Charged Particle Beam Apparatus, Image Forming Method Using a Charged Particle Beam Apparatus, and Image Processing Apparatus
US-2016276128-A1 · Sep 22, 2016 · US
US12431333B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12431333-B2 |
| Application number | US-202418663041-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 13, 2024 |
| Priority date | Oct 1, 2019 |
| Publication date | Sep 30, 2025 |
| Grant date | Sep 30, 2025 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving. The movement may be due to vibrations in the system and/or movement of a movable stage on which the NCEM-enabled cell vehicle is positioned. Position information for an electron beam column producing the electron beam performing the NCEMs and/or for the moving stage may be used to align the electron beam with targets on the NCEM-enabled cell vehicle while it is moving.
Opening claim text (preview).
We claim: 1. A computer-readable medium storing a set of instructions thereon, which when executed by a processor cause the processor to: receive a recipe for a die included in a wafer, the die including a plurality of chips, each chip of the plurality of chips being divided into a plurality of tiles, each tile including a non-contact electronic measurement (NCEM)-enabled NCEM-enabled registration cell and a plurality of NCEM-enabled fill cells, the recipe including a position for the die within the wafer, a position of the NCEM-enabled registration cell, and a position of each NCEM-enabled cell of the plurality NCEM-enabled cells; determine an expected position of a NCEM-enabled registration cell included a tile of the plurality of tiles; direct an electron beam toward the NCEM-enabled registration cell; receive an indication of a response of the NCEM-enabled registration cell to the electron beam; determine an actual position of the NCEM-enabled registration cell using the response; align the electron beam using the actual position of the NCEM-enabled registration cell; direct the aligned electron beam toward an NCEM-enabled fill cell of the plurality of NCEM-enabled fill cells; receive a response of the NCEM-enabled fill cell to the aligned electron beam; and provide an indication of the response to a processor. 2. The computer-readable medium of claim 1 , wherein the NCEM-enabled registration cell comprises: a substrate; a power rail electrically coupled to a power supply and mechanically coupled to the substrate; a ground rail electrically coupled to a ground and mechanically coupled to the substrate; and a floating feature mechanically, but not electrically, coupled to the substrate, the floating feature being configured to provide an easily distinguishable feature when exposed to a non-contact electrical measurement. 3. A computer-readable medium storing a set of instructions thereon, which when executed by a processor cause the processor to: receive a recipe for a die included in a wafer, each die of the plurality of chips being divided into a plurality of tiles, each tile including a NCEM-enabled registration cell and a plurality of non-contact electronic measurement (NCEM)-enabled fill cells, the recipe including a position for the die within the wafer and a position for each of the NCEM-enabled fill cell of the plurality of NCEM-enabled fill cells; determine an expected position of a NCEM-enabled registration cell included in a tile of the plurality of tiles; scan the NCEM-enabled registration cell using an electron beam; receive an indication of a response of the NCEM-enabled registration cell to the scanning; determine an actual position of the NCEM-enabled registration cell using the response; align the electron beam using the actual position of the NCEM-enabled registration cell; sequentially direct the aligned electron beam toward each of NCEM-enabled fill cells of the plurality of NCEM-enabled fill cells within the tile of the plurality of tiles; receive an indication of a response of each of the NCEM-enabled fill cells to the aligned electron beam; and provide an indication of the response to a processor. 4. The method of claim 3 , wherein responses of NCEM-enabled fill cells to the electron beam are received from a plurality of tiles of in an array of chips included in the wafer, each respective tile and chip of the array being configured to be identical to one another and the set of instructions, which when executed by the processor further cause the processor to: compare the received responses to one another to determine whether there are any outlying responses; and provide a result of the comparison to a processor. 5. A computer-readable medium storing a set of instructions thereon, which when executed by a processor cause the processor to: receive a recipe for a die included in a wafer, the die including a plurality of chips, each of the chips being divided into a plurality of tiles, each tile including a NCEM-enabled registration cell and a plurality of non-contact electronic measurement (NCEM)-enabled fill cells, the recipe including a position for the die within the wafer, contents of the wafer, and a position for the contents of the wafer; receive a selection of an array of chips included in the wafer to test using a non-contact electronic measurement (NCEM), each chip of the array being configured to be identical to one another; identify a target region in each of the chips included in the array, direct an electron beam toward the target region for each chip in the array; receive an indication of a response of each target region to the electron beam; compare the received indications to one another to determine whether there are any outlying indications; and provide a result of the comparison to a processor.
using electron beams · CPC title
of printed or hybrid circuits · CPC title
Observing the objects or the point of impact on the object · CPC title
Computer and memory organisation · CPC title
Means for position and/or orientation registration · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.