:
a tub-shaped body; and
an intermediate plate partitioning an interior of the tub-shaped body into an upper space and a lower space and having a hollow, and

wherein the process chamber and the clamping member are located in any one of the upper space and the lower space, and the elevation member is located in the other of the upper space and the lower space.

2. The substrate treating apparatus of claim 1 , further comprising:
a substrate support unit configured to support the substrate in the treatment space; and
a fluid supply unit configured to supply a treatment fluid to the treatment space.

3. The substrate treating apparatus of claim 2 , wherein the clamping member includes:
a first clamp located on one side of the process chamber; and
a second clamp located to face the first clamp while the process chamber being interposed between the first clamp and the second clamp.

4. The substrate treating apparatus of claim 3 , wherein the upper body is shaped such that a central portion of an upper surface thereof is higher than an peripheral portion of the upper surface thereof,
wherein the lower body is shaped such that a central portion of a bottom surface thereof is lower than a peripheral portion of the bottom surface thereof, and
wherein each of the first clamp and the second clamp has a clamp groove, into which the peripheral portion of the upper surface of the upper body and the peripheral portion of the bottom surface of the lower body are inserted, on an inner surface thereof.

5. The substrate treating apparatus of claim 4 , wherein each of the first clamp and the second clamp includes:
an upper surface that is inclined downwards as it goes toward the upper body;
a lower surface that is inclined upwards as it goes towards the lower body; and
a side surface connecting the upper surface and the lower surface,
wherein the clamp groove is formed through combination of the upper surface, the lower surface, and the side surface,
wherein the peripheral portion of the upper surface of the upper body has a shape corresponding to the upper surfaces of the first clamp and the second clamp, and
wherein the peripheral portion of the bottom surface of the lower body has a shape corresponding to the lower surfaces of the first clamp and the second clamp.

6. The substrate treating apparatus of claim 4 , wherein the movable member includes:
a driving shaft, a lengthwise direction of which is perpendicular to an elevation direction and to which the first clamp and the second clamp are hinge-coupled; and
a driving member configured to drive the driving shaft such that the clamping member is moved to the locking location or the release location along the lengthwise direction of the driving shaft.

7. The substrate treating apparatus of claim 4 , wherein a first hole of a slit shape that passes through an inner surface and an outer surface of the first clamp is formed at one end of the first clamp,
wherein a second hole of a slit shape that passes through an inner surface and an outer surface of the second clamp is formed at one end of the second clamp,
wherein the first hole and the second hole of the clamping member are communicated with each other at the locking location, and
wherein the first hole and the second hole function as passages, through which the substrate is carried in and out.

8. The substrate treating apparatus of claim 3 , wherein the first clamp is provided such that one side surface thereof contacting the second clamp is stepped,
wherein the second clamp is provided such that an opposite side surface thereof contacting the first clamp is stepped to correspond to the one side surface thereof,
wherein a first pin groove, into which a locking pin is inserted, is formed in one of a stepped area of the first clamp and a stepped area of the second clamp, and a second pin groove is formed on the other thereof,
wherein the first pin groove and the second groove face each other at the locking location, and
wherein the first pin groove and the second pin groove is located to be opposite to each other in a direction that is perpendicular to movement directions of the first clamp and the second clamp.

9. The substrate treating apparatus of claim 2 ,
wherein the elevation member further includes:
a driver configured to elevate the upper body or the lower body,
wherein the driver drives the movable member to perform an attachment operation of providing a driving force to the driver such that the lower body and the upper body are attached to each other if the substrate is introduced into the treatment space, a clamping operation of, after the attachment operation, clamping the upper body and the lower body attached to each other by the driving force with the clamping member, and a substrate treating operation of, after the clamping operation, supplying a treatment liquid to the treatment space, and
wherein if the treatment space reaches a preset pressure due to a treatment fluid in the substrate treating operation, the driving force of the driver is released while the clamping is made.

10. The substrate treating apparatus of claim 2 , further comprising:
a heating member configured to heat the treatment space,
wherein the heating member further includes:
a heater located in at least one of the upper body and the lower body and having a bar shape, a lengthwise direction of which faces a direction that is perpendicular to a movement direction of the clamping member.

11. The substrate treating apparatus of claim 1 , wherein the elevation member includes:
a support plate configured to support one of the upper body and the lower body, the support plate being able to elevate, and
wherein the support plate has a diameter that is larger than a diameter of the hollow.

12. The substrate treating apparatus of claim 1 , wherein any one of the upper body and the lower body is moved by the elevation member, and the other of the upper body and the lower body is fixed to the housing,
wherein the housing includes:
an impact absorbing member configured to support one of the upper body and the lower body, which is fixed to the housing, and
wherein the impact absorbing member is formed of an elastic material.

13. The substrate treating apparatus of claim 1 , further comprising:
wherein the elevation member further includes:
a driver configured to elevate the upper body or the lower body,
wherein the driver drives the movable member to perform an attachment operation of providing a driving force to the driver such that the lower body and the upper body are attached to each other if the sub

Assignees

• Semes Co Ltd

Inventors

• Lim Do-Youn
• Won Joonho
• Eum Kisang
• Kim Boong
• Park Joo Jib

Classifications

• H10P70/80

  Cleaning only by supercritical fluids · CPC title

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title