Orthogonally hinged individualized memory module cooling

Patent metadata

Field	Value
Publication number	US-9786578-B2
Application number	US-201414164986-A
Country	US
Kind code	B2
Filing date	Jan 27, 2014
Priority date	Jan 27, 2014
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

A memory module cooling system includes a liquid cooled manifold assembly and a heat spreader assembly rotateably attached to the liquid cooled manifold assembly about an axis perpendicular to the memory module. The liquid cooled manifold assembly includes a manifold, an liquid inlet, and a liquid outlet. The heat spreader assembly includes a base in thermal contact with a heat pipe, and a heat spreader in thermal contact with the heat pipe, the heat spreader configured to thermally engage the memory module. In certain embodiments, thermal bonds are maintained between a plurality of neighboring memory modules when a particular heat spreader assembly is rotated away from an associated memory module.

First claim

The invention claimed is:

1. A memory module cooling system comprising:
a liquid cooled manifold assembly comprising a manifold, an liquid inlet, and a liquid outlet;
a heat spreader assembly rotateably attached to the liquid cooled manifold assembly and about an axis perpendicular to a memory module, the heat spreader assembly comprising:
a base in thermal contact with a heat pipe;
a heat spreader in thermal contact with the heat pipe, the heat spreader being movable into and out of thermal engagement with the memory module by rotation of the heat spreader assembly about the axis perpendicular to the memory module; and
a compression sleeve located on the heat spreader assembly,
wherein the heat pipe extends through an opening along a length of the heat spreader, the heat pipe and heat spreader being movable together by the rotation of the heat spreader assembly.

2. The memory module cooling system of claim 1 ,
wherein the compression sleeve is structured for compressing the heat spreader to increase thermal bonding between the heat spreader and memory module.

3. The memory module cooling system of claim 1 , wherein the manifold comprises:
a plurality of recessed engagement features, each recess engagement feature configured to accept the base.

4. The memory module cooling system of claim 3 , wherein the heat spreader thermally engages the memory module by the base juxtapositionally contacting an associated recessed engagement feature.

5. The memory module cooling system of claim 1 , further comprising:
a heat spreader retention system rotatably attached to the manifold for preventing relative rotation between the heat spreader assembly and the liquid cooled manifold assembly.

6. The memory module cooling system of claim 2 , wherein the compression sleeve includes a vertical alignment feature and wherein the heat spreader comprises a vertical alignment feature configured to engage with the compression alignment feature to force horizontal positioning and vertical installation direction for engaging compression sleeve upon heat spreader.

7. The memory module cooling system of claim 1 , wherein thermal bonds are maintained between a plurality of neighboring memory modules when a particular heat spreader assembly is rotated away from an associated memory module.

8. The memory module cooling system of claim 1 , wherein heat transfers from the memory module to the heat spreader, from the heat spreader to the heat pipe, from the heat pipe to the base, from the base to the manifold.

9. The memory module cooling system of claim 4 , wherein the juxtapositionally contact allows for a majority of one or more perimeter surfaces of the base to be in thermal contact with engagement feature.

10. A memory module cooling system installation method comprising:
seating a memory module to a system board assembly;
rotating a heat spreader assembly relative to a liquid cooled manifold assembly about an axis perpendicular to the memory module, the heat spreader assembly comprising: a base in thermal contact with a heat pipe; and a heat spreader in thermal contact with the heat pipe, the heat spreader and the heat pipe being coupled together and being movable together to move the heat spreader into and out of thermal engagement with the memory module by rotating the heat spreader assembly about the axis perpendicular to the memory module, and;
juxtapositionally contacting the base with a liquid cooled manifold assembly engagement recess feature, the manifold assembly comprising: a manifold, an liquid inlet, and a liquid outlet.

11. The memory module cooling system installation method of claim 10 , further comprising:
engaging a compression sleeve with the heat spreader to compress the heat spreader against the memory module.

12. The memory module cooling system installation method of claim 10 , wherein juxtapositionally contacting further comprises:
thermally engaging the memory module with an associated recessed engagement feature.

13. The memory module cooling system installation method of claim 10 , further comprising:
engaging a heat spreader retention system rotatably attached to the manifold to prevent relative rotation between the heat spreader assembly and the liquid cooled manifold assembly.

14. The memory module cooling system installation method of claim 11 , wherein the compression sleeve comprises a vertical alignment feature and wherein the heat spreader comprises a vertical alignment feature configured to engage with the compression alignment feature to force horizontal positioning and vertical installation direction for engaging compression sleeve upon heat spreader.

15. The memory module cooling system installation method of claim 10 , wherein the cooling system maintains thermal bonds between a plurality of neighboring memory modules when a particular heat spreader assembly is rotated away from an associated memory module.

16. The memory module cooling system installation method of claim 10 , wherein heat transfers from the memory module to the heat spreader, from the heat spreader to the heat pipe, from the heat pipe to the base, from the base to the manifold.

17. The memory module cooling system installation method of claim 10 , wherein the juxtapositionally contact allows for a majority of one or more perimeter surfaces of the base to be in thermal contact with engagement feature.

18. A memory module cooling system removal method comprising:
removing a compression sleeve from a heat spreader of a heat spreader assembly, the heat spreader assembly comprising: a base in thermal contact with a heat pipe; and the heat spreader in thermal contact with the heat pipe, the heat spreader and the heat pipe being coupled together and being movable together to move the heat spreader into and out of thermal engagement with a memory module, and;
rotating the heat spreader assembly relative to a liquid cooled manifold assembly about an axis perpendicular to the memory module to lift the heat spreader out of thermal engagement with the memory module, and;
unseating the memory module from a system board assembly.

19. The memory module cooling system removal method of claim 18 , wherein thermal bonds are maintained between a plurality of neighboring memory modules when a particular heat spreader assembly is rotated away from an associated memory module.

20. The memory module cooling system removal method of claim 18 , further comprising:
disengaging a heat spreader retention system rotatably attached to the liquid cooled manifold assembly to prevent relative rotation between the heat spreader assembly and the liquid cooled manifold assembly.

Assignees

• Lenovo Entpr Solutions Singapore Pte Ltd

Inventors

• Cox Aaron R
• Grady William J
• Matteson Jason A
• Minyard Jason E

Classifications

• H10W40/641

  Snap-on arrangements, e.g. clips · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/20509

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title

• F28F1/20

  the means being attachable to the element (F28F1/22 takes precedence) · CPC title