Pattern forming method, resist material, and pattern forming apparatus

Patent metadata

Field	Value
Publication number	US-12449737-B2
Application number	US-202017623979-A
Country	US
Kind code	B2
Filing date	Jun 30, 2020
Priority date	Jul 2, 2019
Publication date	Oct 21, 2025
Grant date	Oct 21, 2025

Abstract

It is an object of the present invention to provide a method of forming a high-contrast fine pattern onto a resist film. The present invention relates to a pattern forming method, comprising; applying a resist material onto a substrate to form a resist film, introducing a metal into the resist film, exposing, and developing. In addition, the present invention also relates to a resist material and a pattern forming apparatus.

First claim

The invention claimed is:

1. A pattern forming method, comprising:
applying a resist material onto a substrate to form a resist film,
introducing a metal into the resist film,
exposing, and
developing,
wherein:
the resist material comprises a polymer, and the polymer comprises a unit derived from structures represented by the following formula ( 101 ):

wherein, in the formula ( 101 ), R 1 each independently represents a hydrogen atom, an alkyl group optionally having a substituent, an acyl group optionally having a substituent, an allyl group optionally having a substituent, an alkoxy group optionally having a substituent, or an alkylsilyl group optionally having a substituent, and a plurality of R 1 may be the same or different; R 11 represents a hydrogen atom or an alkyl group optionally having a substituent; R 2 represents a hydrogen atom, an alkyl group, a fluorine atom, a chlorine atom, a bromine atom, or a halogenated alkyl group; and Y 1 represents a single bond or a linking group,
the polymer is a main-chain scission type polymer, and the introducing a metal is established between the applying the resist material and the exposing.

2. The pattern forming method according to claim 1 , wherein the polymer further comprises a unit derived from at least one selected from structures represented by the following formulae ( 102 ) to ( 103 ):

wherein, in the formula ( 102 ), X 1 represents an alkyl group optionally having a substituent, an acyl group optionally having a substituent, or an allyl group optionally having a substituent; R 3 represents a hydrogen atom, an alkyl group, a fluorine atom, a chlorine atom, a bromine atom, or a halogenated alkyl group; and Y 2 represents a single bond or a linking group; and
wherein, in the formula ( 103 ), X 2 represents an aryl group optionally having a substituent; R 4 represents a hydrogen atom, an alkyl group, a fluorine atom, a chlorine atom, a bromine atom, or a halogenated alkyl group; and Y 3 represents a single bond or a linking group.

3. The pattern forming method according to claim 2 , wherein the polymer comprises the units derived from the structures represented by the formulae ( 101 ) to ( 103 ).

4. The pattern forming method according to claim 2 , wherein at least any one of the R 3 to R 4 is a fluorine atom, a chlorine atom, or a bromine atom.

5. The pattern forming method according to claim 1 , wherein the R 2 is a fluorine atom, a chlorine atom, or a bromine atom.

6. The pattern forming method according to claim 1 , wherein the metal introduction step is a step of introducing at least one selected from the group consisting of Mg, Al, Ag, Ge, Cd, W, Ta, Hf, Zr, Mo, In, Sn, Sb, and Te into the resist film.

7. The pattern forming method according to claim 1 , wherein, in the introducing a metal into the resist film, a metal material, in which at least one selected from halogen, an alkyl group, and an aminoalkyl group binds to a metallic element, is used.

8. The pattern forming method according to claim 1 , wherein the introducing the metal is performed using a metal gas material that comprises at least one selected from the group consisting of Mg, Al, Ag, Ge, Cd, W, Ta, Hf, Zr, Mo, In, Sn, Sb, and Te.

9. The pattern forming method according to claim 8 , wherein the metal gas material is a material in which at least one selected from halogen, an alkyl group, and an aminoalkyl group binds to a metallic element.

10. The pattern forming method according to claim 1 , wherein the resist material comprises a polymer comprising a unit derived from at least one selected from structures represented by the following formulae ( 101 ) to ( 103 ), and wherein the resist material is for use in introduction of a metal:

wherein, in the formula ( 101 ), R 1 each independently represents a hydrogen atom, an alkyl group optionally having a substituent, an acyl group optionally having a substituent, an allyl group optionally having a substituent, an alkoxy group optionally having a substituent, or an alkylsilyl group optionally having a substituent, and a plurality of R 1 may be the same or different; R 11 represents a hydrogen atom or an alkyl group optionally having a substituent; R 2 represents a hydrogen atom, an alkyl group, a fluorine atom, a chlorine atom, a bromine atom, or a halogenated alkyl group; and Y 1 represents a single bond or a linking group;
in the formula ( 102 ), X 1 represents an alkyl group optionally having a substituent, an acyl group optionally having a substituent, or an allyl group optionally having a substituent; R 3 represents a hydrogen atom, an alkyl group, a fluorine atom, a chlorine atom, a bromine atom, or a halogenated alkyl group; and Y 2 represents a single bond or a linking group; and
in the formula ( 103 ), X 2 represents an aryl group optionally having a substituent; R 4 represents a hydrogen atom, an alkyl group, a fluorine atom, a chlorine atom, a bromine atom, or a halogenated alkyl group; and Y 3 represents a single bond or a linking group.

11. The pattern forming method according to claim 10 , wherein the polymer comprises the units derived from the structures represented by the formulae ( 101 ) to ( 103 ).

12. The pattern forming method according to claim 11 , wherein at least any one of the R 2 to R 4 is a fluorine atom, a chlorine atom, or a bromine atom.

13. The pattern forming method according to claim 1 , performed by a pattern forming apparatus comprising:
an applier which applies the resist material onto the substrate to form the resist film,
an introducer which introduces the metal into the resist film,
an exposure mechanism that performs the exposing, and
a developer that performs the developing.

Assignees

• Oji Holdings Corp

Inventors

• Morita Kazuyo
• Hattori Kimiko

Classifications

• G03F7/70125

  Use of illumination settings tailored to particular mask patterns (details of setting means G03F7/70091) · CPC title

• G03F7/0397

  the macromolecular compound having an alicyclic moiety in a side chain · CPC title

• G03F7/0125

  characterised by the polymeric binder or the macromolecular additives other than the macromolecular azides · CPC title

• G03F7/0045

  with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

• G03F7/167

  from the gas phase, by plasma deposition (G03F7/2035 takes precedence) · CPC title