Apparatus and method for controlling a substrate temperature

Patent metadata

Field	Value
Publication number	US-12424421-B2
Application number	US-202217592766-A
Country	US
Kind code	B2
Filing date	Feb 4, 2022
Priority date	Aug 5, 2019
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

A stage includes a shaft, a first supporting plate over the shaft, a heater arranged in a trench formed in the first supporting plate, and a gas-supplying tube arranged in the shaft and configured to blow a gas to the first supporting plate. The first supporting plate may have a disk shape, and a cross section of the gas-supplying tube parallel to a surface of the first supporting plate may overlap a center of the disk shape. The first supporting plate may be configured to block the gas so that the gas is not released to a chamber in which the stage is arranged.

First claim

What is claimed is:

1. A stage comprising:
a shaft;
a first supporting plate over the shaft;
a heater arranged in a trench formed in the first supporting plate; and
a gas-supplying tube arranged in the shaft and configured to blow a gas to the first supporting plate,
wherein a tip of the gas-supplying tube is spaced in an extending direction of the gas-supplying tube from an end of the shaft over which the first supporting plate is positioned, and is located under the end of the shaft.

2. The stage according to claim 1 ,
wherein the first supporting plate has a disk shape, and
wherein a cross section of the gas-supplying tube parallel to a surface of the first supporting plate overlaps a center of the disk shape.

3. The stage according to claim 1 ,
wherein the first supporting plate is configured to block the gas and not to release the gas into a chamber in which the stage is arranged.

4. The stage according to claim 1 , further comprising a second supporting plate over the first supporting plate.

5. The stage according to claim 1 , further comprising a third supporting plate under the first supporting plate,
wherein the first supporting plate has a channel for circulating a fluid.

6. The stage according to claim 1 ,
wherein the first plate has a through hole which does not overlap the shaft.

7. The stage according to claim 1 , further comprising a plurality of gas-discharging tubes surrounding the gas-supplying tube.

8. A method for controlling a substrate temperature, the method comprising:
arranging a substrate over a first stage comprising a first supporting plate and a shaft under the first supporting plate;
heating the first stage with a heater arranged in a trench formed in the first supporting plate; and
blowing a gas to the first supporting plate from a gas-supplying tube arranged in the shaft,
wherein a tip of the gas-supplying tube is spaced in an extending direction of the gas- supplying tube from an end of the shaft over which the first supporting plate is positioned, and is located under the end of the shaft.

9. The method according to claim 8 ,
wherein the first supporting plate has a disk shape, and
wherein the gas is blown so that a temperature of a center of the first supporting plate is lower than a temperature of a circumference portion of the first supporting plate.

10. The method according to claim 8 ,
wherein the first supporting plate has a disk shape, and
wherein the gas-supplying tube is arranged so that a cross section of the gas-supplying tube parallel to a surface of the first supporting plate overlaps a center of the disk shape.

11. The method according to claim 8 , further comprising discharging the gas to the outside of a chamber in which the stage is arranged so that the gas is not released into the chamber.

12. The method according to claim 8 , further comprising flowing a fluid in a channel formed in the first supporting plate.

Assignees

• Nhk Spring Co Ltd

Inventors

• Kida Naoya
• Tatsumi Arata
• Sekiya Kenji
• Aikawa Naoya
• TAKANASHI Masaya

Classifications

• H10P72/722

  Details of electrostatic chucks · CPC title

• H10P72/7626 Primary

  characterised by the construction of the shaft · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title