Combined global and local process variation modeling

Patent metadata

Field	Value
Publication number	US-12430486-B1
Application number	US-202218060390-A
Country	US
Kind code	B1
Filing date	Nov 30, 2022
Priority date	Nov 30, 2022
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

A set of global parameters may be modeled using a set of equivalent parameters, where the set of global parameters represents global process variation in a circuit. A global distribution for a metric in the circuit may be determined by performing Monte-Carlo (MC) analysis using the set of equivalent parameters. Combined local and global variations for the metric may be calculated based on the global distribution for the metric and a local distribution for the metric.

First claim

What is claimed is:

1. A method, comprising:
modeling a set of global parameters using a set of equivalent parameters, wherein the set of global parameters represents global process variation in a circuit;
determining a global distribution for a metric in the circuit by performing Monte Carlo (MC) analysis using the set of equivalent parameters; and
calculating, by a processor, combined local and global variations for the metric based on the global distribution for the metric and a local distribution for the metric.

2. The method of claim 1 , wherein the modeling the set of global parameters using the set of equivalent parameters comprises:
determining a set of representative circuits;
determining a set of global process corners corresponding to the metric in the set of representative circuits by performing MC analysis using the set of global parameters, wherein the metric has a first set of values at the set of global process corners; and
determining a set of value changes for the set of equivalent parameters which generate a second set of values of the metric at the set of global process corners which are substantially equal to the first set of values of the metric.

3. The method of claim 1 , wherein the set of equivalent parameters includes one parameter per device type and two parameters per interconnect layer.

4. The method of claim 3 , wherein the one parameter per device type is a threshold voltage.

5. The method of claim 3 , wherein the two parameters per interconnect layer are either (1) a resistance per unit length and a capacitance per unit length, or (2) a resistance scaling factor and a capacitance scaling factor.

6. The method of claim 1 , wherein the calculating the combined local and global variations for the metric based on the global distribution for the metric and a local distribution for the metric comprises calculating a linear combination of the global distribution for the metric and the local distribution for the metric.

7. The method of claim 1 , wherein the calculating the combined local and global variations for the metric based on the global distribution for the metric and a local distribution for the metric comprises calculating a root sum squared combination of the global distribution for the metric and the local distribution for the metric.

8. The method of claim 1 , wherein the calculating the combined local and global variations for the metric based on the global distribution for the metric and a local distribution for the metric comprises determining local distribution amounts for the metric at a set of process corners by scaling a nominal local distribution amount for the metric based on global distribution amounts for the metric at the set of process corners.

9. A non-transitory computer-readable medium comprising stored instructions, which when executed by a processor, cause the processor to:
model a set of global parameters using a set of equivalent parameters, wherein the set of global parameters represents global process variation in a circuit;
determine a global distribution for a metric in the circuit by performing Monte Carlo (MC) analysis using the set of equivalent parameters; and
calculate combined local and global variations for the metric based on the global distribution for the metric and a local distribution for the metric.

10. The non-transitory computer-readable medium of claim 9 , wherein the modeling the set of global parameters using the set of equivalent parameters comprises:
determining a set of representative circuits;
determining a set of global process corners corresponding to the metric in the set of representative circuits by performing MC analysis using the set of global parameters, wherein the metric has a first set of values at the set of global process corners; and
determining a set of value changes for the set of equivalent parameters which generate a second set of values of the metric at the set of global process corners which are substantially equal to the first set of values of the metric.

11. The non-transitory computer-readable medium of claim 9 , wherein the set of equivalent parameters includes one parameter per device type and two parameters per interconnect layer.

12. The non-transitory computer-readable medium of claim 11 , wherein the one parameter per device type is a threshold voltage.

13. The non-transitory computer-readable medium of claim 11 , wherein the two parameters per interconnect layer are either (1) a resistance per unit length and a capacitance per unit length, or (2) a resistance scaling factor and a capacitance scaling factor.

14. The non-transitory computer-readable medium of claim 9 , wherein the calculating the combined local and global variations for the metric based on the global distribution for the metric and a local distribution for the metric comprises calculating a linear combination of the global distribution for the metric and the local distribution for the metric.

15. The non-transitory computer-readable medium of claim 9 , wherein the calculating the combined local and global variations for the metric based on the global distribution for the metric and a local distribution for the metric comprises calculating a root sum squared combination of the global distribution for the metric and the local distribution for the metric.

16. The non-transitory computer-readable medium of claim 9 , wherein the calculating the combined local and global variations for the metric based on the global distribution for the metric and a local distribution for the metric comprises determining local distribution amounts for the metric at a set of process corners by scaling a nominal local distribution amount for the metric based on global distribution amounts for the metric at the set of process corners.

17. An apparatus, comprising:
a memory storing instructions; and
a processor, coupled with the memory and to execute the instructions, the instructions when executed causing the processor to:
model a set of global parameters using a set of equivalent parameters, wherein the set of global parameters represents global process variation in a circuit, and wherein the set of equivalent parameters includes a threshold voltage parameter for each device type, a resistance per unit length parameter for each interconnect layer, and a capacitance per unit length parameter for each interconnect layer;
determine a global distribution for a metric in the circuit by performing Monte Carlo (MC) analysis using the set of equivalent parameters; and
calculate combined local and global variations for the metric based on the global distribution for the metric and a local distribution for the metric.

18. The apparatus of claim 17 , wherein the modeling the set of global parameters using the set of equivalent parameters comprises:
determining a set of representative circuits;
determining a set of global process corners corresponding to the metric in the set of representative circuits by performing MC analysis using the set of global parameters, wherein the metric has a first set of values at the set of global process corners; and
determining a set of value changes for the set of equivalent parameters which generate a second set of values of the metric at the set of global process corners which are substantially equal to the first set of values of the metric.

19. The apparatus of claim 17 , wherein the calculating the combined local and global variations for the metric based on the global distribution for the metric and a local distribution for the metric compris

Assignees

• Synopsys Inc

Inventors

• Chai Wenwen
• Ding Li

Classifications

• G06F30/3312

  Timing analysis · CPC title

• G06F2119/12

  Timing analysis or timing optimisation · CPC title

• G06F2111/08

  Probabilistic or stochastic CAD · CPC title

• G06F30/3323

  using formal methods, e.g. equivalence checking or property checking · CPC title

• G06F30/398

  Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM] (optical proximity correction [OPC] design processes G03F1/36) · CPC title