Piezoelectric resonator device using temperature sensor unit

Patent metadata

Field	Value
Publication number	US-9548717-B2
Application number	US-201314440720-A
Country	US
Kind code	B2
Filing date	Nov 13, 2013
Priority date	Nov 16, 2012
Publication date	Jan 17, 2017
Grant date	Jan 17, 2017

Abstract

A deviation in mounting a temperature sensor unit is eliminated. In a second cavity 47 for mounting a temperature sensor unit 3 of a base 4 , exposed electrodes 6 that intersect at least an internal wall surface 474 of a second wall portion 45 are formed so as to be exposed within the second cavity 47 . The exposed electrodes 6 include a pair of temperature sensor electrode pads 621 and 622 to which the temperature sensor unit 3 is bonded via a solder 13 . The solder 13 is formed so as to cover an entire surface of the exposed electrodes 6 including the temperature sensor electrode pads 621 and 622 to which the temperature sensor unit 3 is bonded.

First claim

The invention claimed is:

1. A piezoelectric resonator device, comprising:
a base for mounting a piezoelectric resonator plate; and
a lid for hermetically sealing the piezoelectric resonator plate,
wherein the piezoelectric resonator device is constituted by: a bottom portion; a first wall portion extending upward from the bottom portion along an outer periphery of one main surface of the base; and a second wall portion extending downward from the bottom portion along an outer periphery of the other main surface of the base,
wherein a first cavity is formed by being surrounded by the bottom portion and the first wall portion so as to mount the piezoelectric resonator plate, and a second cavity is formed by being surrounded by the bottom portion and the second wall portion so as to mount a temperature sensor unit as a temperature detecting element,
wherein, on a bottom surface of the second cavity, exposed electrodes that intersect at least an internal wall surface of the second wall portion are formed so as to be exposed within the second cavity, the exposed electrodes including a pair of temperature sensor electrode pads to which the temperature sensor unit is bonded via a fluid conductive bonding material,
wherein the conductive bonding material is formed so as to cover an entire surface of the exposed electrodes including the temperature sensor electrode pads to which the temperature sensor unit is bonded,
wherein the pair of temperature sensor electrode pads are formed so as to have a same shape, and
wherein, when nearest sides facing each other of the respective temperature sensor electrode pads in the second cavity are each referred to as a near end edge, and farthest sides opposed to each other of the respective temperature sensor electrode pads in the second cavity are each referred to as a far end edge, and when a distance from the near end edge to the far end edge of each of the temperature sensor electrode pads is represented by D 1 and a distance from the far end edge to the nearest internal wall surface of the second cavity is represented by D 2 , then a relational expression of 2.85<=D 1 /D 2 <=15.67 is satisfied in the second cavity.

2. The piezoelectric resonator device according to claim 1 , wherein the exposed electrodes formed in the second cavity have respective cut-out portions, and wherein the cut-out portions are the respective far end edges.

3. The piezoelectric resonator device according to claim 2 , wherein the conductive bonding material is formed on a side surface of the temperature sensor unit bonded to the temperature sensor electrode pads.

4. The piezoelectric resonator device according to claim 2 , wherein the base has a rectangular parallelepiped shape, and wherein the pair of temperature sensor electrode pads are disposed along a short-side direction of the base.

5. The piezoelectric resonator device according to claim 1 , wherein the conductive bonding material is formed on a side surface of the temperature sensor unit bonded to the temperature sensor electrode pads.

6. The piezoelectric resonator device according to claim 1 , wherein the base has a rectangular parallelepiped shape, and wherein the pair of temperature sensor electrode pads are disposed along a short-side direction of the base.

7. A piezoelectric resonator device, comprising:
a base for mounting a piezoelectric resonator plate; and
a lid for hermetically sealing the piezoelectric resonator plate,
wherein the piezoelectric resonator device is constituted by: a bottom portion; a first wall portion extending upward from the bottom portion along an outer periphery of one main surface of the base; and a second wall portion extending downward from the bottom portion along an outer periphery of the other main surface of the base,
wherein a first cavity is formed by being surrounded by the bottom portion and the first wall portion so as to mount the piezoelectric resonator plate, and a second cavity is formed by being surrounded by the bottom portion and the second wall portion so as to mount a temperature sensor unit as a temperature detecting element,
wherein, on a bottom surface of the second cavity, exposed electrodes that intersect at least an internal wall surface of the second wall portion are formed so as to be exposed within the second cavity, the exposed electrodes including a pair of temperature sensor electrode pads to which the temperature sensor unit is bonded via a fluid conductive bonding material,
wherein the conductive bonding material is formed so as to cover an entire surface of the exposed electrodes including the temperature sensor electrode pads to which the temperature sensor unit is bonded,
wherein the pair of temperature sensor electrode pads are formed so as to have a same rectangular shape, and wherein, when nearest sides facing each other of the respective temperature sensor electrode pads in the second cavity are each referred to as a near end edge, and farthest sides opposed to each other of the respective temperature sensor electrode pads in the second cavity are each referred to as a far end edge, then each outer periphery of the pair of temperature sensor electrode pads is made up of: a first side including the near end edge; a second side including the far end edge; and a pair of sides for connecting between the corresponding first side and the corresponding second side,
wherein the exposed electrodes include respective extracted portions each extracted toward the nearest internal wall surface of the second cavity from the corresponding far end edge of the pair of temperature sensor electrode pads, and
wherein, in the temperature sensor electrode pads, when a distance from the far end edge to the nearest internal wall surface of the second cavity is represented by D 2 , and when a width of the extracted portion is represented by W 1 , then a relational expression of W 1 >D 2 is satisfied in the second cavity.

8. The piezoelectric resonator device according to claim 7 , wherein the conductive bonding material is formed on a side surface of the temperature sensor unit bonded to the temperature sensor electrode pads.

9. The piezoelectric resonator device according to claim 7 , wherein the base has a rectangular parallelepiped shape, and wherein the pair of temperature sensor electrode pads are disposed along a short-side direction of the base.

10. A piezoelectric resonator device, comprising:
a base for mounting a piezoelectric resonator plate; and
a lid for hermetically sealing the piezoelectric resonator plate,
wherein the piezoelectric resonator device is constituted by: a bottom portion; a first wall portion extending upward from the bottom portion along an outer periphery of one main surface of the base; and a second wall portion extending downward from the bottom portion along an outer periphery of the other main surface of the base,
wherein a first cavity is formed by being surrounded by the bottom portion and the first wall portion so as to mount the piezoelectric resonator plate, and a second cavity is formed by being surrounded by the bottom portion and the second wall portion so as to mount a temperature sensor unit as a temperature detecting element,
wherein, on a bottom surface of the second cavity, exposed electrodes that intersect at least an internal wall surface of the second wall portion are formed so as to be exposed within the second cavity, the exposed electrodes including a pair of temperature sensor electrode pads to which the temperature sensor unit is bonded via a fluid conductive bonding material,
wherein the conductive bonding material is formed so as to cover an entire surface of the exposed electrodes including the temperature sensor electrode pads to

Assignees

• Daishinku Corp

Inventors

• Takase Hidenori

Classifications

• H03H9/1021

  the BAW device being of the cantilever type · CPC title

• H03H9/10 Primary

  Mounting in enclosures {(constructional combinations of enclosure with electromechanical and other electronic elements H03H9/0538)} · CPC title

• H03H9/0552 Primary

  the device and the other elements being mounted on opposite sides of a common substrate · CPC title

• H03H9/08

  Holders with means for regulating temperature · CPC title

• H03H9/19

  consisting of quartz · CPC title