Hermetically sealed piezoelectric device with integrated temperature sensor and optimized thermal characteristics
US-12438478-B2 · Oct 7, 2025 · US
Thermal details, e.g. cooling means · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H02N2/009 |
| Official title | {Thermal details, e.g. cooling means} |
| Display label | Thermal details, e.g. cooling means |
| Total patents | 25 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2017 | 2 |
| 2018 | 1 |
| 2019 | 3 |
| 2020 | 4 |
| 2021 | 4 |
| 2022 | 2 |
| 2023 | 2 |
| 2024 | 3 |
| 2025 | 2 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-12438478-B2 · Oct 7, 2025 · US
US-12339588-B2 · Jun 24, 2025 · US
US-2024402621-A1 · Dec 5, 2024 · US
US-12117739-B2 · Oct 15, 2024 · US
US-2024012332-A1 · Jan 11, 2024 · US
US-11692608-B2 · Jul 4, 2023 · US
US-2023163702-A1 · May 25, 2023 · US
US-11454869-B2 · Sep 27, 2022 · US
US-2022236651-A1 · Jul 28, 2022 · US
US-11178323-B2 · Nov 16, 2021 · US
US-2021207681-A1 · Jul 8, 2021 · US
US-11054904-B2 · Jul 6, 2021 · US
US-10965223-B2 · Mar 30, 2021 · US
US-2020336639-A1 · Oct 22, 2020 · US
US-10686116-B2 · Jun 16, 2020 · US
US-2020174347-A1 · Jun 4, 2020 · US
US-2020150764-A1 · May 14, 2020 · US
US-10518645-B2 · Dec 31, 2019 · US
US-2019273450-A1 · Sep 5, 2019 · US
US-2019058107-A1 · Feb 21, 2019 · US
Answers are generated from the same data shown on this page.