Hermetically sealed piezoelectric device with integrated temperature sensor and optimized thermal characteristics

Patent metadata

Field	Value
Publication number	US-12438478-B2
Application number	US-202318158578-A
Country	US
Kind code	B2
Filing date	Jan 24, 2023
Priority date	Jul 29, 2020
Publication date	Oct 7, 2025
Grant date	Oct 7, 2025

Abstract

A piezoelectric device includes a piezoelectric element, a mounting plate, an electronic element including a temperature sensor therein, a base on which the piezoelectric element is mounted with the mounting plate therebetween and on which the electronic element is mounted, and a lid joined to the base and hermetically sealing at least the piezoelectric element and the mounting plate.

First claim

The invention claimed is:

1. A piezoelectric device comprising:
a piezoelectric element;
a mounting plate;
an electronic element comprising a temperature sensor therein;
a base on which the piezoelectric element is mounted with the mounting plate therebetween, and on which the electronic element is mounted, wherein the base comprises:
a substrate comprising a first bottom surface on which the electronic element is mounted;
a first frame located on an outer peripheral edge of the first bottom surface and comprising a second bottom surface on which the piezoelectric element is mounted with the mounting plate therebetween; and
a second frame located on an outer peripheral edge of the second bottom surface; and

a lid joined to the base and hermetically sealing at least the piezoelectric element and the mounting plate, wherein the lid is joined to the second frame and hermetically seals the piezoelectric element, the mounting plate, and the electronic element.

2. The piezoelectric device according to claim 1 , wherein the piezoelectric element, the electronic element, and the mounting plate interposed therebetween are superposed on each other in a plan view.

3. The piezoelectric device according to claim 1 , wherein, in a plan view, the mounting plate is equal in size to the piezoelectric element or is greater in size to the piezoelectric element to encompass the piezoelectric element.

4. The piezoelectric device according to claim 1 , wherein the mounting plate and the base are made of a same material.

5. The piezoelectric device according to claim 1 , wherein the piezoelectric device satisfies |τs−τx1|<|τs−τx2|
where
τs denotes a thermal time constant of heat transferred from the base to the electronic element,
τx1 denotes a thermal time constant of heat transferred from the base to the piezoelectric element through the mounting plate, and
τx2 denotes a thermal time constant of heat transferred from the base mounted directly to the piezoelectric element without the mounting plate therebetween.

6. The piezoelectric device according to claim 5 , wherein each thermal time constant is a time that it takes for a respective one of the electronic element and the piezoelectric element to change from T1 to {T1+(T2−T1)×0.632} while an ambient temperature of the piezoelectric device changes from T1 to T2.

7. A piezoelectric device comprising:
a piezoelectric element;
a mounting plate;
an electronic element comprising a temperature sensor therein;
a base on which the piezoelectric element is mounted with the mounting plate therebetween, and on which the electronic element is mounted, wherein the base comprises:
a substrate comprising an inner surface and an outer surface opposite to the inner surface, the piezoelectric element being mounted on the inner surface with the mounting plate therebetween, the electronic element being mounted on the inner surface; and
a frame located on an outer peripheral edge of the inner surface; and

a lid joined to the base and hermetically sealing at least the piezoelectric element and the mounting plate, wherein the lid is joined to the frame and hermetically seals the piezoelectric element, the mounting plate, and the electronic element.

8. The piezoelectric device according to claim 7 , wherein, in a plan view, the mounting plate is equal in size to the piezoelectric element or is greater in size to the piezoelectric element to encompass the piezoelectric element.

9. The piezoelectric device according to claim 7 , wherein the mounting plate and the base are made of a same material.

10. The piezoelectric device according to claim 7 , wherein the piezoelectric device satisfies |τs−τx1|<|τs−τx2|
where
τs denotes a thermal time constant of heat transferred from the base to the electronic element,
τx1 denotes a thermal time constant of heat transferred from the base to the piezoelectric element through the mounting plate, and
τx2 denotes a thermal time constant of heat transferred from the base mounted directly to the piezoelectric element without the mounting plate therebetween.

11. The piezoelectric device according to claim 10 , wherein each thermal time constant is a time that it takes for a respective one of the electronic element and the piezoelectric element to change from T1 to {T1+(T2−T1)×0.632} while an ambient temperature of the piezoelectric device changes from T1 to T2.

12. A piezoelectric device comprising:
piezoelectric element;
a mounting plate;
an electronic element comprising a temperature sensor therein;
a base on which the piezoelectric element is mounted with the mounting plate therebetween, and on which the electronic element is mounted, wherein the base comprises:
a substrate comprising an inner surface and an outer surface opposite to the inner surface, the piezoelectric element being mounted on the inner surface with the mounting plate therebetween, the electronic element being mounted on the outer surface;
a first frame located on an outer peripheral edge of the outer surface; and
a second frame located on an outer peripheral edge of the inner surface; and

a lid joined to the base and hermetically sealing at least the piezoelectric element and the mounting plate, wherein the lid is joined to the second frame and hermetically seals the piezoelectric element and the mounting plate.

13. The piezoelectric device according to claim 12 , wherein the piezoelectric element, the electronic element, and the mounting plate interposed therebetween are superposed on each other in a plan view.

14. The piezoelectric device according to claim 12 , wherein, in a plan view, the mounting plate is equal in size to the piezoelectric element or is greater in size to the piezoelectric element to encompass the piezoelectric element.

15. The piezoelectric device according to claim 12 , wherein the mounting plate and the base are made of a same material.

16. The piezoelectric device according to claim 12 , wherein the piezoelectric device satisfies |τs−τx1|<|τs−τx2|
where
τs denotes a thermal time constant of heat transferred from the base to the electronic element,
τx1 denotes a thermal time constant of heat transferred from the base to the piezoelectric element through the mounting plate, and
τx2 denotes a thermal time constant of heat transferred from the base mounted directly to the piezoelectric element without the mounting plate therebetween.

17. The piezoelectric device according to claim 16 , wherein each thermal time constant is a time that it takes for a respective one of the electronic element and the piezoelectric element to change from T1 to {T1+(T2−T1)×0.632} while an ambient temperature of the piezoelectric device changes from T1 to T2.

Assignees

• Kyocera Corp

Inventors

• Ueta Takahiro
• Ando Motoharu

Classifications

• H02N2/009

  Thermal details, e.g. cooling means · CPC title

• H02N2/005

  Mechanical details, e.g. housings (casings for dynamo-electric machines H02K5/00) · CPC title

• H03B5/32

  being a piezoelectric resonator (selection of piezoelectric material H10N30/00) · CPC title

• H03H9/10

  Mounting in enclosures {(constructional combinations of enclosure with electromechanical and other electronic elements H03H9/0538)} · CPC title

• H03H9/02

  Details · CPC title