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US-9478450-B2 · Oct 25, 2016 · US
Substrate processing apparatus
US12454032B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12454032-B2 |
| Application number | US-202318323820-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 25, 2023 |
| Priority date | May 26, 2022 |
| Publication date | Oct 28, 2025 |
| Grant date | Oct 28, 2025 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A substrate processing apparatus including a lower jig plate for arranging a substrate which is an object to be pressurized, columnar members supporting the lower jig plate, and a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members.
First claim
Opening claim text (preview).
What is claimed is: 1. A substrate processing apparatus comprising a lower jig plate for arranging an object to be pressurized, columnar members supporting the lower jig plate, and a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members, wherein the heat dissipating column includes a column main body, and a cover portion covering the column main body and comprising a material with a higher thermal conductivity than the column main body. 2. The substrate processing apparatus according to claim 1 , wherein the heat dissipating column includes heat dissipating columns, and the heat dissipating columns are arranged in accordance with an in-plane distribution of temperature of the lower jig plate. 3. The substrate processing apparatus according to claim 1 , wherein the cover portion is attached at a top of the column main body, and a resilient member is provided between the cover portion and the top of the column main body. 4. The substrate processing apparatus according to claim 1 , wherein the heat dissipating column is provided at a position where a large load is applied to the lower jig plate. 5. The substrate processing apparatus according to claim 1 further comprising an installation portion where the columnar members and the heat dissipating column are installed.
Assignees
Inventors
Classifications
Apparatus therefor · CPC title
characterised by the mechanical construction of the susceptor, stage or support · CPC title
Temperature monitoring · CPC title
Apparatus for mechanical treatment or grinding or cutting · CPC title
- H10P72/1912Primary
characterised by shock absorbing elements, e.g. retainers or cushions · CPC title
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Frequently asked questions
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- What does patent US12454032B2 cover?
- A substrate processing apparatus including a lower jig plate for arranging a substrate which is an object to be pressurized, columnar members supporting the lower jig plate, and a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members.
- Who is the assignee on this patent?
- Tdk Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P72/1912. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 28 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).