Conforming heat transport device for dual inline memory module cooling applications
US-12432884-B2 · Sep 30, 2025 · US
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Patent family 74685719
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 74685719 |
| Family type | — |
| Earliest priority | Aug 23, 2019 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US12432884B2 — Conforming heat transport device for dual inline memory module cooling applications |
Representative publication
Best representative member for this family based on priority and filing country.
US12432884B2 — Conforming heat transport device for dual inline memory module cooling applications (published Sep 30, 2025)
Member publications
Related publications in this family.
Conforming heat transport device for dual inline memory module cooling applications
US-2024251528-A1 · Jul 25, 2024 · US
Conforming heat transport device for dual inline memory module cooling applications
US-11974414-B2 · Apr 30, 2024 · US
Conforming heat transport device for dual inline memory module cooling applications
US-2022053668-A1 · Feb 17, 2022 · US